JPS6160152B2 - - Google Patents

Info

Publication number
JPS6160152B2
JPS6160152B2 JP4131578A JP4131578A JPS6160152B2 JP S6160152 B2 JPS6160152 B2 JP S6160152B2 JP 4131578 A JP4131578 A JP 4131578A JP 4131578 A JP4131578 A JP 4131578A JP S6160152 B2 JPS6160152 B2 JP S6160152B2
Authority
JP
Japan
Prior art keywords
gold
sulfite
plating bath
strike plating
pyrophosphate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP4131578A
Other languages
English (en)
Japanese (ja)
Other versions
JPS54134042A (en
Inventor
Kazuhiro Higuchi
Shinji Funami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NIPPON EREKUTOROPUREITEINGU ENJINYAAZU KK
Original Assignee
NIPPON EREKUTOROPUREITEINGU ENJINYAAZU KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NIPPON EREKUTOROPUREITEINGU ENJINYAAZU KK filed Critical NIPPON EREKUTOROPUREITEINGU ENJINYAAZU KK
Priority to JP4131578A priority Critical patent/JPS54134042A/ja
Publication of JPS54134042A publication Critical patent/JPS54134042A/ja
Publication of JPS6160152B2 publication Critical patent/JPS6160152B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Electroplating And Plating Baths Therefor (AREA)
JP4131578A 1978-04-10 1978-04-10 Gold strike plating solution Granted JPS54134042A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4131578A JPS54134042A (en) 1978-04-10 1978-04-10 Gold strike plating solution

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4131578A JPS54134042A (en) 1978-04-10 1978-04-10 Gold strike plating solution

Publications (2)

Publication Number Publication Date
JPS54134042A JPS54134042A (en) 1979-10-18
JPS6160152B2 true JPS6160152B2 (enrdf_load_stackoverflow) 1986-12-19

Family

ID=12605068

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4131578A Granted JPS54134042A (en) 1978-04-10 1978-04-10 Gold strike plating solution

Country Status (1)

Country Link
JP (1) JPS54134042A (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6126807A (en) * 1999-04-30 2000-10-03 Lucent Technologies Inc. Process for making sodium gold sulfite solution

Also Published As

Publication number Publication date
JPS54134042A (en) 1979-10-18

Similar Documents

Publication Publication Date Title
JP2835287B2 (ja) ニッケルチタン合金部材のめっき方法
WO1991002110A1 (en) Treatment to reduce solder plating whisker formation
GB1558919A (en) Electrolytic surface treating process for copper foil for use in printed circuit
US4076599A (en) Method and composition for plating palladium
JPH0587598B2 (enrdf_load_stackoverflow)
US4474838A (en) Electroless direct deposition of gold on metallized ceramics
EP0127857B1 (en) Solderable stainless steel article and method for making same
JPS58500765A (ja) パラジウムと銅およびニツケルの少くとも一方の金属とを含むめつき層を化学的に剥離する方法および該方法に使用する浴
JPH0119000B2 (enrdf_load_stackoverflow)
JPS6160152B2 (enrdf_load_stackoverflow)
EP0132596A2 (en) Solderable nickel-iron alloy article and method for making same
KR100321205B1 (ko) 구리또는구리합금의변색방지액및변색방지방법
US2966448A (en) Methods of electroplating aluminum and alloys thereof
JPS62199791A (ja) コバルトおよびコバルト合金めつき液
JPS6196088A (ja) Ni−Fe合金IC用リ−ドフレ−ムの製造法
JPS597359B2 (ja) メツキ方法
JP2931657B2 (ja) 電気活性重合体の電気メッキ法
JPH04160173A (ja) 銅の変色防止液
JPH0154438B2 (enrdf_load_stackoverflow)
JPH07180085A (ja) 非シアン銀めっき方法及びそれに用いられる非シアン溶液
JP3685276B2 (ja) パラジウム・銀合金めっき浴
JPS62230996A (ja) アルミニウム基板にめつきをする方法
JP3141144B2 (ja) 銀の電解剥離剤
JPS6326375A (ja) 無電解めつき開始方法
US3075894A (en) Method of electroplating on aluminum surfaces