JPS6154654A - 液冷装置 - Google Patents

液冷装置

Info

Publication number
JPS6154654A
JPS6154654A JP17670884A JP17670884A JPS6154654A JP S6154654 A JPS6154654 A JP S6154654A JP 17670884 A JP17670884 A JP 17670884A JP 17670884 A JP17670884 A JP 17670884A JP S6154654 A JPS6154654 A JP S6154654A
Authority
JP
Japan
Prior art keywords
cooling
liquid
pipe
cooling liquid
boiling point
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP17670884A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0317222B2 (enrdf_load_stackoverflow
Inventor
Kishio Yokouchi
貴志男 横内
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP17670884A priority Critical patent/JPS6154654A/ja
Publication of JPS6154654A publication Critical patent/JPS6154654A/ja
Publication of JPH0317222B2 publication Critical patent/JPH0317222B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP17670884A 1984-08-27 1984-08-27 液冷装置 Granted JPS6154654A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17670884A JPS6154654A (ja) 1984-08-27 1984-08-27 液冷装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17670884A JPS6154654A (ja) 1984-08-27 1984-08-27 液冷装置

Publications (2)

Publication Number Publication Date
JPS6154654A true JPS6154654A (ja) 1986-03-18
JPH0317222B2 JPH0317222B2 (enrdf_load_stackoverflow) 1991-03-07

Family

ID=16018364

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17670884A Granted JPS6154654A (ja) 1984-08-27 1984-08-27 液冷装置

Country Status (1)

Country Link
JP (1) JPS6154654A (enrdf_load_stackoverflow)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005284138A (ja) * 2004-03-30 2005-10-13 Seiko Epson Corp 光学装置およびプロジェクタ
WO2007102498A1 (ja) 2006-03-06 2007-09-13 Tokyo University Of Science Educational Foundation Administrative Organization 沸騰冷却方法、沸騰冷却装置および流路構造体並びにその応用製品
US8061414B2 (en) 2004-12-22 2011-11-22 Tokyo University Of Science Educational Foundation Administrative Organization Boil cooling method, boil cooling apparatus, flow channel structure, and applied technology field thereof
WO2016075838A1 (ja) * 2014-11-14 2016-05-19 株式会社ＥｘａＳｃａｌｅｒ 電子機器の冷却システム、及び冷却方法
WO2017037860A1 (ja) * 2015-08-31 2017-03-09 株式会社ＥｘａＳｃａｌｅｒ 電子機器の冷却システム
US9653380B2 (en) 2015-05-26 2017-05-16 Fujitsu Limited Method for manufacturing component built-in substrate
US20180092243A1 (en) * 2015-03-30 2018-03-29 Exascaler Inc. Electronic-device cooling system

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005284138A (ja) * 2004-03-30 2005-10-13 Seiko Epson Corp 光学装置およびプロジェクタ
US8061414B2 (en) 2004-12-22 2011-11-22 Tokyo University Of Science Educational Foundation Administrative Organization Boil cooling method, boil cooling apparatus, flow channel structure, and applied technology field thereof
WO2007102498A1 (ja) 2006-03-06 2007-09-13 Tokyo University Of Science Educational Foundation Administrative Organization 沸騰冷却方法、沸騰冷却装置および流路構造体並びにその応用製品
WO2016075838A1 (ja) * 2014-11-14 2016-05-19 株式会社ＥｘａＳｃａｌｅｒ 電子機器の冷却システム、及び冷却方法
JPWO2016075838A1 (ja) * 2014-11-14 2017-10-19 株式会社ＥｘａＳｃａｌｅｒ 電子機器の冷却システム、及び冷却方法
US20170332514A1 (en) * 2014-11-14 2017-11-16 Exascaler Inc. Cooling system and cooling method for electronic equipment
US20180092243A1 (en) * 2015-03-30 2018-03-29 Exascaler Inc. Electronic-device cooling system
US10123454B2 (en) * 2015-03-30 2018-11-06 Exascaler Inc. Electronic-device cooling system
US9653380B2 (en) 2015-05-26 2017-05-16 Fujitsu Limited Method for manufacturing component built-in substrate
WO2017037860A1 (ja) * 2015-08-31 2017-03-09 株式会社ＥｘａＳｃａｌｅｒ 電子機器の冷却システム
CN107924896A (zh) * 2015-08-31 2018-04-17 株式会社ＥｘａＳｃａｌｅｒ 电子设备的冷却系统
CN107924896B (zh) * 2015-08-31 2021-07-23 株式会社ＥｘａＳｃａｌｅｒ 电子设备的冷却系统

Also Published As

Publication number Publication date
JPH0317222B2 (enrdf_load_stackoverflow) 1991-03-07

Similar Documents

Publication Publication Date Title
US10517191B2 (en) Liquid immersion server
US10888032B2 (en) Apparatus for liquid immersion cooling, system for liquid immersion cooling, and method of cooling electronic device
US6193905B1 (en) Immersion cooling coolant
JP6278071B2 (ja) 電子機器の液浸槽
JPWO2012025981A1 (ja) 冷却機器、冷却機器を有する電子機器及び発熱体の冷却方法
KR20100045376A (ko) 액체 냉각식 전자 장치 패키지용 개방 흐름 냉각판
CN214592559U (zh) 浸没式冷却系统
US20070107441A1 (en) Heat-dissipating unit and related liquid cooling module
JPS6154654A (ja) 液冷装置
TWI837731B (zh) 流體浸沒式冷卻系統及冷卻電子系統的方法
JPH02114597A (ja) 電子素子の冷却方法
JPH04147657A (ja) 電子部品冷却機構
JP5860728B2 (ja) 電子機器の冷却システム
JP2828996B2 (ja) 半導体の冷却装置
JP6244066B1 (ja) 冷却システム
JPS59232448A (ja) 液冷容器
CN219225465U (zh) 两相浸没式冷却装置与系统
JPH0442931Y2 (enrdf_load_stackoverflow)
JPS6285448A (ja) 半導体装置の冷却構造
JPS61131553A (ja) 浸漬液冷装置
JP3355726B2 (ja) 沸騰冷却装置
JPS61128598A (ja) 冷却装置
JPH0278256A (ja) 浸漬冷却モジュール
JPH03224256A (ja) 電子機器の冷却装置
TW202420926A (zh) 電子裝置