JP3190124B2 - Substrate cleaning device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate processing apparatus used in a water washing step after a chemical treatment in a batch wet treatment of a semiconductor wafer.

[0002]

2. Description of the Related Art As shown in FIG. 3, a conventional substrate cleaning apparatus is provided with a single pure water supply pipe 2 at a lower portion of a water washing tank 1.
The pipe 2 is provided with a plurality of holes 3 for ejecting pure water toward the upper part of the tank 1. When cleaning the wafer, the wafer 4 is put into the wafer carrier 5 and the pure water in the tank 1 is , And washed with pure water supplied from a pure water supply pipe 2. The pitch of the holes 3 of the pure water supply pipe 2 is two to three times the pitch of the wafers arranged on the wafer carrier.

[0003]

In the above conventional method,
The flow of pure water from the bottom to the top in the tank 1 is disturbed, so that a uniform flow state cannot be created, and dust attached to the wafer 4 or the carrier 5 is scattered over the entire wafer, and adheres again to the wafer. There is a lot of garbage, which is a factor that lowers product yield.

An object of the present invention is to realize a substrate cleaning apparatus capable of cleaning dust adhering to a wafer or a wafer carrier without re-adhering to the wafer.

[0005]

The substrate cleaning apparatus according to the present invention is a substrate cleaning apparatus for batch-type wet processing of semiconductor wafers, in which a plurality of pure water supply pipes 11 are provided below a washing tank 10. together placed in parallel with a predetermined gap, and a plurality and plurality or more of the wafer at a pitch the same pitch of the wafer to be cleaned is held in a wafer carrier disposed within the washing tank 10 to each of the pipe 11 And the pure water supply pipes 15
At the base of 11 is the pure water supplied to each pipe 11
A flow rate adjuster that reduces the area of the flow path so that the amount of water can be adjusted
A step is provided . Further, in addition to the above, in the pure water blowing hole 15, the hole diameter of the pipe 11 on the pure water supply side is made larger than the other.

In addition to the above, the flow rate adjusting means
It is characterized by a flow regulating bolt 16 to narrow the area of the channel. By adopting this configuration, a substrate cleaning apparatus capable of cleaning dust adhering to a wafer or a wafer carrier without re-adhering to the wafer can be obtained.

[0007]

According to the present invention, a plurality of pure water supply pipes 11 in which holes 15 for blowing out pure water are formed at the same pitch as the pitch of the wafer 17 to be cleaned are provided at the lower part of the washing tank 10. The pure water which has flowed out of the pure water supply pipe 11 has a uniform flow velocity distribution as a whole from the front to the back of the wafer 17, and is symmetrical in the diameter direction of the wafer with the maximum near the center of the wafer 17. It is possible to obtain a suitable flow velocity distribution. In this way, a uniform flow of pure water can be created from the bottom to the top in the washing tank, and the dust attached to the wafer and the wafer carrier does not adhere to the wafer again.
It can be discharged out of the washing tank from the top.

[0008]

1A and 1B show an embodiment of the present invention. FIG. 1A is a sectional view taken along line aa of FIG. 1B, and FIG. 1B is a sectional view taken along line bb of FIG. It is. As shown in the figure, the present embodiment includes a washing tank 10 and a plurality of pure water supply pipes 11 provided below the washing tank 10.
As shown in FIG. 2, the pure water supply pipes 11 are arranged in parallel with a slight gap therebetween, and are connected to the front water pipe 12 via the side water pipes 13 and 13 ′. It is connected to the intake manifold 14. The other end of the pure water supply pipe 11 is fixed to the front water conduit 12, but the part is blind.

Each of the pure water supply pipes 11 is provided with a plurality of pure water blow-out holes 15 opening upward from the washing tank 10. The number of the holes 15 is larger than the number of wafers placed on the wafer carrier and cleaned, and the interval between the holes is equal to the pitch of the wafers (mounting interval). And several 1 near intake manifold 14
The holes 5a (two in the figure) are made larger than the other holes so that a uniform flow distribution can be obtained from one end of the pure water supply pipe to the other. Also, the intake manifold 14
At the inlet of each pure water supply pipe 11, a flow control bolt 16 for changing the cross-sectional area of the flow path is provided so that the amount of pure water flowing into each pipe can be adjusted.

The operation of the embodiment constructed as described above will be described with reference to FIGS. First, as shown in FIG.
Is placed on a wafer carrier 18, immersed in pure water in a washing tank 10, and supplied with pure water from a water supply port 12 a of a front water pipe 12. The supplied pure water is supplied from the front water pipe 12 to the side water pipes 13, 13 ′ and the intake manifold 14.
Through the pure water supply pipe 11 and blows upward from the pure water blowing hole 15 to clean the wafer 17.

At this time, the holes 15 are formed in accordance with the mounting interval of the wafers 17, and the diameters of several holes 15a on the base side of the pipe 11 are increased so that the holes 11 are uniformly formed from one end of the pipe 11 to the other. Since the flow rate distribution is obtained, each of the water flows can reliably flow on the wafer surface and can prevent re-adhesion of dust to the wafer surface.

Further, by controlling the amount of pure water flowing into each pure water supply pipe 11 with the flow rate adjusting bolt 16, the flow rate distribution in the diameter direction of the wafer 17 can be optimized. Fig. 2
The mountain-shaped flow velocity distribution as shown by the curve A in FIG. In order to realize such a flow velocity distribution, the central bolt 16 may be short, and may be longer toward both ends.

When the washing operation is completed and the water is drained from a drain port (not shown) provided at the lower part of the washing tank 10, each pure water supply pipe 11 is installed with a slight gap (several mm). In addition, the flow of the liquid at the time of drainage is hardly obstructed, and the drainage can be performed quickly in a substantially vertical direction.

[0014]

According to the present invention, it is possible to reduce the number of dirt particles having a size of 0.2 μm or more, which has been about several hundreds, to 100 or less by a water washing treatment after a chemical treatment of a wafer having a diameter of 6 inches. Was completed. This can contribute to an improvement in yield.

[Brief description of the drawings]

1A and 1B are diagrams showing an embodiment of the present invention, in which FIG. 1A is a cross-sectional view taken along line aa of FIG. 1B, and FIG.
It is sectional drawing in a line.

FIGS. 2A and 2B are diagrams showing details of a pure water supply pipe in an embodiment of the present invention, wherein FIG. 2A is a plan view and FIG.
FIG. 3C is a cross-sectional view taken along line cc in FIG. 3A, and FIG. 4D is a cross-sectional view taken along line dd in FIG.

FIG. 3 is a view showing a conventional substrate cleaning apparatus.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 ... Rinse tank 11 ... Pure water supply pipe 12 ... Front part water pipe 13, 13 '... Side part water pipe 14 ... Intake manifold 15 ... Pure water blowing hole 16 ... Flow control bolt 17 ... Wafer 18 ... Wafer carrier

──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-60-106136 (JP, A) JP-A-2-110993 (JP, A) Fully open 1984-177940 (JP, U) Really open 39148 (JP, U) JP-A-1-173933 (JP, U) JP-A-3-38628 (JP, U) (58) Fields investigated (Int. Cl. ⁷ , DB name) B08B 3/00-3 / 14 H01L 21/304 642

Claims (3)

(57) [Claims] 1. A substrate cleaning apparatus for batch-type wet processing of semiconductor wafers, wherein a plurality of pure water supply pipes (1) are provided at a lower portion of a washing tank (10).
1) are installed in parallel with a predetermined gap therebetween, and each pipe (11) has the same pitch as the pitch of the wafer to be washed held by the wafer carrier provided in the washing tank (10). And a plurality of pure water blowing holes (15) equal to or larger than the number of wafers , and further, each of the pure water supply pipes
At the root of (11), supply to each pipe (11)
Flow to reduce the area of the flow path so that the amount of pure water
A substrate cleaning apparatus comprising an amount adjusting means . 2. The substrate cleaning apparatus according to claim 1, wherein a diameter of the pure water supply hole of the pipe on the pure water supply side is made larger than the other. Wherein said flow regulating means, the substrate cleaning apparatus according to claim 1, characterized in that the flow regulating bolt narrowing the area of the channel (16).