JPS6158732A - Manufacture of copper-lined laminated board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed description of the invention] The present invention relates to a method for manufacturing a copper-clad laminate.

Conventionally, laminated molding of prepreg and copper foil, which are made by impregnating a synthetic resin into base materials such as fiberglass cloth and glass cloth, has a weight of 40 kg or more.
It was carried out under a high pressure of 120 mm/d.

This is to allow the synthetic resin to sufficiently penetrate into the base material.

If the molding pressure is insufficient, voids in the base material or resin may remain, resulting in
This is because the quality of the product will be impaired.

Therefore, the molding equipment becomes large and the equipment cost becomes large. However, even with such molding equipment, pressure is applied from above and below, causing problems such as resin flowing sideways, resulting in fat loss, difficulty in achieving uniform thickness, and unstable quality. In addition, resin scum adheres to the surroundings and surfaces of products or is scattered indoors, causing product defects.The present invention relates to a method for manufacturing copper-clad laminates that solves these problems. It is something.

The present invention will be explained according to drawings of embodiments.

FIG. 1 is a schematic diagram of the equipment used in the present invention, which includes a high-pressure gas tank (2), a vacuum pump (3), a pressure vessel (1) equipped with a heater (4) and a cooler (5), and It consists of a table (6) that is pumped into the pressure vessel (1),
A rack (7) is mounted on the trolley (6). The rack (7) is loaded with a molding material αG consisting of copper foil and four sheets of embossed resin glass cloth prepreg. To explain how the molding material is loaded into the rack (6), there is a base plate 02 having a concave groove α1 on the plate αη, the molding material is stacked on the base plate, and the surrounding area of the molding material is A silicone film aO is placed on the silicone film Q, and the end portion of the silicone film Q (the end portion of the plate member α1) is bonded to the outside of the silicone film Q with an adhesive. There is a ventilation hole in the center of the plate αυ.
4) is provided, and the vent α→ serves as a terminal that can communicate with the pressure vessel (1) and an external vacuum pump (2) through detachable piping.

The molding material αQ on the plate body Ql) is mounted together with the plate body 0(1) on the rack (7) on the trolley (6), and is fed into the pressure vessel (1), After the ventilation hole a and the vacuum pump (3) are connected, the vacuum pump (3)
The pressure in the molded cypress cypress is reduced by the operation of 0. The pressure is reduced at a predetermined pressure, and gases such as nitrogen gas and carbon dioxide are filled from the high pressure gas tank (2) to transform the formed mud material into silicone. Pressure is applied to the outside of the film (It3).

Although it is determined based on consideration, it is preferable to implement the pressure up to about 5 wHg. It is preferable from the viewpoint of safety etc. that gas filling is carried out after the inside of the pressure vessel has been lowered to 10- or less of the Daibutsu pressure.The pressure vessel (1) is made of a steel plate with a pressure resistance of 60 kglcd. External heater (4) and cooler (5)
It has a structure in which heating and cooling can be carried out freely by the operation of the heat exchangers +8) and (9) connected to and the fan θQ driven from the outside.

The 1,000 yen method for reducing pressure, applying pressure, and heating includes methods of applying pressure and heating after reducing pressure, and methods of applying pressure and heating after reducing pressure, and applying pressure and heating by temporary heating. That's fine.

After pressurizing and heating the molding material in a pressure vessel for a predetermined period of time, the molding process is completed by cooling and releasing gas.

The C1 film surrounding the molding material includes a synthetic resin film such as polyimide, polyester, nylon, silicone, etc., as well as a porous FI base material such as non-woven fabric, cloth, etc., which is coated with a heat-resistant synthetic resin by impregnation or coating. An integrated composite film or the like can be used. The method of bonding the film to the surface of the plate includes a method of bonding with an adhesive such as polyimide, urethane, epoxy, polyester, butyl rubber, phenol butyral, etc., a method of bonding with an adhesive tape, and a method of bonding with an adhesive attached to the film and the plate. A method of joining using buttons, hooks, etc. can be adopted.

Grooves such as diagonal grooves are provided on the surface of the base plate or plate body on which the molding material is placed so that air can be vented around the molding material covered with the film. The ventilation holes in the cough plate are shaped to allow air to circulate.

In order to prevent the film surrounding the molding material from sticking tightly to the surface of the molding material and causing the 9 capsules to partially remain and bite, a porous material such as non-woven fabric or net is placed between the molding material and the film. By interposing a quality sheet, pressure reduction can be effectively carried out, and defects such as surface discoloration and bubbles caused by oxidation caused by vertical air ingress can be avoided, and higher quality products can be produced.

The molding material consists of a copper foil, a base material, and an adhesive medium interposed between the two, and one to several molding materials are molded depending on manufacturing conditions.

In the case of multiple pieces, they are stacked vertically or arranged in a plane.

Base materials include polyester film, polyimide film,
-1 for films such as glass epoxy film, or molded plates such as phenol resin private laminate, epoxy resin laminate, etc.
Synthetic resin prepregs, etc., which are made by impregnating a porous base material such as paper or glass cloth with synthetic resins such as phenol resin or epoxy resin, are used, but synthetic resin prepregs are used because there is no molding factor other than the method of the present invention. In the case of resin prepreg, the manufacturing method of the present invention is more effective.

The adhesive medium is based on the base material's Pi! Although it may not be used depending on the type, materials that can be used include synthetic resin adhesives with excellent heat resistance such as epoxy, urethane, silicone, polyester, polyimide, phenol, phenol butyral, etc., α-cellulose, glass, etc. Paper, cloth, non-1'J + cloth made from rutted fibers 47;
, there is a sheet that integrates the same type of synthetic resin used in the above-mentioned adhesive into the porous a base material, and the manufacturing conditions and performance e
'z will be selected in a timely manner.

In the manufacturing method of the present invention, molding conditions up to a maximum pressure of 50 kg/d and a maximum temperature of 350° C. can be freely determined depending on the pressure resistance fr of the pressure capacity z3 and the type of heating medium.

According to the method for manufacturing a copper-clad laminate according to the present invention, the pressure around the molded material is reduced to a vacuum state and air bubbles, generated gas, etc. in the resin are released to the outside. Compared to the conventional press method, which requires a pressure of 40 to 120 mm/d to release and stir the material, molding can be performed at a lower pressure of 10 to 40 mm/d, improving production efficiency and simplifying equipment. . Furthermore, the flow of resin into the mold, which has been a problem in conventional pressing methods, does not occur at all in the α4 method of the present invention because pressure is applied from the periphery of the molding material. Therefore, the problems of resin loss, uneven thickness, and quality defects caused by the horizontal flow of resin have been resolved. Furthermore, there is the advantage that molding materials of various sizes can be molded at the same time, which speeds up the molding work.

[Brief explanation of the drawing]

Firstly, 1 is a schematic diagram of the equipment according to the present invention, FIG. 2 is a schematic diagram showing the inside of one side of the pressure vessel, and FIG. FIG. 3... Vacuum pump 4... Heater 5... Cooler 6... Cart 15... Molding material

Claims (1)

[Claims] Copper laminate, which is characterized by covering a molding material made by stacking copper foil on a base material such as synthetic resin prepreg with a film, reducing the pressure inside the film, and applying pressure and heating from the outside of the film to form the material. The manufacturing method of the board.