JPS6151150A - Formation of pattern and exposing device - Google Patents

Formation of pattern and exposing device

Info

Publication number
JPS6151150A
JPS6151150A JP17359684A JP17359684A JPS6151150A JP S6151150 A JPS6151150 A JP S6151150A JP 17359684 A JP17359684 A JP 17359684A JP 17359684 A JP17359684 A JP 17359684A JP S6151150 A JPS6151150 A JP S6151150A
Authority
JP
Japan
Prior art keywords
resist
exposure
atmosphere
pattern
gas
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP17359684A
Other versions
JPH0719058B2 (en
Inventor
Yuji Ikegami
Kenji Osawa
Hajime Tokumitsu
Masanobu Yagi
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP59173596A priority Critical patent/JPH0719058B2/en
Publication of JPS6151150A publication Critical patent/JPS6151150A/en
Publication of JPH0719058B2 publication Critical patent/JPH0719058B2/en
Anticipated expiration legal-status Critical
Application status is Expired - Fee Related legal-status Critical

Links

Abstract

PURPOSE: To obtain a resist image of high resolution at a high speed by carrying out primary exposure and secondary exposure in an atmosphere of necessary gas and forming a pattern latent image.
CONSTITUTION: The space 6 between an exposure mask 3 and photosensitive resist 2 on a printed board 1 is put in a nonactive atmosphere of nitrogen gas, etc., and the primary exposure using parallel energy rays such as ultraviolet rays is carried out to set only the surface part of the resist 2 in conformity with the pattern of the mask 3. Then, the secondary exposure using parallel rays is performed while the space 6 is placed in an active gas atmosphere of oxygen gas, etc., to set up to the bottom part of the resist 2. In this case, even if scattered or reflected light strikes the surface of the resist 2 where light should not hit, its setting is hardly caused because of an oxygen impediment. Thus, a resist image is formed at a high speed by the primary exposure and to high resolution by the secondary exposure.
COPYRIGHT: (C)1986,JPO&Japio
JP59173596A 1984-08-21 1984-08-21 Pattern - down forming method and an exposure apparatus Expired - Fee Related JPH0719058B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59173596A JPH0719058B2 (en) 1984-08-21 1984-08-21 Pattern - down forming method and an exposure apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59173596A JPH0719058B2 (en) 1984-08-21 1984-08-21 Pattern - down forming method and an exposure apparatus

Publications (2)

Publication Number Publication Date
JPS6151150A true JPS6151150A (en) 1986-03-13
JPH0719058B2 JPH0719058B2 (en) 1995-03-06

Family

ID=15963526

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59173596A Expired - Fee Related JPH0719058B2 (en) 1984-08-21 1984-08-21 Pattern - down forming method and an exposure apparatus

Country Status (1)

Country Link
JP (1) JPH0719058B2 (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02103919A (en) * 1988-10-13 1990-04-17 Matsushita Electric Ind Co Ltd Aligner
US4971895A (en) * 1981-10-20 1990-11-20 Sullivan Donald F Double exposure method of photoprinting with liquid photopolymers
JP2006156507A (en) * 2004-11-25 2006-06-15 Matsushita Electric Works Ltd Method of exposing substrate coated with photosensitive resin
KR100841494B1 (en) 2001-09-06 2008-06-25 산에이 기껜 가부시키가이샤 Partition exposure apparatus
US9250541B2 (en) 2012-12-27 2016-02-02 Canon Kabushiki Kaisha Exposure apparatus and device fabrication method
US9280050B2 (en) 2012-12-27 2016-03-08 Canon Kabushiki Kaisha Exposure apparatus and method of device fabrication

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5055333A (en) * 1973-09-13 1975-05-15
JPS51120727A (en) * 1975-04-16 1976-10-22 Fujitsu Ltd Photograph processing method
JPS5340124A (en) * 1976-09-24 1978-04-12 Nissan Motor Co Ltd Fueled-cylinder switching controller
JPS53130030A (en) * 1977-04-19 1978-11-13 Matsushita Electric Ind Co Ltd Photographic etching method
JPS57109949A (en) * 1980-12-26 1982-07-08 Matsushita Electric Ind Co Ltd Photoetching method

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5055333A (en) * 1973-09-13 1975-05-15
JPS51120727A (en) * 1975-04-16 1976-10-22 Fujitsu Ltd Photograph processing method
JPS5340124A (en) * 1976-09-24 1978-04-12 Nissan Motor Co Ltd Fueled-cylinder switching controller
JPS53130030A (en) * 1977-04-19 1978-11-13 Matsushita Electric Ind Co Ltd Photographic etching method
JPS57109949A (en) * 1980-12-26 1982-07-08 Matsushita Electric Ind Co Ltd Photoetching method

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4971895A (en) * 1981-10-20 1990-11-20 Sullivan Donald F Double exposure method of photoprinting with liquid photopolymers
JPH02103919A (en) * 1988-10-13 1990-04-17 Matsushita Electric Ind Co Ltd Aligner
KR100841494B1 (en) 2001-09-06 2008-06-25 산에이 기껜 가부시키가이샤 Partition exposure apparatus
JP2006156507A (en) * 2004-11-25 2006-06-15 Matsushita Electric Works Ltd Method of exposing substrate coated with photosensitive resin
JP4622482B2 (en) * 2004-11-25 2011-02-02 パナソニック電工株式会社 Exposure method of a substrate for a photosensitive resin is applied
US9250541B2 (en) 2012-12-27 2016-02-02 Canon Kabushiki Kaisha Exposure apparatus and device fabrication method
US9280050B2 (en) 2012-12-27 2016-03-08 Canon Kabushiki Kaisha Exposure apparatus and method of device fabrication

Also Published As

Publication number Publication date
JPH0719058B2 (en) 1995-03-06

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees