JPS6153427B2 - - Google Patents
Info
- Publication number
- JPS6153427B2 JPS6153427B2 JP57102260A JP10226082A JPS6153427B2 JP S6153427 B2 JPS6153427 B2 JP S6153427B2 JP 57102260 A JP57102260 A JP 57102260A JP 10226082 A JP10226082 A JP 10226082A JP S6153427 B2 JPS6153427 B2 JP S6153427B2
- Authority
- JP
- Japan
- Prior art keywords
- target
- magnet
- shield
- sputtering
- magnetic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000002184 metal Substances 0.000 claims description 27
- 229910052751 metal Inorganic materials 0.000 claims description 27
- 238000004544 sputter deposition Methods 0.000 claims description 24
- 230000005291 magnetic effect Effects 0.000 claims description 16
- 239000000463 material Substances 0.000 claims description 8
- 239000000498 cooling water Substances 0.000 claims description 7
- 239000000696 magnetic material Substances 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 6
- 239000010409 thin film Substances 0.000 claims 1
- 239000003302 ferromagnetic material Substances 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- BGPVFRJUHWVFKM-UHFFFAOYSA-N N1=C2C=CC=CC2=[N+]([O-])C1(CC1)CCC21N=C1C=CC=CC1=[N+]2[O-] Chemical compound N1=C2C=CC=CC2=[N+]([O-])C1(CC1)CCC21N=C1C=CC=CC1=[N+]2[O-] BGPVFRJUHWVFKM-UHFFFAOYSA-N 0.000 description 1
- 241000220317 Rosa Species 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229910000889 permalloy Inorganic materials 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 239000013077 target material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3414—Targets
- H01J37/3426—Material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
- H01J37/3405—Magnetron sputtering
- H01J37/3408—Planar magnetron sputtering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3488—Constructional details of particle beam apparatus not otherwise provided for, e.g. arrangement, mounting, housing, environment; special provisions for cleaning or maintenance of the apparatus
- H01J37/3497—Temperature of target
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Electrodes Of Semiconductors (AREA)
- Thin Magnetic Films (AREA)
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57102260A JPS58221275A (ja) | 1982-06-16 | 1982-06-16 | スパツタリング装置 |
US06/439,044 US4405436A (en) | 1982-06-16 | 1982-11-04 | Sputtering apparatus |
GB08231830A GB2110719B (en) | 1981-11-30 | 1982-11-08 | Sputtering apparatus |
FR8219696A FR2517330B1 (fr) | 1981-11-30 | 1982-11-24 | Appareil de projection de metal sur un substrat, en particulier du type a magnetron |
DE19823244691 DE3244691C3 (de) | 1981-11-30 | 1982-11-30 | Magnetron-Kathodenzerstäubungs-Anlage |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57102260A JPS58221275A (ja) | 1982-06-16 | 1982-06-16 | スパツタリング装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS58221275A JPS58221275A (ja) | 1983-12-22 |
JPS6153427B2 true JPS6153427B2 (US06272168-20010807-M00014.png) | 1986-11-18 |
Family
ID=14322619
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP57102260A Granted JPS58221275A (ja) | 1981-11-30 | 1982-06-16 | スパツタリング装置 |
Country Status (2)
Country | Link |
---|---|
US (1) | US4405436A (US06272168-20010807-M00014.png) |
JP (1) | JPS58221275A (US06272168-20010807-M00014.png) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH029630U (US06272168-20010807-M00014.png) * | 1988-06-28 | 1990-01-22 |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4684454A (en) * | 1983-05-17 | 1987-08-04 | Minnesota Mining And Manufacturing Company | Sputtering process for making magneto optic alloy |
DE3331406A1 (de) * | 1983-08-31 | 1985-03-14 | Leybold-Heraeus GmbH, 5000 Köln | Zerstaeubungskatode |
US4597847A (en) * | 1984-10-09 | 1986-07-01 | Iodep, Inc. | Non-magnetic sputtering target |
US5215639A (en) * | 1984-10-09 | 1993-06-01 | Genus, Inc. | Composite sputtering target structures and process for producing such structures |
JP2602807B2 (ja) * | 1985-09-27 | 1997-04-23 | 株式会社島津製作所 | スパツタ用ターゲツトアセンブリ |
JPH0689446B2 (ja) * | 1988-12-19 | 1994-11-09 | 株式会社日立製作所 | 薄膜形成装置 |
DE4042286C1 (US06272168-20010807-M00014.png) * | 1990-12-31 | 1992-02-06 | Leybold Ag, 6450 Hanau, De | |
DE4135939A1 (de) * | 1991-10-31 | 1993-05-06 | Leybold Ag, 6450 Hanau, De | Zerstaeubungskathode |
US6199259B1 (en) | 1993-11-24 | 2001-03-13 | Applied Komatsu Technology, Inc. | Autoclave bonding of sputtering target assembly |
US5433835B1 (en) * | 1993-11-24 | 1997-05-20 | Applied Materials Inc | Sputtering device and target with cover to hold cooling fluid |
US5487822A (en) * | 1993-11-24 | 1996-01-30 | Applied Materials, Inc. | Integrated sputtering target assembly |
DE19535894A1 (de) * | 1995-09-27 | 1997-04-03 | Leybold Materials Gmbh | Target für die Sputterkathode einer Vakuumbeschichtungsanlage und Verfahren zu seiner Herstellung |
DE19540543A1 (de) * | 1995-10-31 | 1997-05-07 | Leybold Ag | Vorrichtung zum Beschichten eines Substrats mit Hilfe des Chemical-Vapor-Deposition-Verfahrens |
US5985115A (en) * | 1997-04-11 | 1999-11-16 | Novellus Systems, Inc. | Internally cooled target assembly for magnetron sputtering |
DE19754986C2 (de) * | 1997-12-11 | 2002-09-12 | Leybold Systems Gmbh | Sputterkathode |
US6340415B1 (en) | 1998-01-05 | 2002-01-22 | Applied Materials, Inc. | Method and apparatus for enhancing a sputtering target's lifetime |
GB0126721D0 (en) * | 2001-11-07 | 2002-01-02 | Bellido Gonzalez V | Ferromagnetic magnetron |
US20040055883A1 (en) * | 2002-03-02 | 2004-03-25 | Shinzo Onishi | Magnetron sputtering target for non-magnetic materials |
DE102004035335A1 (de) * | 2004-07-21 | 2006-02-16 | Schott Ag | Reinraumfähige Beschichtungsanlage |
JP5853487B2 (ja) * | 2010-08-19 | 2016-02-09 | 東レ株式会社 | 放電電極及び放電方法 |
CN111996505B (zh) * | 2020-07-10 | 2023-07-14 | 包头稀土研究院 | 磁控溅射铁磁性靶材的装置 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3117065A (en) * | 1959-09-02 | 1964-01-07 | Magnetic Film And Tape Company | Method and apparatus for making magnetic recording tape |
SU411037A1 (ru) * | 1971-10-28 | 1974-08-05 | В. М. Гол ЯНОВ , А. П. Демидов | Способ получения искусственных алмазов |
US3838031A (en) * | 1972-09-15 | 1974-09-24 | A Snaper | Means and method for depositing recrystallized ferroelectric material |
HU179482B (en) * | 1979-02-19 | 1982-10-28 | Mikroelektronikai Valalat | Penning pulverizel source |
US4299678A (en) * | 1979-07-23 | 1981-11-10 | Spin Physics, Inc. | Magnetic target plate for use in magnetron sputtering of magnetic films |
US4324631A (en) * | 1979-07-23 | 1982-04-13 | Spin Physics, Inc. | Magnetron sputtering of magnetic materials |
JPS5952957B2 (ja) * | 1980-06-16 | 1984-12-22 | 日電アネルバ株式会社 | マグネトロン型スパッタ装置のカソ−ド部 |
-
1982
- 1982-06-16 JP JP57102260A patent/JPS58221275A/ja active Granted
- 1982-11-04 US US06/439,044 patent/US4405436A/en not_active Expired - Lifetime
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH029630U (US06272168-20010807-M00014.png) * | 1988-06-28 | 1990-01-22 |
Also Published As
Publication number | Publication date |
---|---|
US4405436A (en) | 1983-09-20 |
JPS58221275A (ja) | 1983-12-22 |
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