JPS6172848U - - Google Patents

Info

Publication number
JPS6172848U
JPS6172848U JP1984156904U JP15690484U JPS6172848U JP S6172848 U JPS6172848 U JP S6172848U JP 1984156904 U JP1984156904 U JP 1984156904U JP 15690484 U JP15690484 U JP 15690484U JP S6172848 U JPS6172848 U JP S6172848U
Authority
JP
Japan
Prior art keywords
circuit board
pattern
semiconductor device
adhesive film
conductive adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1984156904U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1984156904U priority Critical patent/JPS6172848U/ja
Publication of JPS6172848U publication Critical patent/JPS6172848U/ja
Pending legal-status Critical Current

Links

Classifications

    • H10W74/15

Landscapes

  • Wire Bonding (AREA)
  • Die Bonding (AREA)
JP1984156904U 1984-10-17 1984-10-17 Pending JPS6172848U (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984156904U JPS6172848U (enExample) 1984-10-17 1984-10-17

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984156904U JPS6172848U (enExample) 1984-10-17 1984-10-17

Publications (1)

Publication Number Publication Date
JPS6172848U true JPS6172848U (enExample) 1986-05-17

Family

ID=30714910

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984156904U Pending JPS6172848U (enExample) 1984-10-17 1984-10-17

Country Status (1)

Country Link
JP (1) JPS6172848U (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999000842A1 (fr) * 1997-06-26 1999-01-07 Hitachi Chemical Company, Ltd. Substrat pour montage de plaquettes a semi-conducteur

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999000842A1 (fr) * 1997-06-26 1999-01-07 Hitachi Chemical Company, Ltd. Substrat pour montage de plaquettes a semi-conducteur

Similar Documents

Publication Publication Date Title
JPS6172848U (enExample)
JPH02102738U (enExample)
JPS6237939U (enExample)
JPS6338328U (enExample)
JPS6310571U (enExample)
JPS6346844U (enExample)
JPS5881940U (ja) 半導体素子の取付構造
JPH0328775U (enExample)
JPS63187330U (enExample)
JPS5899841U (ja) 半導体装置
JPS6188248U (enExample)
JPS5945929U (ja) 半導体素子の実装構造
JPS6429885U (enExample)
JPS6298242U (enExample)
JPH0270448U (enExample)
JPH038449U (enExample)
JPS5895054U (ja) 半導体装置
JPH0385682U (enExample)
JPS62190344U (enExample)
JPS63155634U (enExample)
JPS63108633U (enExample)
JPS6076046U (ja) 半導体装置
JPH0390468U (enExample)
JPH0245640U (enExample)
JPS5945930U (ja) 半導体素子の実装構造