JPS6148254B2 - - Google Patents
Info
- Publication number
- JPS6148254B2 JPS6148254B2 JP16119881A JP16119881A JPS6148254B2 JP S6148254 B2 JPS6148254 B2 JP S6148254B2 JP 16119881 A JP16119881 A JP 16119881A JP 16119881 A JP16119881 A JP 16119881A JP S6148254 B2 JPS6148254 B2 JP S6148254B2
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- plasma
- wafers
- wafer table
- conveyor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 235000012431 wafers Nutrition 0.000 claims description 88
- 238000009832 plasma treatment Methods 0.000 claims description 5
- 238000003672 processing method Methods 0.000 claims description 5
- 238000000034 method Methods 0.000 description 29
- 230000008569 process Effects 0.000 description 15
- 230000007246 mechanism Effects 0.000 description 13
- 238000005530 etching Methods 0.000 description 9
- 238000005516 engineering process Methods 0.000 description 3
- 238000011161 development Methods 0.000 description 2
- 230000018109 developmental process Effects 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000001039 wet etching Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 238000004380 ashing Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 230000003028 elevating effect Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000011282 treatment Methods 0.000 description 1
- 231100000691 up-and-down procedure Toxicity 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3435—Target holders (includes backing plates and endblocks)
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Drying Of Semiconductors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16119881A JPS5795630A (en) | 1981-10-09 | 1981-10-09 | Automatic plasma treating method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16119881A JPS5795630A (en) | 1981-10-09 | 1981-10-09 | Automatic plasma treating method |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15979877A Division JPS5493363A (en) | 1977-07-18 | 1977-12-31 | Improved plasma reactive processor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5795630A JPS5795630A (en) | 1982-06-14 |
| JPS6148254B2 true JPS6148254B2 (enrdf_load_html_response) | 1986-10-23 |
Family
ID=15730446
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16119881A Granted JPS5795630A (en) | 1981-10-09 | 1981-10-09 | Automatic plasma treating method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5795630A (enrdf_load_html_response) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2746179B2 (ja) * | 1995-03-17 | 1998-04-28 | 日本電気株式会社 | 真空処理装置および真空処理方法 |
-
1981
- 1981-10-09 JP JP16119881A patent/JPS5795630A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5795630A (en) | 1982-06-14 |
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