JP3211561B2 - Manufacturing method of single-sided copper foil clad laminate - Google Patents

Manufacturing method of single-sided copper foil clad laminate

Info

Publication number
JP3211561B2
JP3211561B2 JP11908194A JP11908194A JP3211561B2 JP 3211561 B2 JP3211561 B2 JP 3211561B2 JP 11908194 A JP11908194 A JP 11908194A JP 11908194 A JP11908194 A JP 11908194A JP 3211561 B2 JP3211561 B2 JP 3211561B2
Authority
JP
Japan
Prior art keywords
copper foil
laminate
resin
less
prepreg
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP11908194A
Other languages
Japanese (ja)
Other versions
JPH07323502A (en
Inventor
一彦 根本
智貴 森田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP11908194A priority Critical patent/JP3211561B2/en
Publication of JPH07323502A publication Critical patent/JPH07323502A/en
Application granted granted Critical
Publication of JP3211561B2 publication Critical patent/JP3211561B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Laminated Bodies (AREA)

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【産業上の利用分野】本発明は、電子機器、電気機器、
計算機器、通信機器等に用いられる片面銅箔張積層板の
製造方法に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to electronic equipment, electrical equipment,
The present invention relates to a method for manufacturing a single-sided copper foil-clad laminate used for computing equipment, communication equipment, and the like.

【0002】[0002]

【従来の技術】従来から、セルロース系の紙基材に樹脂
を含浸してなるプリプレグを複数枚積層し、その上面
、光沢面と粗化面とを備えた銅箔を、この銅箔の粗化
面を内向きに積層して積層体を形成し、この積層体を上
下からこの積層体よりも小さい金属プレートで挟み、さ
らに加熱加圧成形する片面銅箔張積層板の製造方法が行
われている。一般にこの種の片面銅箔張積層板の製造方
法では、上記金属プレートで挟んだ上記積層体を上下に
複数段積み重ねて同時に加熱加圧成形する多段式成形が
採用されている。上記の如き片面銅箔張積層板の製造方
法にあっては、加熱加圧成形時に、上段に配した上記積
層体のプリプレグ(又は銅箔)の、上記金属プレートか
らはみ出した周辺部が軟化して下段に配した積層体の銅
箔(又はプリプレグ)の周辺部の光沢面上に垂れ下が
り、この状態のままで溶融した樹脂が硬化する。加熱加
圧成形終了後は、得られた片面銅箔張積層板(以下積層
板と略す)を上段から順番に例えば吸着パッド等を用い
て持ち上げて、積層板と金属プレートとを分解してい
く。しかしながら、このとき、上記銅箔の光沢面と上記
樹脂との密着力が強いために、上段の積層板と下段の積
層板の周辺部が接着し、袋状となって上記金属プレート
を抱き抱えたまま持ち上がる。そのために、上記積層板
と金属プレートとを分解する作業を一時中断して、上段
の積層板と下段の積層板とを分離する人為的作業が必要
となり、生産性を低下させるという欠点があった。
2. Description of the Related Art Conventionally, a plurality of prepregs obtained by impregnating a resin into a cellulose-based paper base material are laminated,
, The copper foil having a shiny side and a roughened surface, a laminate formed by laminating a roughened surface of the copper foil inwardly, small metal plate than the laminate the laminate from above and below And a method for producing a single-sided copper foil-clad laminate that is sandwiched by heat and pressure-formed. In general, this type of single-sided copper foil-clad laminate manufacturing method employs multi-stage molding in which the laminate sandwiched between the metal plates is vertically stacked in plural stages and simultaneously heated and pressed. In the method for manufacturing a single-sided copper foil-clad laminate as described above, the peripheral portion of the prepreg (or copper foil) of the laminated body disposed on the upper stage, which protrudes from the metal plate, is softened during heating and pressing. The resin hangs down on the glossy surface of the periphery of the copper foil (or prepreg) of the laminated body disposed at the lower stage, and the molten resin is cured in this state. After the completion of the heat and pressure molding, the obtained single-sided copper foil-clad laminate (hereinafter abbreviated as a laminate) is lifted in order from the top using, for example, a suction pad or the like, and the laminate and the metal plate are disassembled. . However, at this time, since the adhesive force between the glossy surface of the copper foil and the resin is strong, the peripheral portions of the upper laminate and the lower laminate adhere to each other, forming a bag shape and holding the metal plate. Lift it up. Therefore, the work of disassembling the laminated plate and the metal plate is temporarily interrupted, and an artificial work of separating the upper laminated plate and the lower laminated plate is required, which has a disadvantage of reducing productivity. .

【0003】[0003]

【発明が解決しようとする課題】本発明は、上記の欠点
を解消するためになされたもので、その目的とするとこ
ろは、加熱加圧成形後に、得られた積層板と金属プレー
トとを分解する作業の効率を高めて、生産性を向上した
片面銅箔張積層板の製造方法を提供するものである。
SUMMARY OF THE INVENTION The present invention has been made in order to solve the above-mentioned drawbacks, and an object of the present invention is to disassemble a laminate and a metal plate obtained after heating and pressing. An object of the present invention is to provide a method for manufacturing a single-sided copper foil-clad laminate with improved productivity and improved productivity.

【0004】[0004]

【課題を解決するための手段】本発明の請求項1に係る
片面銅箔張積層板の製造方法は、セルロース系の紙基材
に樹脂を含浸してなるプリプレグを複数枚積層し、その
上面、光沢面と粗化面とを備えた銅箔を、この銅箔の
粗化面を内向きに積層して積層体を形成し、この積層体
を上下からこの積層体よりも小さい金属プレートで挟
み、さらに加熱加圧成形する片面銅箔張積層板の製造方
法において、上記銅箔の光沢面には、クロム、亜鉛の金
属で表面処理が施され、この光沢面におけるクロム存在
量が0.013mg/dm2 以下、亜鉛存在量が0.1
35mg/dm2 以下であり、且つ表面粗度の算術平均
粗さ(Ra)が0.35μm以下、最大高さ(Rma
x)が3.5μm以下であり、上記プリプレグの樹脂含
有量が50重量%以下であり、さらに、上記プリプレグ
に用いた樹脂が、フェノール樹脂組成物であることを特
徴とする。
According to a first aspect of the present invention, there is provided a method of manufacturing a single-sided copper foil-clad laminate, comprising: laminating a plurality of prepregs obtained by impregnating a cellulose-based paper base material with a resin; , the copper foil having a shiny side and a roughened surface, a laminate formed by laminating a roughened surface of the copper foil inwardly, small metal plate than the laminate the laminate from above and below In the method for producing a single-sided copper foil-clad laminate, which is sandwiched between and further heated and pressed, the glossy surface of the copper foil includes gold of chromium and zinc.
Chromium present on the glossy surface is 0.013 mg / dm 2 or less and zinc is 0.1
35 mg / dm 2 or less, the arithmetic average roughness (Ra) of the surface roughness is 0.35 μm or less, and the maximum height (Rma).
x) is Ri der less 3.5 [mu] m, the prepreg resin containing
Content is 50% by weight or less;
The resin used in the above is a phenol resin composition .

【0005】以下、本発明を詳細に説明する。本発明に
は、セルロース系の紙基材に樹脂を含浸して得たプリプ
レグが用いられる。上記紙基材としては、例えばクラフ
ト紙、リンター紙、その他クラフト紙又はリンター紙に
無機物或いは有機物を混入した紙基材を用いることがで
きる。
Hereinafter, the present invention will be described in detail. In the present invention, a prepreg obtained by impregnating a cellulose-based paper base material with a resin is used. As the paper base, for example, kraft paper, linter paper, or a paper base obtained by mixing inorganic or organic substances with kraft paper or linter paper can be used.

【0006】上記樹脂としては、例えば、フェノール樹
脂、クレゾール樹脂、ポリエステル樹脂、エポキシ樹脂
等の単独物、混合物、変性物等が用いられ、必要に応じ
てこれらの樹脂に硬化剤、硬化促進剤、難燃剤、有機或
いは無機の充填剤等の各種添加剤を配合して用いられる
ものである。
As the above resin, for example, a phenol resin, a cresol resin, a polyester resin, an epoxy resin, etc. alone, a mixture, a modified product or the like is used. If necessary, a curing agent, a curing accelerator, It is used by blending various additives such as a flame retardant and an organic or inorganic filler.

【0007】上記プリプレグは、上記樹脂を適当な溶剤
に溶解して調製した樹脂ワニスに、上記紙基材を含浸
し、乾燥して、不要となった溶剤を除去しつつ上記樹脂
をBステージ状態にして得られる。このとき、上記プリ
プレグの樹脂含有量は、50重量%以下にすることが望
ましい。上記プリプレグの樹脂含有量が多いと、加熱加
圧成形時に金属プレートの周辺から溶融して流れ出る上
記樹脂の量が多くなって、銅箔の光沢面への上記樹脂の
付着が発生しやすくなるためである。
[0007] The prepreg is prepared by impregnating a resin varnish prepared by dissolving the resin in an appropriate solvent with the paper base and drying the resin to remove the unnecessary solvent. Is obtained. At this time, the resin content of the prepreg is desirably 50% by weight or less. When the resin content of the prepreg is large, the amount of the resin that melts and flows out from the periphery of the metal plate at the time of heating and pressing is increased, and the adhesion of the resin to the glossy surface of the copper foil is likely to occur. It is.

【0008】本発明の片面銅箔張積層板の製造方法は、
上記プリプレグを複数枚積層し、その上面、光沢面と
粗化面とを備えた銅箔を、この銅箔の粗化面を内向きに
積層して積層体を形成する。この銅箔の粗化面とは、プ
リプレグ層との密着性を向上させるために表面を荒らし
て表面積を大きくした面であり、光沢面とは、上記粗化
面の如き処理を施していない、表面が滑らかで光沢のあ
る面である。
The method for producing a single-sided copper foil-clad laminate of the present invention comprises:
The prepreg laminating a plurality, on the upper surface thereof, a copper foil having a shiny side and a roughened surface, to form a laminate by laminating the roughened surface of the copper foil inwardly. The roughened surface of the copper foil is a surface having a large surface area by roughening the surface in order to improve the adhesion with the prepreg layer, and the glossy surface is not subjected to the treatment such as the roughened surface. The surface is smooth and shiny.

【0009】一般に、銅箔の光沢面には、酸化を防止
し、且つ半田とのなじみを良くするために、クロム、亜
鉛等の金属で表面処理が施されている。本発明において
は、上記銅箔の光沢面への上記樹脂の付着を防止するた
めに、上記銅箔として、上記光沢面におけるクロム存在
量(以下Cr量とする)が0.013mg/dm2 以下
で、且つ亜鉛存在量(以下Zn量とする)が0.135
mg/dm2 以下の表面処理を施したものが用いられ
る。上記銅箔の光沢面におけるCr量及びZn量をそれ
ぞれ上記の値以下にすると、上記銅箔の光沢面と上記樹
脂とのなじみ易さを低下させて、密着力を弱くすること
ができるものである。
In general, the glossy surface of a copper foil is subjected to a surface treatment with a metal such as chromium, zinc or the like in order to prevent oxidation and improve compatibility with solder. In the present invention, in order to prevent the resin from adhering to the glossy surface of the copper foil, the copper foil has a chromium abundance (hereinafter referred to as Cr amount) on the glossy surface of 0.013 mg / dm 2 or less. And the amount of zinc (hereinafter referred to as Zn amount) is 0.135
What has been subjected to a surface treatment of not more than mg / dm 2 is used. When the amount of Cr and the amount of Zn on the glossy surface of the copper foil are respectively equal to or less than the above values, the glossiness of the copper foil and the ease with which the resin is adapted can be reduced, and the adhesion can be reduced. is there.

【0010】さらに、本発明においては、上記銅箔の光
沢面への上記樹脂の付着を防止するために、上記銅箔と
して、光沢面の表面粗度を、JIS−B−0601にお
ける算術平均粗さ(Ra)が0.35μm以下、最大高
さ(Rmax)が3.5μm以下であるものを用いるこ
とを必須としている。すなわち、上記銅箔の光沢面滑ら
かさを高めることで、上記樹脂が付着しにくくなるもの
である。
Further, in the present invention, in order to prevent the resin from adhering to the glossy surface of the copper foil, the surface roughness of the glossy surface of the copper foil is determined by the arithmetic average roughness in JIS-B-0601. It is essential to use a material having a height (Ra) of 0.35 μm or less and a maximum height (Rmax) of 3.5 μm or less. That is, by increasing the smoothness of the glossy surface of the copper foil, the resin is less likely to adhere.

【0011】本発明の片面銅箔張積層板の製造方法は、
上記積層体を上下からこの積層体よりも小さい金属プレ
ートで挟み、これらを複数段積み重ねて加熱加圧成形し
て、片面銅箔張積層板を得ることができる。このとき、
上段に配した上記積層体のプリプレグの、上記金属プレ
ートからはみ出した周辺部が軟化して下段に配した積層
体の銅箔の周辺部の光沢面上に垂れ下がるり、この状態
のままで溶融した樹脂が硬化する。加熱加圧成形終了後
は、得られた片面銅箔張積層板(以下積層板と略す)を
上段から順番に例えば吸着パッド等を用いて持ち上げ
て、積層板と金属プレートとを分解していく。本発明に
あっては、上記樹脂と銅箔の光沢面との密着力が低減さ
れており、上段の積層板と下段の積層板の周辺部は上記
樹脂が付着することなく、上段の積層板を持ち上げると
下段の積層板が自重で容易に剥離して、上記積層板と金
属プレートとを分解する作業が滞ることなく効率よく行
える。
[0011] The method for producing a single-sided copper foil-clad laminate of the present invention comprises:
The laminated body is sandwiched from above and below by a metal plate smaller than the laminated body, these are stacked in a plurality of stages, and heated and pressed to obtain a single-sided copper foil-clad laminate. At this time,
The peripheral portion of the prepreg of the laminated body arranged in the upper stage, which protruded from the metal plate, softened and hanged down on the glossy surface of the peripheral portion of the copper foil of the laminated body arranged in the lower stage, or melted in this state The resin cures. After the completion of the heat and pressure molding, the obtained single-sided copper foil-clad laminate (hereinafter abbreviated as a laminate) is lifted in order from the top using, for example, a suction pad or the like, and the laminate and the metal plate are disassembled. . In the present invention, the adhesive strength between the resin and the glossy surface of the copper foil is reduced, and the peripheral portions of the upper laminate and the lower laminate do not adhere to the resin, and the upper laminate does not adhere. When the is lifted, the lower laminate is easily peeled off by its own weight, and the work of disassembling the laminate and the metal plate can be performed efficiently without delay.

【0012】[0012]

【実施例】以下、本発明を実施例に基づいて説明する。DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below with reference to embodiments.

【0013】 実施例1乃至3、比較例1乃至4に用いるプリプレグの
作製 メタクレゾール390g,桐油150g,37重量%の
ホルマリン45g、及び25重量%のアンモニア水18
mlをフラスコ内で混合し、温度100℃で60分間還
流後、脱水し、メタノール300gを投入して桐油変性
フェノール樹脂溶液を得た。さらに、上記溶液に、上記
桐油変性フェノール樹脂固形分に対して、難燃剤として
テトラブロムビスフェノールAを15重量%、及びトリ
クレジルフォスフェイトを5重量%添加し、エポキシ樹
脂(シエル化学株式会社製、エピコート1120−80
M)を4重量%添加して樹脂ワニスを得た。この樹脂ワ
ニスを単位重量117g/m2 のクラフト紙に含浸し乾
燥して、実施例1乃至3、比較例1乃至4それぞれにつ
いて、(表1)に示す如き樹脂含有量のプリプレグを作
製した。
Preparation of Prepreg Used in Examples 1 to 3 and Comparative Examples 1 to 4 390 g of metacresol, 150 g of tung oil, 45 g of 37% by weight formalin, and 25% by weight of aqueous ammonia 18
The mixture was refluxed at a temperature of 100 ° C. for 60 minutes, dehydrated, and charged with 300 g of methanol to obtain a tung oil-modified phenol resin solution. Further, to the above solution, 15% by weight of tetrabromobisphenol A and 5% by weight of tricresyl phosphate as flame retardants were added to the solid content of the tung oil-modified phenol resin, and an epoxy resin (manufactured by Ciel Chemical Co., Ltd.) was added. , Epicoat 1120-80
M) was added at 4% by weight to obtain a resin varnish. This resin varnish was impregnated into kraft paper having a unit weight of 117 g / m 2 and dried to prepare prepregs having resin contents as shown in (Table 1) for each of Examples 1 to 3 and Comparative Examples 1 to 4.

【0014】 実施例1乃至実施例3、及び比較例1乃至比較例4の積
層板の作製 実施例1乃至実施例3、及び比較例1乃至比較例4それ
ぞれについて、(表1)に示す如きプリプレグ及び銅箔
を用いて、積層板を作製した。すなわち、図1に示す如
く、プリプレグ(2)を8枚積層し、その上面に光沢面
と粗化面とを備えた銅箔(1)を、この銅箔(1)の粗
化面を内向きに積層して積層体(4)を形成し、この積
層体(4)を上下からこの積層体(4)よりも小さい金
属プレート(3)(3)で挟み、さらに成形プレス機に
て温度160℃、圧力120kg/cm2 、60分間の
条件で加熱加圧成形し、その後、冷却し解圧して積層板
を得た。得られた積層板を上段から順番に吸着パッドを
用いて持ち上げて、積層板と金属プレートとを分解し
た。このとき、実施例1乃至実施例3においては、上段
に配した積層板と下段に配した積層板とを容易に分離す
ることができたが、比較例1乃至比較例4においては、
上段に配した積層板と下段に配した積層板とがその周辺
部にて、硬化した樹脂が付着することによって接着した
ために、この接着部にへらを差し込んで剥離する人為的
作業を要した。結果を(表1)に示した。(表1)中
の、銅箔光沢面とプリプレグの付着の評価項目におい
て、「なし」とは、上段の積層板を吸着パッドで持ち上
げたとき、下段の積層板が自重で剥離したことであり、
「あり」とは、上段の積層板を吸着パッドで持ち上げた
とき、上段の積層板とともに下段の積層板が剥離せず持
ち上がったことを示す。
Production of Laminated Plates of Examples 1 to 3 and Comparative Examples 1 to 4 Each of Examples 1 to 3 and Comparative Examples 1 to 4 was as shown in (Table 1). A laminate was prepared using the prepreg and the copper foil. That is, as shown in FIG. 1, eight prepregs (2) are laminated, and a copper foil (1) having a glossy surface and a roughened surface on its upper surface is placed inside the roughened surface of the copper foil (1). The laminate (4) is formed by laminating in a direction, the laminate (4) is sandwiched from above and below by metal plates (3) and (3) smaller than the laminate (4), and the temperature is further increased by a molding press. It was heated and pressed under the conditions of 160 ° C., pressure of 120 kg / cm 2 and 60 minutes, then cooled and decompressed to obtain a laminate. The obtained laminate was lifted in order from the top using suction pads, and the laminate and the metal plate were disassembled. At this time, in Examples 1 to 3, the laminated plate arranged in the upper stage and the laminated plate arranged in the lower stage could be easily separated, but in Comparative Examples 1 to 4,
Since the laminated plate arranged in the upper stage and the laminated plate arranged in the lower stage adhered to each other at the peripheral portion thereof by adhesion of the cured resin, manual work was required to insert and insert a spatula into the adhesive portion. The results are shown in (Table 1). In the evaluation items of the adhesion between the glossy surface of the copper foil and the prepreg in (Table 1), "None" means that the lower laminate was peeled off by its own weight when the upper laminate was lifted by the suction pad. ,
“Present” indicates that when the upper laminate was lifted by the suction pad, the lower laminate together with the upper laminate was lifted without peeling.

【0015】[0015]

【表1】 [Table 1]

【0016】[0016]

【発明の効果】本発明片面銅箔張積層板の製造方法
は、セルロース系の紙基材に樹脂を含浸してなるプリプ
レグを複数枚積層し、その上面、光沢面と粗化面とを
備えた銅箔を、この銅箔の粗化面を内向きに積層して積
層体を形成し、この積層体を上下からこの積層体よりも
小さい金属プレートで挟み、さらに加熱加圧成形する積
層板の製造方法において、上記銅箔の光沢面におけるク
ロム存在量が0.013mg/dm2 以下、亜鉛存在量
が0.135mg/dm2 以下であり、且つ表面粗度の
算術平均粗さ(Ra)が0.35μm以下、最大高さ
(Rmax)が3.5μm以下である上記銅箔を用いる
ことによって、上記樹脂と銅箔の光沢面との密着力が低
減される。よって、加熱加圧成形する際に多段式成形を
採用して、積層板を製造しても、上段の積層板と下段の
積層板の周辺部は上記樹脂が付着することなく、上段の
積層板を持ち上げると下段の積層板が自重で容易に剥離
して、上記積層板と金属プレートとを分解する作業が滞
ることなく効率よく行える。故に、生産性が向上する。
According to the method for producing a single-sided copper foil-clad laminate of the present invention, a plurality of prepregs obtained by impregnating a resin with a cellulose-based paper base material are laminated, and a glossy surface and a roughened surface are formed on the upper surface. , A laminated body is formed by laminating the roughened surface of the copper foil inward, sandwiching the laminated body from above and below with a metal plate smaller than the laminated body, and further heat-press molding. In the method for producing a laminate, the chromium abundance on the glossy surface of the copper foil is 0.013 mg / dm 2 or less, the zinc abundance is 0.135 mg / dm 2 or less, and the arithmetic average roughness of the surface roughness ( By using the copper foil having Ra) of 0.35 μm or less and the maximum height (Rmax) of 3.5 μm or less, the adhesion between the resin and the glossy surface of the copper foil is reduced. Therefore, even if a laminated board is manufactured by adopting a multi-stage molding at the time of heat and pressure molding, the periphery of the upper laminated plate and the lower laminated plate does not adhere to the above resin, and the upper laminated plate is not attached. When the is lifted, the lower laminate is easily peeled off by its own weight, and the work of disassembling the laminate and the metal plate can be performed efficiently without delay. Therefore, productivity is improved.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の片面銅箔張積層板の製造方法の加熱加
圧成形時の構成を示す断面図である。
FIG. 1 is a cross-sectional view showing a configuration at the time of heat and pressure molding in a method for producing a single-sided copper foil-clad laminate of the present invention.

【符号の説明】[Explanation of symbols]

1 銅箔 2 プリプレグ 3 金属プレート 4 積層体 1 copper foil 2 prepreg 3 metal plate 4 laminate

───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 平5−299834(JP,A) 特開 平5−275817(JP,A) 特開 昭56−152299(JP,A) 特開 昭63−252777(JP,A) (58)調査した分野(Int.Cl.7,DB名) B32B 15/08 ────────────────────────────────────────────────── ─── Continuation of the front page (56) References JP-A-5-299834 (JP, A) JP-A-5-275817 (JP, A) JP-A-56-152299 (JP, A) JP-A-63- 252777 (JP, A) (58) Field surveyed (Int. Cl. 7 , DB name) B32B 15/08

Claims (1)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】 セルロース系の紙基材に樹脂を含浸して
なるプリプレグを複数枚積層し、その上面、光沢面と
粗化面とを備えた銅箔を、この銅箔の粗化面を内向きに
積層して積層体を形成し、この積層体を上下からこの積
層体よりも小さい金属プレートで挟み、さらに加熱加圧
成形する片面銅箔張積層板の製造方法において、上記銅
箔の光沢面には、クロム、亜鉛の金属で表面処理が施さ
れ、この光沢面におけるクロム存在量が0.013mg
/dm2 以下、亜鉛存在量が0.135mg/dm2
下であり、且つ表面粗度の算術平均粗さ(Ra)が0.
35μm以下、最大高さ(Rmax)が3.5μm以下
であり、上記プリプレグの樹脂含有量が50重量%以下
であり、さらに、上記プリプレグに用いた樹脂が、フェ
ノール樹脂組成物であることを特徴とする片面銅箔張積
層板の製造方法。
A prepreg obtained by impregnating a resin with a cellulose-based paper base material is laminated on a plurality of layers, and a copper foil having a glossy surface and a roughened surface on an upper surface thereof is formed on the roughened surface of the copper foil. Are laminated inward to form a laminate, and the laminate is sandwiched between metal plates smaller than the laminate from above and below, and further heated and pressed to form a single-sided copper foil-clad laminate. The glossy surface is surface treated with chrome and zinc metal
The chromium abundance on this glossy surface is 0.013 mg
/ Dm 2 or less, the amount of zinc present is 0.135 mg / dm 2 or less, and the arithmetic average roughness (Ra) of the surface roughness is 0.
35μm or less and a maximum height (Rmax) is Ri der less 3.5 [mu] m, the resin content of the prepreg is 50 wt% or less
Further, the resin used in the prepreg is
A method for producing a single-sided copper foil-clad laminate , which is a knol resin composition .
JP11908194A 1994-05-31 1994-05-31 Manufacturing method of single-sided copper foil clad laminate Expired - Fee Related JP3211561B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11908194A JP3211561B2 (en) 1994-05-31 1994-05-31 Manufacturing method of single-sided copper foil clad laminate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11908194A JP3211561B2 (en) 1994-05-31 1994-05-31 Manufacturing method of single-sided copper foil clad laminate

Publications (2)

Publication Number Publication Date
JPH07323502A JPH07323502A (en) 1995-12-12
JP3211561B2 true JP3211561B2 (en) 2001-09-25

Family

ID=14752415

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11908194A Expired - Fee Related JP3211561B2 (en) 1994-05-31 1994-05-31 Manufacturing method of single-sided copper foil clad laminate

Country Status (1)

Country Link
JP (1) JP3211561B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6368764B2 (en) 1999-12-22 2002-04-09 Minolta Co., Ltd. Photosensitive member for electrophotography

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6368764B2 (en) 1999-12-22 2002-04-09 Minolta Co., Ltd. Photosensitive member for electrophotography

Also Published As

Publication number Publication date
JPH07323502A (en) 1995-12-12

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