JPS6151309A - Method of dividing wiring board - Google Patents
Method of dividing wiring boardInfo
- Publication number
- JPS6151309A JPS6151309A JP17267684A JP17267684A JPS6151309A JP S6151309 A JPS6151309 A JP S6151309A JP 17267684 A JP17267684 A JP 17267684A JP 17267684 A JP17267684 A JP 17267684A JP S6151309 A JPS6151309 A JP S6151309A
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- dividing
- groove
- divided
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Devices For Post-Treatments, Processing, Supply, Discharge, And Other Processes (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明はセラミック配線板などの配線板の分割法に関す
る。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a method for dividing wiring boards such as ceramic wiring boards.
（従来技術とその問題点） 従来９例えば多数個数９のセラミック基板に。(Prior art and its problems) Conventional 9 For example, for a large number of 9 ceramic substrates.
はんだを付着せしめたセラミック配線板をスリットの部
分から分割する方法としてセラミック配線板を手で持っ
て分割する方法、ペンチなどでセラミック配線板を挾ん
で分割する方法がある。There are two methods for dividing a ceramic wiring board to which solder is adhered from the slits: holding the ceramic wiring board by hand and dividing it by holding the ceramic wiring board with pliers.
しかしこれらの方法では量産性に劣り、コスト高になる
欠点がある。However, these methods have disadvantages of poor mass productivity and high costs.
この対策として９例えば第４図に示すような方法がある
が、この方法では多数個取シのセラミック基板１の導体
パターン３上にはんだ４を付着せしめると分割治具６の
溝２に挿入した場合、ガタが生じこの状態でＡ方向に力
を加えてスリット５０部分から分割すると分割面に第５
図に示すようなばシフやかけ８が発生する。溝２の幅は
、はんだ４が最も厚いときでも使用可能なように設定し
て製作したものであるため、はんだ４の厚みが極端に薄
いような場合は、セラミック配線板の裏面９が溝の上端
面１０に斜めになって接するためばシフやかけ８の不良
率がさらに増加する。ばシの場合は研磨すれば再使用す
ることができるが、研磨するには手間がかかる問題があ
る。またかけが発生した場合はそのものは再使用できな
いという欠点がある。なお第５図において１１は分割さ
れたセラミック配線板である。As a countermeasure against this problem, there is a method as shown in FIG. If the slit 50 part is divided by applying force in the A direction in this state, there will be play, and the fifth
As shown in the figure, shifts and gaps 8 occur. The width of the groove 2 is set so that it can be used even when the solder 4 is at its thickest. Therefore, if the thickness of the solder 4 is extremely thin, the back side 9 of the ceramic wiring board should be placed in the groove. If it comes into contact with the upper end surface 10 obliquely, the defective rate of the sifting and bulging 8 will further increase. In the case of bashi, it can be reused by polishing it, but there is a problem in that polishing is time-consuming. Another drawback is that if it breaks, it cannot be reused. In FIG. 5, numeral 11 indicates a divided ceramic wiring board.
（発明の目的） ′
本発明は上記の問題のない配線板の分割法を提供するこ
とを目的とするものである。(Object of the Invention) The object of the present invention is to provide a method for dividing a wiring board without the above-mentioned problems.
（問題点を解決するだめの手段）
本発明者らは上記の欠点について種々検討した結果、絶
縁基板の表面に導体パターンを形成し。(Means for Solving the Problem) As a result of various studies on the above-mentioned drawbacks, the inventors formed a conductor pattern on the surface of an insulating substrate.
さらにその上面にはんだを付着せしめて配線板とし、こ
の配線板を溝の底面部分で２分割し、かつ分割面を分離
した状態のときの分割治具の溝の中にスリット部分の筒
さまで挿入し１次いで溝の側面に形成したくぼみ又は穴
に導体パターンおよびその上面に付着せしめたはんだの
部分を嵌合させると共に分割治具の分割面を合致させ、
その後溝の上端面でスリットの部分から分割したところ
ばシやかけが発生しないことを確認した。Further, solder is attached to the top surface to form a wiring board, this wiring board is divided into two at the bottom of the groove, and when the divided surfaces are separated, it is inserted into the groove of the dividing jig between the cylinders of the slit part. 1. Next, fit the conductor pattern and the solder portion attached to the top surface of the conductor pattern into the recess or hole formed on the side surface of the groove, and match the dividing surfaces of the dividing jig.
Thereafter, when the groove was divided from the slit portion at the upper end surface, it was confirmed that no staining or chipping occurred.
本発明は分割治具の溝の端面でスリットの部分から分割
する配線板の分割法において、絶縁基板の表面に導体パ
ターンを形成し、さらにその上面にはんだを付着せしめ
て配線板とし、この配線板を溝の底面部分で２分割し、
かつ分割面を分離した状態のときの分割治具の溝の中に
スリットの部分の高さまで挿入し１次いで溝の側面に形
成したくぼみ又は穴に導体パターンおよびその上面に付
着せしめたはんだの部分を嵌合させると共に左右の分割
治具の分割面を合致させ、その後溝の上端面でスリット
の部分から分割する配線板の分割法に関する。The present invention is a wiring board dividing method in which the wiring board is divided from the slit portion at the end face of the groove of a dividing jig, in which a conductive pattern is formed on the surface of an insulating substrate, and solder is further adhered to the upper surface of the wiring board to form a wiring board. Divide the board into two at the bottom of the groove,
Insert into the groove of the dividing jig up to the height of the slit part when the dividing surfaces are separated, and then attach the conductor pattern to the recess or hole formed on the side surface of the groove and the solder part to the upper surface of the conductor pattern. This invention relates to a wiring board dividing method in which the dividing surfaces of the left and right dividing jigs are fitted together, and then the wiring board is divided from the slit portion at the upper end surface of the groove.
なお本発明において分割治具を２分割する箇所は溝の底
面であれば中央部に設けてもよく又は端に設けてもよく
特に制限はない。In the present invention, there is no particular restriction on the location where the dividing jig is divided into two parts, as long as it is on the bottom surface of the groove, it may be provided in the center or at the ends.
左右の分割治具の分割面を合致させる方法としては９例
えば分割治具の両端を手で押圧して合致させるか、左右
の分割治具をバネの作用で押圧して合致させるなどの方
法があるが９本発明ではこれらの方法に限定するもので
はない。There are 9 methods for matching the dividing surfaces of the left and right dividing jigs, such as pressing both ends of the dividing jigs by hand to make them match, or pressing the left and right dividing jigs with the action of a spring to make them match. However, the present invention is not limited to these methods.
く両側面に形成してもよく特に制限はない。It may be formed on both sides without any particular limitation.
（実施例） 以下図面を引用して本発明の詳細な説明する。(Example) The present invention will be described in detail below with reference to the drawings.
第１図は本発明の一実施例になるセラミック配線板の分
割法を示す断面側面図および第２図は本発明の他の一実
施例になるセラミック配線板の分割法を示す断面側面図
である。FIG. 1 is a cross-sectional side view showing a method of dividing a ceramic wiring board according to an embodiment of the present invention, and FIG. 2 is a cross-sectional side view showing a method of dividing a ceramic wiring board according to another embodiment of the present invention. be.
１は多数個取りのセラミック基板で９分割を必要とする
箇所にスリット５が形成され、かつ表面には導体パター
ン３を形成し、さらにその上面にはんだ４を付着せしめ
てセラミック配線板とした。Reference numeral 1 is a multi-chip ceramic substrate in which slits 5 are formed at locations requiring nine divisions, a conductive pattern 3 is formed on the surface, and a solder 4 is adhered to the upper surface to obtain a ceramic wiring board.
次に溝２の底面部分１６で２分割し、かつ分割面を分離
した状態のときの分割治具１２又は１４の溝２の中に前
記のセラミック配線板をスリット５の部分の高さまで挿
入し２次いで溝２の側面に形成したくぼみ１３又は１５
に導体パターン３およびはんだ４の部分を嵌合させると
共に左右の分割治具１２又は１４の両端を手で押圧して
分割治具１２又は１４の分割面を合致させた。Next, the groove 2 is divided into two parts at the bottom part 16, and the ceramic wiring board is inserted into the groove 2 of the dividing jig 12 or 14 up to the height of the slit 5 when the divided surfaces are separated. 2. Next, a recess 13 or 15 formed on the side surface of the groove 2.
The conductive pattern 3 and the solder 4 were fitted together, and both ends of the left and right dividing jigs 12 or 14 were pressed by hand to match the dividing surfaces of the dividing jigs 12 or 14.
この後セラミック配線板を、Ａ方向に力を加えて溝の上
端面１０でスリット５の部分を分割した。Thereafter, force was applied to the ceramic wiring board in the direction A to divide the slit 5 at the upper end surface 10 of the groove.
分割面を観察したところばりやかけの発生は見られなか
った。When the split surface was observed, no burrs or chips were observed.
（発明の効果）
本発明は分割治具の溝の端面でスリットの部分から分割
する配線板の分割法において、絶縁基板の表面に導体パ
ターンを形成し、さらにその上面にはんだを付着せしめ
て配線板とし、この配線板を溝の底面部分で２分割し、
かつ分割面を分離した状態のときの分割治具の溝の中に
スリットの部分の高さまで挿入し９次いで溝の側面に形
成したくぼみ又は穴に導体パターンおよびその上面に付
着せしめたはんだの部分を嵌合させると共に左右の分割
治具の分割面を合致させ、その後溝の上端面でスリット
の部分から分割するので配線板の分割面におけるばシや
かけによる不良が減少する。(Effects of the Invention) The present invention is a wiring board dividing method in which the wiring board is divided from the slit portion at the end face of the groove of a dividing jig, in which a conductive pattern is formed on the surface of an insulating substrate, and solder is further adhered to the upper surface of the wiring board. board, divide this wiring board into two at the bottom of the groove,
Insert the part of the dividing jig into the groove of the dividing jig to the height of the slit part when the dividing plane is separated, and then attach the conductor pattern to the recess or hole formed on the side surface of the groove and the solder part to the upper surface of the conductor pattern. At the same time, the dividing surfaces of the left and right dividing jigs are made to match, and then the wiring board is divided from the slit portion at the upper end surface of the groove, thereby reducing defects caused by blistering or chipping at the dividing surface of the wiring board.
第１図および第２図は本発明の実施例になるセラはツク
配線板の分割法を示す断面側面図、第３図は従来のセラ
ミック配線板の分割法を示す断面側面図、第４図は第３
図に示す方法で分割したセラミック配線板の分割面の平
面図である。
符号の説明
ｌ・・・多数個数シのセラミック基板 ２・・・溝３・
・・導体パターン ４・・・はんだ５・・
・スリット ６・・・分割治具７・・
・ばり ８・・・かけ９・・・セ
ラミック配線板の裏面 ・１０・・・溝の上端面１１・
・・分割されたセラミック配線板１２・・・分割治具１
３・・・〈ぼみ １４・・・分割治具
１５・・・穴 １６・・・溝の底
面裏１１！１１ 第２１￥１
第３１幻 ［４1 and 2 are cross-sectional side views showing a method of dividing a ceramic wiring board according to an embodiment of the present invention, FIG. 3 is a cross-sectional side view showing a method of dividing a conventional ceramic wiring board, and FIG. is the third
FIG. 2 is a plan view of a divided surface of a ceramic wiring board divided by the method shown in the figure. Explanation of symbols 1...Ceramic substrate with multiple pieces 2...Groove 3...
...Conductor pattern 4...Solder 5...
・Slit 6...Dividing jig 7...
・Flash 8...Cover 9...Back side of ceramic wiring board ・10...Top end surface of groove 11・
...Divided ceramic wiring board 12...Dividing jig 1
3...<Indentation 14...Dividing jig 15...Hole 16...Back side of the bottom of the groove 11!11 21st ¥1 31st illusion [4
Claims (1)
分割する配線板の分割法において、絶縁基板の表面に導
体パターンを形成し、さらにその上面にはんだを付着せ
しめて配線板とし、この配線板を溝の底面部分で２分割
し、かつ分割面を分離した状態のときの分割治具の溝の
中にスリットの部分の高さまで挿入し、次いで溝の側面
に形成したくぼみ又は穴に導体パターンおよびその上面
に付着せしめたはんだの部分を嵌合させると共に左右の
分割治具の分割面を合致させ、その後溝の上端面でスリ
ットの部分から分割することを特徴とする配線板の分割
法。1. In the wiring board dividing method in which the wiring board is divided from the slit (cut groove) on the end face of the groove of the dividing jig, a conductive pattern is formed on the surface of the insulating substrate, and solder is further adhered to the upper surface to form the wiring board. , this wiring board is divided into two parts at the bottom of the groove, and when the divided surfaces are separated, the wiring board is inserted into the groove of the dividing jig up to the height of the slit part, and then the recess or A wiring board characterized in that a conductive pattern and a solder portion attached to the upper surface thereof are fitted into the hole, and the dividing surfaces of the left and right dividing jigs are matched, and then the wiring board is divided from the slit portion at the upper end surface of the groove. division method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17267684A JPS6151309A (en) | 1984-08-20 | 1984-08-20 | Method of dividing wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17267684A JPS6151309A (en) | 1984-08-20 | 1984-08-20 | Method of dividing wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6151309A true JPS6151309A (en) | 1986-03-13 |
Family
ID=15946301
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17267684A Pending JPS6151309A (en) | 1984-08-20 | 1984-08-20 | Method of dividing wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6151309A (en) |
-
1984
- 1984-08-20 JP JP17267684A patent/JPS6151309A/en active Pending
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