JPS6161872U - - Google Patents
Info
- Publication number
- JPS6161872U JPS6161872U JP14719084U JP14719084U JPS6161872U JP S6161872 U JPS6161872 U JP S6161872U JP 14719084 U JP14719084 U JP 14719084U JP 14719084 U JP14719084 U JP 14719084U JP S6161872 U JPS6161872 U JP S6161872U
- Authority
- JP
- Japan
- Prior art keywords
- legs
- printed circuit
- circuit board
- main body
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000002265 prevention Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案の一実施例のソリ防止部品の使
用状態の斜視図、第２図はその裏側の斜視図、第
３図は他の実施例のソリ防止部品の一部の使用状
態の断面図、第４図は従来の噴流はんだ装置の概
略断面説明図、第５図はプリント基板のホルダー
を示す図である。
図中、１１はプリント基板、１１ａは基板本体
、１２はソリ防止部品、１２ａ，１２ｂ，１２ｃ
は脚体としての脚杆、１２ｄは連結体としての連
結杆である。
Fig. 1 is a perspective view of the warp prevention part of one embodiment of the present invention in use, Fig. 2 is a perspective view of its back side, and Fig. 3 is a part of the warp prevention part of another embodiment of the invention in use. 4 is a schematic cross-sectional view of a conventional jet soldering device, and FIG. 5 is a diagram showing a holder for a printed circuit board. In the figure, 11 is a printed circuit board, 11a is a board main body, 12 is warpage prevention parts, 12a, 12b, 12c
is a leg rod as a leg body, and 12d is a connecting rod as a connecting body.
Claims (1)
結する連結体を有して全体の形態が外力に対して
変形困難に構成され、かつ上記脚体の少なくとも
２本はプリント基板の基板本体に固着されること
を特徴とするプリント基板のソリ防止部品。 It has a plurality of spaced apart legs and a connecting body that connects all of these legs so that the overall form is difficult to deform due to external force, and at least two of the legs are attached to the main body of the printed circuit board. A part for preventing warpage of printed circuit boards, characterized by being fixed to the parts.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14719084U JPS6161872U (en) | 1984-09-28 | 1984-09-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14719084U JPS6161872U (en) | 1984-09-28 | 1984-09-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6161872U true JPS6161872U (en) | 1986-04-25 |
Family
ID=30705427
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14719084U Pending JPS6161872U (en) | 1984-09-28 | 1984-09-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6161872U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5722269B2 (en) * | 1974-10-09 | 1982-05-12 |
-
1984
- 1984-09-28 JP JP14719084U patent/JPS6161872U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5722269B2 (en) * | 1974-10-09 | 1982-05-12 |
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