JPS6159838A - Washer for wafer - Google Patents

Abstract

PURPOSE:To wash a wafer after washing by chemicals precisely even regarding particulate dust by forming a large number of holes to a running-water control plate disposed to a lower section in a tank, thickly arranging holes in a region just under a carrier and thinly disposing holes in regions except the region just under the carrier. CONSTITUTION:An inlet 26 is formed to the lower section of a tank 22, and water is fed into the tank 22 from the direction of the arrow 29. A running- water control plate 25 is mounted to the shape of a parting plate in a lower section in the tank 22. A large number of holes 27, 28 are shaped to the running- water control plate 25. The holes 27 are arranged thickly in a region just under a carrier 21 in these holes 27, 28. The holes 28 in regions except the region just under the carrier 21 are disposed thinly. Accordingly, a large amount of water are fed through the holes 27 from the region just under the carrier 21, and a small amount of water are fed through the holes 28 from the periphery of the carrier 21.

Description

DETAILED DESCRIPTION OF THE INVENTION 5. The present invention relates to an improvement in a cleaning device for washing wafers with water after chemical cleaning.

Although wafers are cleaned using chemicals to remove organic matter, dust, etc. after mirror boring, dust, etc. may remain on the wafer surface even after chemical cleaning.

FIGS. 5 and 6 show an example of a conventional wafer cleaning apparatus used for washing the dust with water. Water is supplied from below the tank 10 and water is drained from above the tank 10. A drainage passage 11 is provided above the tank 10. Water in the tank 10 is drained through a drain passage 11.

An ultrasonic generator 12 is provided at the bottom of the tank 10.

A carrier 13 carrying a large number of wafers is transferred to a tank 10.
The wafer is placed in water 14 inside the wafer, and an ultrasonic generator 12 generates ultrasonic waves to remove dust and the like from the wafer surface.

When removing dust from the wafer surface using ultrasonic waves, if the size of the dust exceeds a certain level, the dust will not be properly removed from the wafer. However, if the dust is extremely fine, it will not only not be removed from the wafer surface, but rather the fine dust in the water will adhere to the wafer surface.

Such a phenomenon has not been noticed by those skilled in the art, and was discovered for the first time by the present inventors.

Shellfish! ■This invention eliminates the drawbacks of the prior art described above,
It is an object of the present invention to provide a wafer cleaning device that can accurately wash wafers after chemical cleaning, even for fine dust particles, without using ultrasonic waves.

The gist of the present invention to achieve this object is that in a wafer cleaning apparatus u for washing wafers with water after chemical cleaning using a carrier, water is supplied from the lower part of the tank. A flowing water control plate is arranged at the lower part of the tank, and a large number of holes are formed in the flowing water control plate. The wafer cleaning apparatus is characterized in that the holes are arranged densely, and the holes in areas outside the area directly below the carrier are sparsely arranged.

After chemical cleaning, a carrier 21 carrying a number of wafers (not shown) is placed in water 23 in a tank 22. Water is supplied from the lower part of the tank 22, and dust is removed from the wafer surface solely by the action of the flowing water. Water is in tank 2
Water is drained from above 2 through a drainage passage 24.

A water flow control plate 25 in the form of a partition plate or the like is provided in the lower part of the tank 22. The water that entered from the inlet port 26 flows through the hole 27 of this water control plate 25.
28 and flows upwardly. At this time, the large number of holes 27 in the area directly below the carrier 21 are densely arranged, and the holes 28 in the area outside the area directly below the carrier 21 are sparsely arranged.

Water entering from the L-pan inlet 26 flows upwardly through the holes 27, 28 in the flow control plate, and as it does so, the carrier 2
A large number of wafers placed on the wafer 1 are cleaned. This removes dust and organic particles on the wafer surface.

Disaster 101 1 and 2 show a first embodiment of the invention.

An inlet 26 is provided at the bottom of the tank 22, and an inlet 26 is provided at the bottom of the tank 22.
Water is supplied into the tank 22 from this direction.

In the lower part of the inside of the tank 22, a running water controller 1-roll plate 25 is provided in the form of a partition plate in the figure.

Also, inside the tank 22 there is a carrier 2 as in the conventional case.
1 can be set at a predetermined position. A large number of wafers (not shown) can be placed on this carrier 21 as in the conventional case.

A drainage passage 24 is provided above and outside the tank 22.

Water 23 in tank 22 overflows from the upper edge of tank 22 and drains through drain passage 24 in the direction of arrow 30.

The flowing water control plate 25 has many holes 27 and 28.
is formed. Of these holes 27, 28, in the area directly below the carrier 21, the holes 27 are arranged closely. Further, the holes 28 in the area away from directly below the kit clear 21 are sparsely arranged. Therefore, Kii! Water is supplied from the area immediately below the carrier 21 through holes 27, and raw water is supplied from around the carrier 21 through holes 28. .

3 and 4 show a second embodiment of the invention.

The members with the same reference numerals are completely the same in the first embodiment and the second embodiment, so the description thereof will be omitted.

In the second embodiment, a partition plate 31 is provided below the water flow control plate 25. The shapes of the partition plays 1 to 31 approximately correspond to the carrier 21. An inlet 26 is connected to the outer space of the partition plate 31, and another inlet 32 is connected to the inner space of the partition plate 31.

That is, separate entrances 26, 32 are provided for the spaces inside and outside the partition plate 31.

Further, in the inner region of the partition plate 31, the holes 27 of the water flow control plate 25 are arranged densely. In the outer region of the partition plate 31, the holes 28 of the water flow control plate 25 are arranged sparsely. It is located in

The two inlets 26.32 are each supplied with water via arrows 29.33. In this case, the water supply recesses at each inlet 26, 32 may be the same or different, and can be freely controlled.

Note that the hole 27 provided in the water flow control plate 25.
The diameter and number of the holes 28 are generally determined by the capacity of the tank 22 in many cases.

For example, when the capacity of the tank 22 is V and the maximum flow of the holes 27.28 is Q, it is desirable that Q/V-1 to 5 be present.

Note that the hole 27 provided in the water flow control plate 25.
Preferably, the holes 28 have the same cross-sectional area so that the water flow rate in each hole 27,28 is the same.

Furthermore, the flushing effect can be enhanced by ejecting gas from below the running water controller 1 - role plays 1 to 25 to create a powerful vortex.

Entire view of row 11 According to the wafer cleaning apparatus according to the present invention, no ultrasonic generator is used at all, and dust, etc. on the wafer surface is removed by running water from the holes 27 and 28 of the running water control plate 25. Dust can also be reliably removed.

7 and 8 show comparative examples for comparison with the embodiments of FIGS. 1 and 2 according to the present invention. Except for the configuration of the water flow control plate 41, this comparative example and the first embodiment of the present invention (FIGS. 1 and 2) are substantially the same.

In this comparative example, the holes 42 of the water flow control plate 41 are formed at uniform pitches throughout.

In this comparative example, J: had a practical problem because the effect of removing dirt from the surface of the wafer provided on the carrier 21 was much lower than that of the present invention.

[Brief explanation of drawings]

FIG. 1 is a schematic cross-sectional view showing an example of a wafer cleaning apparatus according to the present invention, FIG. 2 is a plan view showing the water condenser 1 to roll play 1 of FIG. 1, and FIG. 3 is a wafer cleaning apparatus according to the present invention. FIG. 4 is a schematic plan view showing the running water controller 1 - roll plate and partition plate 1 of FIG. 3, and FIG. 5 is a conventional wafer washing system. Figure 6 is a cross-sectional view taken along line X-X in Figure 5, Figure 7 is a schematic cross-sectional view showing a comparative example, and Figure 8 is a schematic cross-sectional view of Figure 7. It is a top view which shows a flowing water control plate. 21, Carrier 22, Tank 23, Water 24, Drain passage 25, Flowing water control play 1-26,
,,,,Entrance 27.28. , , Hole 31 , , Partition plate 3211.10. EntranceFigure 1Figure 2Figure 3Figure 4Figure 2'7 Figure 5Figure 6

Claims (1)

[Claims] A wafer cleaning device for placing wafers after chemical cleaning on a carrier and rinsing them with water is configured to supply water from the lower part of the tank and drain water to the outside from the upper part of the tank,
Place the water flow control plate at the bottom of the tank,
A large number of holes are formed in the water flow control plate, and among the holes, the holes in the area directly below the carrier are arranged densely, and the holes in the area outside the area directly below the carrier are sparsely arranged. Wafer cleaning equipment.