JPS63108633U - - Google Patents
Info
- Publication number
- JPS63108633U JPS63108633U JP39887U JP39887U JPS63108633U JP S63108633 U JPS63108633 U JP S63108633U JP 39887 U JP39887 U JP 39887U JP 39887 U JP39887 U JP 39887U JP S63108633 U JPS63108633 U JP S63108633U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- circuit board
- pin
- attached
- conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000004020 conductor Substances 0.000 claims description 4
- 230000009977 dual effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP39887U JPS63108633U (enExample) | 1987-01-06 | 1987-01-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP39887U JPS63108633U (enExample) | 1987-01-06 | 1987-01-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63108633U true JPS63108633U (enExample) | 1988-07-13 |
Family
ID=30777337
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP39887U Pending JPS63108633U (enExample) | 1987-01-06 | 1987-01-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63108633U (enExample) |
-
1987
- 1987-01-06 JP JP39887U patent/JPS63108633U/ja active Pending