JPS6150758U - - Google Patents
Info
- Publication number
- JPS6150758U JPS6150758U JP13522784U JP13522784U JPS6150758U JP S6150758 U JPS6150758 U JP S6150758U JP 13522784 U JP13522784 U JP 13522784U JP 13522784 U JP13522784 U JP 13522784U JP S6150758 U JPS6150758 U JP S6150758U
- Authority
- JP
- Japan
- Prior art keywords
- target
- film
- substrate
- vacuum chamber
- resistant metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004544 sputter deposition Methods 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 2
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 239000002245 particle Substances 0.000 claims 1
- 229920000728 polyester Polymers 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Landscapes
- Physical Vapour Deposition (AREA)
Description
第１図は本考案に係るスパツタ装置の実施例を
示す正断面図、第２図は実施例で用いたグリツド
の平面図、第３図は従来のスパツタ装置の実施例
を示す正断面図である。
１……ポリエステルベースフイルム、２……供
給ロール、３……ドラム、４……巻取りロール、
５……ターゲツト、６……真空室、１０……耐熱
性金属板、１１……穴、１２……多孔板（グリツ
ド）。
FIG. 1 is a front sectional view showing an embodiment of the sputtering device according to the present invention, FIG. 2 is a plan view of the grid used in the embodiment, and FIG. 3 is a front sectional view showing an embodiment of the conventional sputtering device. be. 1... Polyester base film, 2... Supply roll, 3... Drum, 4... Winding roll,
5... Target, 6... Vacuum chamber, 10... Heat resistant metal plate, 11... Hole, 12... Perforated plate (grid).
Claims (1)
ーゲツトを配置し、これに対向する位置に被成膜
基体を配置したスパツタ装置において、前記ター
ゲツトと被成膜基体との間に、耐熱性金属板の多
数の穴を形成してなる多孔板を配設したことを特
徴とするスパツタ装置。 In a sputtering apparatus, a target for emitting sputter particles for film formation is placed in a vacuum chamber, and a substrate to be film-formed is placed at a position opposite to the target, and a heat-resistant metal plate is placed between the target and the substrate to be film-formed. A sputtering device characterized by having a perforated plate formed with a large number of holes formed therein.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984135227U JPH0230442Y2 (en) | 1984-09-07 | 1984-09-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984135227U JPH0230442Y2 (en) | 1984-09-07 | 1984-09-07 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6150758U true JPS6150758U (en) | 1986-04-05 |
| JPH0230442Y2 JPH0230442Y2 (en) | 1990-08-16 |
Family
ID=30693726
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1984135227U Expired JPH0230442Y2 (en) | 1984-09-07 | 1984-09-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0230442Y2 (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5538919A (en) * | 1978-09-05 | 1980-03-18 | Nec Corp | Sputtering apparatus |
-
1984
- 1984-09-07 JP JP1984135227U patent/JPH0230442Y2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5538919A (en) * | 1978-09-05 | 1980-03-18 | Nec Corp | Sputtering apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0230442Y2 (en) | 1990-08-16 |
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