JPS61199052U - - Google Patents
Info
- Publication number
- JPS61199052U JPS61199052U JP1985082300U JP8230085U JPS61199052U JP S61199052 U JPS61199052 U JP S61199052U JP 1985082300 U JP1985082300 U JP 1985082300U JP 8230085 U JP8230085 U JP 8230085U JP S61199052 U JPS61199052 U JP S61199052U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- cap
- plate frame
- semiconductor element
- concave groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985082300U JPH0334909Y2 (https=) | 1985-05-31 | 1985-05-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985082300U JPH0334909Y2 (https=) | 1985-05-31 | 1985-05-31 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61199052U true JPS61199052U (https=) | 1986-12-12 |
| JPH0334909Y2 JPH0334909Y2 (https=) | 1991-07-24 |
Family
ID=30629893
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985082300U Expired JPH0334909Y2 (https=) | 1985-05-31 | 1985-05-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0334909Y2 (https=) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011146451A (ja) * | 2010-01-13 | 2011-07-28 | Fujitsu Ltd | 電子装置及びその製造方法 |
| JP2012054025A (ja) * | 2010-08-31 | 2012-03-15 | Hitachi Vehicle Energy Ltd | 部品実装基板 |
| JP2018110263A (ja) * | 2016-08-10 | 2018-07-12 | 京セラ株式会社 | 電気素子搭載用パッケージ、アレイ型パッケージおよび電気装置 |
-
1985
- 1985-05-31 JP JP1985082300U patent/JPH0334909Y2/ja not_active Expired
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011146451A (ja) * | 2010-01-13 | 2011-07-28 | Fujitsu Ltd | 電子装置及びその製造方法 |
| JP2012054025A (ja) * | 2010-08-31 | 2012-03-15 | Hitachi Vehicle Energy Ltd | 部品実装基板 |
| JP2018110263A (ja) * | 2016-08-10 | 2018-07-12 | 京セラ株式会社 | 電気素子搭載用パッケージ、アレイ型パッケージおよび電気装置 |
| JP2018110262A (ja) * | 2016-08-10 | 2018-07-12 | 京セラ株式会社 | 電気素子搭載用パッケージ、アレイ型パッケージおよび電気装置 |
| US11784459B2 (en) | 2016-08-10 | 2023-10-10 | Kyocera Corporation | Electrical element mounting package, array package, and electrical device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0334909Y2 (https=) | 1991-07-24 |