JPS6157555U - - Google Patents

Info

Publication number
JPS6157555U
JPS6157555U JP1984143239U JP14323984U JPS6157555U JP S6157555 U JPS6157555 U JP S6157555U JP 1984143239 U JP1984143239 U JP 1984143239U JP 14323984 U JP14323984 U JP 14323984U JP S6157555 U JPS6157555 U JP S6157555U
Authority
JP
Japan
Prior art keywords
board
electronic component
component mounting
electronic components
mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1984143239U
Other languages
English (en)
Japanese (ja)
Other versions
JPH039341Y2 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1984143239U priority Critical patent/JPH039341Y2/ja
Publication of JPS6157555U publication Critical patent/JPS6157555U/ja
Application granted granted Critical
Publication of JPH039341Y2 publication Critical patent/JPH039341Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP1984143239U 1984-09-20 1984-09-20 Expired JPH039341Y2 (https=)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984143239U JPH039341Y2 (https=) 1984-09-20 1984-09-20

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984143239U JPH039341Y2 (https=) 1984-09-20 1984-09-20

Publications (2)

Publication Number Publication Date
JPS6157555U true JPS6157555U (https=) 1986-04-17
JPH039341Y2 JPH039341Y2 (https=) 1991-03-08

Family

ID=30701541

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984143239U Expired JPH039341Y2 (https=) 1984-09-20 1984-09-20

Country Status (1)

Country Link
JP (1) JPH039341Y2 (https=)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50143072A (https=) * 1974-05-08 1975-11-18
JPS5593286A (en) * 1979-01-10 1980-07-15 Hitachi Ltd Electronic circuit and method of fabricating same

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50143072A (https=) * 1974-05-08 1975-11-18
JPS5593286A (en) * 1979-01-10 1980-07-15 Hitachi Ltd Electronic circuit and method of fabricating same

Also Published As

Publication number Publication date
JPH039341Y2 (https=) 1991-03-08

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