JPS6149446B2 - - Google Patents
Info
- Publication number
- JPS6149446B2 JPS6149446B2 JP54113499A JP11349979A JPS6149446B2 JP S6149446 B2 JPS6149446 B2 JP S6149446B2 JP 54113499 A JP54113499 A JP 54113499A JP 11349979 A JP11349979 A JP 11349979A JP S6149446 B2 JPS6149446 B2 JP S6149446B2
- Authority
- JP
- Japan
- Prior art keywords
- roadbed
- cement
- weight
- mixing
- slurry composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Road Paving Structures (AREA)
- Road Repair (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11349979A JPS5639203A (en) | 1979-09-06 | 1979-09-06 | Stabilizing treatment of road foundation |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11349979A JPS5639203A (en) | 1979-09-06 | 1979-09-06 | Stabilizing treatment of road foundation |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5639203A JPS5639203A (en) | 1981-04-14 |
JPS6149446B2 true JPS6149446B2 (enrdf_load_stackoverflow) | 1986-10-29 |
Family
ID=14613860
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11349979A Granted JPS5639203A (en) | 1979-09-06 | 1979-09-06 | Stabilizing treatment of road foundation |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5639203A (enrdf_load_stackoverflow) |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6853070B2 (en) | 2001-02-15 | 2005-02-08 | Broadcom Corporation | Die-down ball grid array package with die-attached heat spreader and method for making the same |
US6861750B2 (en) | 2002-02-01 | 2005-03-01 | Broadcom Corporation | Ball grid array package with multiple interposers |
US6906414B2 (en) | 2000-12-22 | 2005-06-14 | Broadcom Corporation | Ball grid array package with patterned stiffener layer |
US6989593B2 (en) | 2000-12-22 | 2006-01-24 | Broadcom Corporation | Die-up ball grid array package with patterned stiffener opening |
US7132744B2 (en) | 2000-12-22 | 2006-11-07 | Broadcom Corporation | Enhanced die-up ball grid array packages and method for making the same |
US7161239B2 (en) | 2000-12-22 | 2007-01-09 | Broadcom Corporation | Ball grid array package enhanced with a thermal and electrical connector |
US7196415B2 (en) | 2002-03-22 | 2007-03-27 | Broadcom Corporation | Low voltage drop and high thermal performance ball grid array package |
US7245500B2 (en) | 2002-02-01 | 2007-07-17 | Broadcom Corporation | Ball grid array package with stepped stiffener layer |
US7259448B2 (en) | 2001-05-07 | 2007-08-21 | Broadcom Corporation | Die-up ball grid array package with a heat spreader and method for making the same |
US7550845B2 (en) | 2002-02-01 | 2009-06-23 | Broadcom Corporation | Ball grid array package with separated stiffener layer |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CH559310A5 (enrdf_load_stackoverflow) * | 1973-07-13 | 1975-02-28 | Bbc Brown Boveri & Cie |
-
1979
- 1979-09-06 JP JP11349979A patent/JPS5639203A/ja active Granted
Cited By (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7462933B2 (en) | 2000-12-22 | 2008-12-09 | Broadcom Corporation | Ball grid array package enhanced with a thermal and electrical connector |
US7227256B2 (en) | 2000-12-22 | 2007-06-05 | Broadcom Corporation | Die-up ball grid array package with printed circuit board attachable heat spreader |
US6906414B2 (en) | 2000-12-22 | 2005-06-14 | Broadcom Corporation | Ball grid array package with patterned stiffener layer |
US6989593B2 (en) | 2000-12-22 | 2006-01-24 | Broadcom Corporation | Die-up ball grid array package with patterned stiffener opening |
US7005737B2 (en) | 2000-12-22 | 2006-02-28 | Broadcom Corporation | Die-up ball grid array package with enhanced stiffener |
US7038312B2 (en) | 2000-12-22 | 2006-05-02 | Broadcom Corporation | Die-up ball grid array package with attached stiffener ring |
US7579217B2 (en) | 2000-12-22 | 2009-08-25 | Broadcom Corporation | Methods of making a die-up ball grid array package with printed circuit board attachable heat spreader |
US7132744B2 (en) | 2000-12-22 | 2006-11-07 | Broadcom Corporation | Enhanced die-up ball grid array packages and method for making the same |
US7161239B2 (en) | 2000-12-22 | 2007-01-09 | Broadcom Corporation | Ball grid array package enhanced with a thermal and electrical connector |
US6853070B2 (en) | 2001-02-15 | 2005-02-08 | Broadcom Corporation | Die-down ball grid array package with die-attached heat spreader and method for making the same |
US7259448B2 (en) | 2001-05-07 | 2007-08-21 | Broadcom Corporation | Die-up ball grid array package with a heat spreader and method for making the same |
US7245500B2 (en) | 2002-02-01 | 2007-07-17 | Broadcom Corporation | Ball grid array package with stepped stiffener layer |
US7550845B2 (en) | 2002-02-01 | 2009-06-23 | Broadcom Corporation | Ball grid array package with separated stiffener layer |
US6861750B2 (en) | 2002-02-01 | 2005-03-01 | Broadcom Corporation | Ball grid array package with multiple interposers |
US7196415B2 (en) | 2002-03-22 | 2007-03-27 | Broadcom Corporation | Low voltage drop and high thermal performance ball grid array package |
US7566590B2 (en) | 2002-03-22 | 2009-07-28 | Broadcom Corporation | Low voltage drop and high thermal performance ball grid array package |
Also Published As
Publication number | Publication date |
---|---|
JPS5639203A (en) | 1981-04-14 |
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