JPS6166993U - - Google Patents

Info

Publication number
JPS6166993U
JPS6166993U JP1984152747U JP15274784U JPS6166993U JP S6166993 U JPS6166993 U JP S6166993U JP 1984152747 U JP1984152747 U JP 1984152747U JP 15274784 U JP15274784 U JP 15274784U JP S6166993 U JPS6166993 U JP S6166993U
Authority
JP
Japan
Prior art keywords
cut
printed circuit
hole
raised piece
piece
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1984152747U
Other languages
English (en)
Other versions
JPH0412714Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1984152747U priority Critical patent/JPH0412714Y2/ja
Priority to KR2019850004879U priority patent/KR890007939Y1/ko
Priority to GB08523890A priority patent/GB2165399B/en
Priority to DE19853535923 priority patent/DE3535923A1/de
Priority to US06/785,784 priority patent/US4725920A/en
Publication of JPS6166993U publication Critical patent/JPS6166993U/ja
Application granted granted Critical
Publication of JPH0412714Y2 publication Critical patent/JPH0412714Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/04—Arrangements of circuit components or wiring on supporting structure on conductive chassis
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4084—Through-connections; Vertical interconnect access [VIA] connections by deforming at least one of the conductive layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4641—Manufacturing multilayer circuits by laminating two or more circuit boards having integrally laminated metal sheets or special power cores
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0215—Grounding of printed circuits by connection to external grounding means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0397—Tab
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/0919—Exposing inner circuit layers or metal planes at the side edge of the printed circuit board [PCB] or at the walls of large holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/063—Lamination of preperforated insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Combinations Of Printed Boards (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)

Description

【図面の簡単な説明】
第１図はこの考案の実施例を示す多層基板の分
解斜視図、第２図は上記多層基板をシヤーシに組
立てた主要部断面図、第３図は従来例で多層プリ
ント基板のアース構造を示す断面図である。 １…第１のプリント基板、２…第２のプリント
基板、２０…シヤーシ、２２，２３…切起し片、
２４…金属アース板、２８…接続片、２６，３０
…導電パターン、２５，３１…挿通孔、２７，２
９…半田付。

Claims (1)

    【実用新案登録請求の範囲】
  1. 切起し片を設けた金属板を挟んで、２枚のプリ
    ント基板を重合せしめ、前記２枚のプリント基板
    の少くとも一方に、前記切起し片に対応して孔を
    設けて、前記切起し片を前記孔を貫通して、前記
    プリント基板上に突出せしめると共に、前記切起
    し片と前記孔の周辺に設けた導電パターンを半田
    にて固定し、更に金属板の周辺には複数個の接続
    片を設け、この接続片をシヤーシに弾接させるよ
    うにしたことを特徴とする基板の保持構造。
JP1984152747U 1984-10-09 1984-10-09 Expired JPH0412714Y2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP1984152747U JPH0412714Y2 (ja) 1984-10-09 1984-10-09
KR2019850004879U KR890007939Y1 (ko) 1984-10-09 1985-04-29 기판의 지지 구조체
GB08523890A GB2165399B (en) 1984-10-09 1985-09-27 Substrate support structures
DE19853535923 DE3535923A1 (de) 1984-10-09 1985-10-08 Substrathaltender aufbau
US06/785,784 US4725920A (en) 1984-10-09 1985-10-09 Holding structure of substrates

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984152747U JPH0412714Y2 (ja) 1984-10-09 1984-10-09

Publications (2)

Publication Number Publication Date
JPS6166993U true JPS6166993U (ja) 1986-05-08
JPH0412714Y2 JPH0412714Y2 (ja) 1992-03-26

Family

ID=15547276

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984152747U Expired JPH0412714Y2 (ja) 1984-10-09 1984-10-09

Country Status (5)

Country Link
US (1) US4725920A (ja)
JP (1) JPH0412714Y2 (ja)
KR (1) KR890007939Y1 (ja)
DE (1) DE3535923A1 (ja)
GB (1) GB2165399B (ja)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4873764A (en) * 1987-12-23 1989-10-17 Zenith Electronics Corporation Component mounting process for printed circuit boards
JPH02187093A (ja) * 1989-01-13 1990-07-23 Toshiba Corp 印刷配線板
US5162971A (en) * 1989-03-23 1992-11-10 Matsushita Electric Industrial Co., Ltd. High-density circuit module and process for producing same
US5189638A (en) * 1990-04-26 1993-02-23 Mitsubishi Denki Kabushiki Kaisha Portable semiconductor memory device
DE4036081C2 (de) * 1990-04-26 1994-10-06 Mitsubishi Electric Corp Halbleiterspeicher-Steckmodul
US5090918A (en) * 1990-05-31 1992-02-25 John Fluke Mfg. Co., Inc. Isothermal termination block having a multi-layer thermal conductor
JP3018640B2 (ja) * 1991-08-29 2000-03-13 ソニー株式会社 回路接続基板構造
US5184283A (en) * 1991-12-23 1993-02-02 Ford Motor Company Power device assembly and method
US5311407A (en) * 1992-04-30 1994-05-10 Siemens Components, Inc. Printed circuit based for mounted semiconductors and other electronic components
US5272599A (en) * 1993-03-19 1993-12-21 Compaq Computer Corporation Microprocessor heat dissipation apparatus for a printed circuit board
JPH07105759B2 (ja) * 1993-03-30 1995-11-13 山一電機株式会社 光電変換器
WO1997001263A1 (fr) * 1995-06-20 1997-01-09 Matsushita Electric Industrial Co., Ltd. Dispositif de maintien de piece, substrat dote de ce dispositif et son procede de fabrication
DE19535490A1 (de) * 1995-09-23 1997-03-27 Bosch Gmbh Robert Schaltungsplatine sowie Verfahren zum Herstellen einer Schaltungsplatine
DE19600617A1 (de) * 1996-01-10 1997-07-17 Bosch Gmbh Robert Elektrisches Gerät
US6078359A (en) * 1996-07-15 2000-06-20 The Regents Of The University Of California Vacuum compatible miniature CCD camera head
DE19636181A1 (de) * 1996-09-06 1998-03-12 Philips Patentverwaltung HF-Modul, z. B. Tuner
FR2822632B1 (fr) * 2001-03-21 2004-01-23 Sagem Carte electronique et circuit correspondant
JP3787291B2 (ja) * 2001-08-22 2006-06-21 ペンタックス株式会社 Ｅｍｃコア支持、シールド、及び放熱の為の構造
DE20211560U1 (de) * 2002-07-12 2003-12-11 Ghw Grote & Hartmann Gmbh Leiterplattenelement mit einer Stromversorgungsvorrichtung für auf der Leiterplatte angeordnete elektrische und elektronische Bauelemente
WO2005002302A1 (en) * 2003-06-24 2005-01-06 Bae Systems Plc Flexi-rigid printed circuit board with integral flexible heat sink area
US20050276024A1 (en) * 2004-06-10 2005-12-15 Westbury Steven D Flexi-rigid printed circuit board with integral flexible heat sink area
JP2023085706A (ja) * 2021-12-09 2023-06-21 日本航空電子工業株式会社 組立体及びハーネス組立体

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2586854A (en) * 1947-04-19 1952-02-26 Farnsworth Res Corp Printed circuit construction
US3202879A (en) * 1959-12-24 1965-08-24 Ibm Encapsulated circuit card
DE1195829C2 (de) * 1962-11-28 1979-07-26 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Elektrisches geraetechassis und verfahren zu seiner herstellung
FR1403061A (fr) * 1964-05-06 1965-06-18 Commissariat Energie Atomique Masse électrique, notamment pour plaquettes de circuits imprimés
US3348101A (en) * 1964-05-27 1967-10-17 Itt Cordwood module with heat sink fence
US3409805A (en) * 1965-08-12 1968-11-05 Foxboro Co Printed-circuit board coupling circuit with d-c isolation
US3506877A (en) * 1968-09-25 1970-04-14 Us Navy Hermetically sealed and shielded circuit module
DE1911779B2 (de) * 1969-03-07 1971-10-21 Verdrahtungsanordnung zur elektrischen verbindung voneinan der verschiedener anschlussebenen
GB1411080A (en) * 1971-11-17 1975-10-22 Lucas Industries Ltd Mounting arrangements for printed circuit boards
IT1008331B (it) * 1973-03-28 1976-11-10 Rca Corp Pannello composito a circuito stampato
AT348018B (de) * 1975-04-16 1979-01-25 Siemens Ag Oesterreich Traegerplatte
US3996500A (en) * 1975-06-16 1976-12-07 Richco Plastic Company Chassis connector and circuit board clip
US4250616A (en) * 1979-03-23 1981-02-17 Methode Electronics, Inc. Method of producing multilayer backplane
US4310870A (en) * 1979-12-31 1982-01-12 Motorola, Inc. Chassis captivation arrangement for an electronic device
DE3021655C2 (de) * 1980-06-10 1983-05-26 Rose-Elektrotechnik Gmbh & Co Kg Elektrotechnische Fabrik, 4952 Porta Westfalica Vorrichtung zum Positionieren von Leiterkarten, Montagewänden oder -platten in Elektronik-Schaltgehäusen
US4498119A (en) * 1980-11-03 1985-02-05 Lockheed Corporation Electronic circuit board and method and apparatus for thermal management thereof
US4388672A (en) * 1981-05-01 1983-06-14 Motorola Inc. Printed circuit board assembly

Also Published As

Publication number Publication date
GB2165399B (en) 1988-06-22
GB8523890D0 (en) 1985-10-30
KR860005454U (ko) 1986-06-11
GB2165399A (en) 1986-04-09
US4725920A (en) 1988-02-16
DE3535923A1 (de) 1986-04-10
DE3535923C2 (ja) 1989-02-02
KR890007939Y1 (ko) 1989-11-10
JPH0412714Y2 (ja) 1992-03-26

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