JPS6149446B2 - - Google Patents

Info

Publication number
JPS6149446B2
JPS6149446B2 JP54113499A JP11349979A JPS6149446B2 JP S6149446 B2 JPS6149446 B2 JP S6149446B2 JP 54113499 A JP54113499 A JP 54113499A JP 11349979 A JP11349979 A JP 11349979A JP S6149446 B2 JPS6149446 B2 JP S6149446B2
Authority
JP
Japan
Prior art keywords
roadbed
cement
weight
mixing
slurry composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP54113499A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5639203A (en
Inventor
Norio Meshida
Kazuhiko Higaki
Koichi Oguro
Bunro Fukushima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nichireki Kagaku Kogyo Co Ltd
Original Assignee
Nichireki Kagaku Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nichireki Kagaku Kogyo Co Ltd filed Critical Nichireki Kagaku Kogyo Co Ltd
Priority to JP11349979A priority Critical patent/JPS5639203A/ja
Publication of JPS5639203A publication Critical patent/JPS5639203A/ja
Publication of JPS6149446B2 publication Critical patent/JPS6149446B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Road Paving Structures (AREA)
  • Road Repair (AREA)
JP11349979A 1979-09-06 1979-09-06 Stabilizing treatment of road foundation Granted JPS5639203A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11349979A JPS5639203A (en) 1979-09-06 1979-09-06 Stabilizing treatment of road foundation

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11349979A JPS5639203A (en) 1979-09-06 1979-09-06 Stabilizing treatment of road foundation

Publications (2)

Publication Number Publication Date
JPS5639203A JPS5639203A (en) 1981-04-14
JPS6149446B2 true JPS6149446B2 (enrdf_load_html_response) 1986-10-29

Family

ID=14613860

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11349979A Granted JPS5639203A (en) 1979-09-06 1979-09-06 Stabilizing treatment of road foundation

Country Status (1)

Country Link
JP (1) JPS5639203A (enrdf_load_html_response)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6853070B2 (en) 2001-02-15 2005-02-08 Broadcom Corporation Die-down ball grid array package with die-attached heat spreader and method for making the same
US6861750B2 (en) 2002-02-01 2005-03-01 Broadcom Corporation Ball grid array package with multiple interposers
US6906414B2 (en) 2000-12-22 2005-06-14 Broadcom Corporation Ball grid array package with patterned stiffener layer
US6989593B2 (en) 2000-12-22 2006-01-24 Broadcom Corporation Die-up ball grid array package with patterned stiffener opening
US7132744B2 (en) 2000-12-22 2006-11-07 Broadcom Corporation Enhanced die-up ball grid array packages and method for making the same
US7161239B2 (en) 2000-12-22 2007-01-09 Broadcom Corporation Ball grid array package enhanced with a thermal and electrical connector
US7196415B2 (en) 2002-03-22 2007-03-27 Broadcom Corporation Low voltage drop and high thermal performance ball grid array package
US7245500B2 (en) 2002-02-01 2007-07-17 Broadcom Corporation Ball grid array package with stepped stiffener layer
US7259448B2 (en) 2001-05-07 2007-08-21 Broadcom Corporation Die-up ball grid array package with a heat spreader and method for making the same
US7550845B2 (en) 2002-02-01 2009-06-23 Broadcom Corporation Ball grid array package with separated stiffener layer

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH559310A5 (enrdf_load_html_response) * 1973-07-13 1975-02-28 Bbc Brown Boveri & Cie

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7462933B2 (en) 2000-12-22 2008-12-09 Broadcom Corporation Ball grid array package enhanced with a thermal and electrical connector
US7227256B2 (en) 2000-12-22 2007-06-05 Broadcom Corporation Die-up ball grid array package with printed circuit board attachable heat spreader
US6906414B2 (en) 2000-12-22 2005-06-14 Broadcom Corporation Ball grid array package with patterned stiffener layer
US6989593B2 (en) 2000-12-22 2006-01-24 Broadcom Corporation Die-up ball grid array package with patterned stiffener opening
US7005737B2 (en) 2000-12-22 2006-02-28 Broadcom Corporation Die-up ball grid array package with enhanced stiffener
US7038312B2 (en) 2000-12-22 2006-05-02 Broadcom Corporation Die-up ball grid array package with attached stiffener ring
US7579217B2 (en) 2000-12-22 2009-08-25 Broadcom Corporation Methods of making a die-up ball grid array package with printed circuit board attachable heat spreader
US7132744B2 (en) 2000-12-22 2006-11-07 Broadcom Corporation Enhanced die-up ball grid array packages and method for making the same
US7161239B2 (en) 2000-12-22 2007-01-09 Broadcom Corporation Ball grid array package enhanced with a thermal and electrical connector
US6853070B2 (en) 2001-02-15 2005-02-08 Broadcom Corporation Die-down ball grid array package with die-attached heat spreader and method for making the same
US7259448B2 (en) 2001-05-07 2007-08-21 Broadcom Corporation Die-up ball grid array package with a heat spreader and method for making the same
US7245500B2 (en) 2002-02-01 2007-07-17 Broadcom Corporation Ball grid array package with stepped stiffener layer
US7550845B2 (en) 2002-02-01 2009-06-23 Broadcom Corporation Ball grid array package with separated stiffener layer
US6861750B2 (en) 2002-02-01 2005-03-01 Broadcom Corporation Ball grid array package with multiple interposers
US7196415B2 (en) 2002-03-22 2007-03-27 Broadcom Corporation Low voltage drop and high thermal performance ball grid array package
US7566590B2 (en) 2002-03-22 2009-07-28 Broadcom Corporation Low voltage drop and high thermal performance ball grid array package

Also Published As

Publication number Publication date
JPS5639203A (en) 1981-04-14

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