JPS63128633A - Semiconductor substrate washer - Google Patents
Semiconductor substrate washerInfo
- Publication number
- JPS63128633A JPS63128633A JP27428086A JP27428086A JPS63128633A JP S63128633 A JPS63128633 A JP S63128633A JP 27428086 A JP27428086 A JP 27428086A JP 27428086 A JP27428086 A JP 27428086A JP S63128633 A JPS63128633 A JP S63128633A
- Authority
- JP
- Japan
- Prior art keywords
- bottom plate
- water
- washing
- washing bath
- fine holes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims description 10
- 239000000758 substrate Substances 0.000 title claims description 9
- 238000005406 washing Methods 0.000 claims abstract description 28
- 239000011148 porous material Substances 0.000 claims description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 12
- 239000000126 substance Substances 0.000 abstract description 6
- 238000011010 flushing procedure Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Landscapes
- Cleaning By Liquid Or Steam (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は半導体集積回路製造工程において、薬液処理さ
れた半導体基板の水洗を目的とする水洗装置に関するも
のである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a water washing device for washing semiconductor substrates treated with a chemical solution in a semiconductor integrated circuit manufacturing process.
従来、この種の水洗装置には第２図（ａ）、（ｂ）に示
すように水洗槽１の底部２に取付られた排水バルブ３の
開閉により槽内の排水を行う水洗槽が用いられていた。Conventionally, this type of washing device uses a washing tank in which the water inside the tank is drained by opening and closing a drain valve 3 attached to the bottom 2 of the washing tank 1, as shown in FIGS. 2(a) and 2(b). was.
このため槽内の水を少量排水して水洗を行う場合、排水
バルブ３の開閉時間が短くなるため、排水バルブ周辺部
のみしか排水されず、槽底にたまった薬液成分が充分に
水と置換されないという欠点があった。Therefore, when flushing is performed by draining a small amount of water in the tank, the opening and closing time of the drain valve 3 is shortened, so only the area around the drain valve is drained, and the chemical components accumulated at the bottom of the tank are sufficiently replaced with water. The drawback was that it was not possible.
本発明の目的は槽底にたまった薬液成分を水と充分に置
換するようにした半導体基板水洗装置を提供することに
ある。SUMMARY OF THE INVENTION An object of the present invention is to provide a semiconductor substrate washing apparatus that can sufficiently replace chemical components accumulated at the bottom of the bath with water.
本発明は薬液処理された半導体基板の水洗を行う半導体
基板水洗装置において、底板全面に細孔を有する水洗槽
を具備したことを特徴とする半導体基板水洗装置である
。The present invention is a semiconductor substrate washing apparatus for washing chemically treated semiconductor substrates, characterized in that the semiconductor substrate washing apparatus is equipped with a washing tank having pores on the entire surface of the bottom plate.
以下、本発明の一実施例を図によって説明する。 Hereinafter, one embodiment of the present invention will be described with reference to the drawings.
第１図（ａ）、 （ｂ）において、水洗槽１の槽底に排
水バルブ３を設ける。さらに、水洗槽１の底板４の全面
に複数個の同径の細孔４ａ、 ４ａ・・・を設け、該底
板４と水洗槽１の槽底との間に排水枡５の空間を残して
該底板４を水洗Ｍｇ２内に設置する。In FIGS. 1(a) and 1(b), a drain valve 3 is provided at the bottom of the washing tank 1. Furthermore, a plurality of pores 4a, 4a... of the same diameter are provided on the entire surface of the bottom plate 4 of the washing tank 1, and a space for a drainage basin 5 is left between the bottom plate 4 and the bottom of the washing tank 1. The bottom plate 4 is installed in water-washed Mg2.
したがって、排水枡５の前段に細孔４ａを有する底板４
が位置するため、水洗槽１内の水は底板４の細孔４ａに
より均一に排水され、底板下部の排水枡５の排水バルブ
３より排水される。Therefore, the bottom plate 4 having the pores 4a at the front stage of the drainage basin 5
Because of this position, the water in the washing tank 1 is uniformly drained through the pores 4a of the bottom plate 4, and is drained through the drain valve 3 of the drainage basin 5 at the bottom of the bottom plate.
本実施例では底板に設ける細孔を同径としたが、異なる
サイズの細孔の配列を用いてもよい。In this embodiment, the pores provided in the bottom plate have the same diameter, but pores of different sizes may be arranged.
以上説明したように本発明は、水洗槽の底板に細孔をあ
けることにより、槽底の排水を均一にすることができ、
少量排水時の薬液成分の水との置換を効率よく行え、水
洗効果を向上させることができる効果を有するものであ
る。As explained above, the present invention makes it possible to make the drainage at the bottom of the tank uniform by making pores in the bottom plate of the washing tank.
This has the effect of efficiently replacing chemical components with water when a small amount of water is drained, and improving the washing effect.
第１図（ａ）は本発明の一実施例を示す正面図、第１図
（ｂ）は開平面図、第２図（ａ）は従来例を示す正面図
、第２図（ｂ）は同平面図である。
１・・・水洗槽 ４・・・底板４ａ・・・
細孔
特許出願人 九州日本電気株式会社
（α）
（ｂ）
第１図FIG. 1(a) is a front view showing an embodiment of the present invention, FIG. 1(b) is an open plan view, FIG. 2(a) is a front view showing a conventional example, and FIG. 2(b) is a front view showing an embodiment of the present invention. FIG. 1...Washing tank 4...Bottom plate 4a...
Pore patent applicant Kyushu NEC Corporation (α) (b) Figure 1
Claims (1)
板水洗装置において、底板全面に細孔を有する水洗槽を
具備したことを特徴とする半導体基板水洗装置。(1) A semiconductor substrate washing apparatus for washing chemically treated semiconductor substrates, characterized in that the semiconductor substrate washing apparatus is equipped with a washing tank having pores on the entire surface of the bottom plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27428086A JPS63128633A (en) | 1986-11-18 | 1986-11-18 | Semiconductor substrate washer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27428086A JPS63128633A (en) | 1986-11-18 | 1986-11-18 | Semiconductor substrate washer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63128633A true JPS63128633A (en) | 1988-06-01 |
Family
ID=17539454
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27428086A Pending JPS63128633A (en) | 1986-11-18 | 1986-11-18 | Semiconductor substrate washer |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63128633A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2387767A (en) * | 2002-03-01 | 2003-10-29 | Phillip Anthony Jarvis | Drainage device for food products |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60113433A (en) * | 1983-11-22 | 1985-06-19 | Mitsubishi Electric Corp | Washing equipment of thin plate |
| JPS6159838A (en) * | 1984-08-31 | 1986-03-27 | Toshiba Ceramics Co Ltd | Washer for wafer |
-
1986
- 1986-11-18 JP JP27428086A patent/JPS63128633A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60113433A (en) * | 1983-11-22 | 1985-06-19 | Mitsubishi Electric Corp | Washing equipment of thin plate |
| JPS6159838A (en) * | 1984-08-31 | 1986-03-27 | Toshiba Ceramics Co Ltd | Washer for wafer |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2387767A (en) * | 2002-03-01 | 2003-10-29 | Phillip Anthony Jarvis | Drainage device for food products |
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