JPS6167869U - - Google Patents

Info

Publication number
JPS6167869U
JPS6167869U JP15093284U JP15093284U JPS6167869U JP S6167869 U JPS6167869 U JP S6167869U JP 15093284 U JP15093284 U JP 15093284U JP 15093284 U JP15093284 U JP 15093284U JP S6167869 U JPS6167869 U JP S6167869U
Authority
JP
Japan
Prior art keywords
liquid
perforated plate
section
supply
outer edge
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15093284U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP15093284U priority Critical patent/JPS6167869U/ja
Publication of JPS6167869U publication Critical patent/JPS6167869U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743—Apparatus for manufacturing layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/743—Apparatus for manufacturing layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Coating Apparatus (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)

Description

【図面の簡単な説明】
第１図は本考案の一実施例を示すもので、供給
口からチヤンバー部の多孔板上への吐出を表わす
断面図、第３図は多孔板上へのエアー吹きつけを
表わす断面図、第３図はアイランド上へのペース
ト塗布を表わす断面図、第４図イは塗布面形状を
示す図、ロはペースト厚さを示す図、第５図イ，
ロ，ハは多孔板の種類を表わす図、第６図は従来
のペースト供給装置の断面図、第７図イは従来の
塗布面形状を示す図、ロはペースト厚さを示す図
である。 ５ａ…ペースト供給部、５ｂ…多孔板、５ｃ…
チヤンバー部、５ｄ…吹き付け部、５ｅ…外縁部
。

Claims (1)

    【実用新案登録請求の範囲】
  1. 液体容器に収容された液体材料を該容器に設け
    た供給口を通して半導体部品のリードフレーム又
    は基板上に塗布する装置において、一定量の液体
    材料を供給する供給部と、その液体を一時的にた
    める多孔板を有するチヤンバー部と、多孔板上の
    液体を加圧気体によりリードフレーム又は基板上
    に前記多孔板の１又は２以上の孔を通して均等に
    塗布する吹きつけ部と、一定塗布面積を保持させ
    る外縁部とを有し、前記チヤンバー部、気体吹き
    つけ部、外縁部を同一軸上に配置したことを特徴
    とする液体供給装置。
JP15093284U 1984-10-05 1984-10-05 Pending JPS6167869U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15093284U JPS6167869U (ja) 1984-10-05 1984-10-05

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15093284U JPS6167869U (ja) 1984-10-05 1984-10-05

Publications (1)

Publication Number Publication Date
JPS6167869U true JPS6167869U (ja) 1986-05-09

Family

ID=30709062

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15093284U Pending JPS6167869U (ja) 1984-10-05 1984-10-05

Country Status (1)

Country Link
JP (1) JPS6167869U (ja)

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