JPS6151751U - - Google Patents
Info
- Publication number
- JPS6151751U JPS6151751U JP13571784U JP13571784U JPS6151751U JP S6151751 U JPS6151751 U JP S6151751U JP 13571784 U JP13571784 U JP 13571784U JP 13571784 U JP13571784 U JP 13571784U JP S6151751 U JPS6151751 U JP S6151751U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- semiconductor device
- bending
- roller
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- 238000005452 bending Methods 0.000 claims 2
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案の一実施例を示す断面図、第２
図ａ，ｂは従来装置を示す断面図である。 ２…樹脂封止型半導体装置、２ａ…リード、４
…ローラ。
図ａ，ｂは従来装置を示す断面図である。 ２…樹脂封止型半導体装置、２ａ…リード、４
…ローラ。
Claims (1)
- 樹脂封止型半導体装置のリードの曲げ加工を行
う半導体リードホーミング機において、前記半導
体装置のリードに当接させる型の曲げ加工面にロ
ーラを備えたことを特徴とする半導体リードホー
ミング機。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13571784U JPS6151751U (ja) | 1984-09-07 | 1984-09-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13571784U JPS6151751U (ja) | 1984-09-07 | 1984-09-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6151751U true JPS6151751U (ja) | 1986-04-07 |
Family
ID=30694199
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13571784U Pending JPS6151751U (ja) | 1984-09-07 | 1984-09-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6151751U (ja) |
-
1984
- 1984-09-07 JP JP13571784U patent/JPS6151751U/ja active Pending