JPS6158260A - 基板の冷却装置 - Google Patents

基板の冷却装置

Info

Publication number
JPS6158260A
JPS6158260A JP59178433A JP17843384A JPS6158260A JP S6158260 A JPS6158260 A JP S6158260A JP 59178433 A JP59178433 A JP 59178433A JP 17843384 A JP17843384 A JP 17843384A JP S6158260 A JPS6158260 A JP S6158260A
Authority
JP
Japan
Prior art keywords
substrate
substrate holder
heat conductive
holder
cover
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59178433A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0228247B2 (enExample
Inventor
Muneharu Komiya
小宮　宗治
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ulvac Inc
Original Assignee
Ulvac Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ulvac Inc filed Critical Ulvac Inc
Priority to JP59178433A priority Critical patent/JPS6158260A/ja
Publication of JPS6158260A publication Critical patent/JPS6158260A/ja
Publication of JPH0228247B2 publication Critical patent/JPH0228247B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67103—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP59178433A 1984-08-29 1984-08-29 基板の冷却装置 Granted JPS6158260A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59178433A JPS6158260A (ja) 1984-08-29 1984-08-29 基板の冷却装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59178433A JPS6158260A (ja) 1984-08-29 1984-08-29 基板の冷却装置

Publications (2)

Publication Number Publication Date
JPS6158260A true JPS6158260A (ja) 1986-03-25
JPH0228247B2 JPH0228247B2 (enExample) 1990-06-22

Family

ID=16048424

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59178433A Granted JPS6158260A (ja) 1984-08-29 1984-08-29 基板の冷却装置

Country Status (1)

Country Link
JP (1) JPS6158260A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62201936U (enExample) * 1986-06-16 1987-12-23
US5685363A (en) * 1994-12-08 1997-11-11 Nissin Electric Co., Ltd. Substrate holding device and manufacturing method therefor

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62201936U (enExample) * 1986-06-16 1987-12-23
US5685363A (en) * 1994-12-08 1997-11-11 Nissin Electric Co., Ltd. Substrate holding device and manufacturing method therefor
EP0716441A3 (en) * 1994-12-08 1998-02-25 Nissin Electric Company, Limited Substrate holding device and manufacturing method therefor

Also Published As

Publication number Publication date
JPH0228247B2 (enExample) 1990-06-22

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