JPS6161218A - Manufacture of thin film magnetic head - Google Patents

Abstract

PURPOSE:To prevent occurrence of defective level differences on an insulating layer at the time of forming an conductive coil pattern by forming a conductive film wholly beforehand when providing the conductive coil pattern, and making the conducting coil pattern by partial oxidation by an anodic oxidation process. CONSTITUTION:A thin film 2 is formed over the whole surface on an end side on a substrate 1, and through-holes are provided at several places. Then, a conductive film 8' of Al is formed on the thin film 2 including the through-hole s. Resists 9, 9- insoluble in an anodic oxidation solution are coated on intended parts 8'', 8''- for forming coil pattern in the conductive coil 8'. The body of the substrate 1 is immersed in the anodic oxidation solution, and an electric current is applied by using the substrate 1 as an anode and the anodic oxidation solution as a cathode to anodize the parts 10, 10- of the conductive film 8' not covered by resists 9, 9-. Then, the resists 9, 9- are stripped off and a conductive layer 11 is formed on the conductive coil patterns 8, 8- and oxidized parts 10, 10- and a ferromagnetic thin film 12 is formed.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention is a method of manufacturing a magnetic head for R/W of a magnetic recording device such as a DAT or a combi coater, and specifically relates to a technique for forming a conductive coil.

Conventional technology Recent DAT (digital audio tape recorder)
First time, POM (Pulse Code Modulation)
Magnetic recording devices that perform recording are required to process a large amount of information in order to digitize analog signals, and are required to have a higher recording density than conventional magnetic recording devices. For DAT, etc., the linear recording density of magnetic tape is
We are approaching the limit, and there is no hope that we will be able to dramatically improve this in the future. Therefore, in DλT and the like, thin film heads, which can easily achieve high track density, are beginning to be used instead of conventional bulk heads. However, the technology for forming a thin film conductive coil has not yet been established, and there is a drawback in that it causes magnetic flux disturbance in the upper core, which will be described below.

That is, the thin film head generally has the following characteristics as shown in FIG.
A non-magnetic thin film 2 for forming a magnetic gap is formed on a substrate 1 serving as the lower core, and a conductive coil pattern 3 is wound several times on the thin film 2, and other parts other than the thin film 2 are connected to the substrate 1. A ferromagnetic thin film 5 is provided which is directly bonded to the IT coil pattern 3 and interlinks with the IT coil pattern 3 via the insulating layer 4. In this case, the upper surface of the insulating layer 4 is uneven depending on the presence or absence of the conductive coil renozzle turn 3 (1). Then, when forming the ferromagnetic thin film 5, one step boundaries 6, 6 .・・・・・・．

The magnetic flux is disturbed at the stepped portions 5/, 5/, . . . , and the magnetic flux leaks to the lower core, which is a problem. ', 5', ...... magnetic flux
The reason for the inconvenient disturbance is that it is extremely difficult to eliminate the step difference on the top surface and edge of the fill due to the insulating layer 4. Moreover, in order to perform PaMW self-recording, this thin-film head is constructed into a multi-head configuration consisting of several dozen heads shown in Fig. 6, so it is necessary to take heat generation into consideration. There is a tendency to reduce t5E as much as possible and instead increase the number of turns of the conductive fill. Therefore, it is extremely important to eliminate the step difference in the insulating layer 4 in the conductive coil by cutting into the thin film. At present, as a measure to eliminate the step difference in the thin film head described above, as shown in FIG. A step eliminating agent such as a resist made of Nistyl containing sulfonic acid and a phenolic OH group and an alkali-soluble 7-polarity resin is applied, but it complicates the manufacturing process and is expensive. 1 also had the weaknesses of low manufacturing yield and poor reliability.

This invention has been proposed as a result of studies in consideration of the above technical background, and its purpose is to prevent the occurrence of uneven steps due to the formation of an insulating layer during the formation of a conductive film or an insulation layer.

Means for Solving the Problems The present invention employs the first means to achieve the above object of an inductive thin film magnetic head.

That is, a step of forming a nonmagnetic thin film for forming a magnetic gap on a ferromagnetic substrate that will become the lower core.

The process of providing a conductive fill pattern on the non-magnetic thin film, a ferromagnetic material that becomes the core of the part that is directly bonded to the substrate other than the non-magnetic thin film, and rides on and interlinks with the conductive coil pattern via an insulating layer. A method for manufacturing a magnetic head that includes a step of forming a thin film is characterized in that when providing a conductive coil pattern, a conductive film is formed on the entire surface in advance and is partially oxidized by an anodic oxidation method to form a conductive coil pattern. It is something to do. Therefore, this invention differs from the conventional method in which when forming a conductive film, the portion of the conductive film previously formed on the entire surface that is not to be set as a coil is removed by chemical or physical coupling means. It is distinctive in that it remains as an oxidized part.

Effect of the Invention By adopting the above-mentioned means, the step difference is almost eliminated when an insulating layer is provided after the conductive fill pattern is formed, so that the step remover, which was conventionally required, is no longer necessary. ! ! In addition, in the conductive film after the coil is formed, the coil portion and the oxidized portion are at approximately the same height, that is, the upper surface of the conductive film is flattened, making it easier to form an insulating layer than before.

Embodiment FIG. 1 is a sectional view of an inductive thin film magnetic head obtained as a result of carrying out an embodiment of the present invention.

First, the substrate 1 is made of a ferromagnetic material such as Mn--Znn phthalate similar to the conventional one, and serves as a lower core. The thin film 2 is an insulating nonmagnetic film such as 5i02 or Al2O3, and is formed by sputtering, and serves as an insulating layer that also serves as a magnetic gap spacer. Zarani, 8,8. . . . is an aluminum conductive coil pattern, 10, 10. ······teeth.

This is the oxidized portion of Al2O3. Reference numeral 11 is an insulating layer equivalent to the conventional one, and 12 is a ferromagnetic thin film such as vermalloy, which serves as the upper core.

To manufacture the inductive thin film magnetic head described above, the following steps are required.

That is, as shown in FIG. 2, first, the thin film 3 is formed on the entire surface of the substrate l toward one end side, although it is not shown in the drawing because it is located away from the cross section.

Make through holes in several places. Next, a conductive film 81 having a thickness of K kg is formed on the thin film 2 including those through holes. Therefore, the conductive film 8' is electrically connected to the substrate 1 through the through hole. Then the third
As shown in the figure, on the coil pattern formation planned portions B#, Bl, . . . in the conductive film 8/, there is a resist (insoluble in polar oxidation liquid f) described later) 9, 9° . . .・Apply. Then, as shown in FIG. 4, the structure of the substrate 1 shown in FIG. 9,9. Part 10 not covered by...
,10. ...... is anodized.

As described above, the oxidized parts 10, 10 of AJ303
.

When .
This is the extent to which it rises and forms. Then, as shown in FIG. 5, resists 9, 9. . . . is peeled off and removed to form conductive coil patterns 8, 8. . . . and the oxidized portions 10, 10. . . . An insulating layer 11 is formed thereon, and a ferromagnetic thin film 12 is formed thereon.

Therefore, in this embodiment, the insulating layer 11 is formed by using substantially flat conductive film lines 8, 8 . ...and oxidized part 1
0.10. . . . can be formed on top of the insulating layer 4 and the step remover 7, and both the number of man-hours and the workability are superior to the conventional formation of the insulating layer 4 and the step remover 7.

In the above embodiments, an inductive thin film magnetic head for R/W has been described, but the present invention can also be applied to a composite thin film magnetic head combined with a read-only MR head. Effects of the invention According to the present invention, the level difference eliminating agent used conventionally is not required, and the upper surfaces of the conductive film and the oxidized portion are flattened, so that the number of man-hours for forming the conductive coil pattern can be reduced.
Improved work efficiency can be achieved at the same time. Moreover, in this invention, the oxidized parts that are not set as conductive coils are left as they are, and there is no need to remove them by etching, so there is no risk of lowering the manufacturing yield due to poor etching removal, and reliability is extremely improved.

[Brief explanation of drawings]

FIG. 1 is a sectional view of a thin film magnetic head according to an embodiment of the present invention, FIGS. 2 to 5 are sectional views of each manufacturing process, and FIG. 6 is a sectional view of a conventional thin film magnetic head. It is a diagram. l... Substrate, 2... Non-magnetic thin film, 8@... Conductive coil pattern. 10... Part to be oxidized, 11... Insulating layer, 12... Ferromagnetic thin film. Figure 2 Figure 3

Claims (1)

[Claims] A process of forming a non-magnetic thin film for forming a magnetic gap on a ferromagnetic substrate that will become the lower core, a process of providing a conductive coil pattern on the non-magnetic thin film, and a process of directly bonding to the substrate other than the above-mentioned non-magnetic thin film. In a method for manufacturing a magnetic head, the method includes the step of forming a ferromagnetic thin film that becomes an upper core and interlinks with the conductive coil pattern by riding on the conductive coil pattern via an insulating layer. A method for manufacturing a thin film magnetic head, characterized in that a film is formed on the entire surface and partially oxidized by an anodic oxidation method to form a conductive coil pattern.