JPS6147918B2 - - Google Patents
Info
- Publication number
- JPS6147918B2 JPS6147918B2 JP12027083A JP12027083A JPS6147918B2 JP S6147918 B2 JPS6147918 B2 JP S6147918B2 JP 12027083 A JP12027083 A JP 12027083A JP 12027083 A JP12027083 A JP 12027083A JP S6147918 B2 JPS6147918 B2 JP S6147918B2
- Authority
- JP
- Japan
- Prior art keywords
- plating
- printed circuit
- circuit board
- plating tank
- plating solution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000007747 plating Methods 0.000 claims description 91
- 239000007788 liquid Substances 0.000 claims description 18
- 238000000034 method Methods 0.000 claims description 14
- 238000009713 electroplating Methods 0.000 claims description 6
- 239000000758 substrate Substances 0.000 description 22
- 239000000243 solution Substances 0.000 description 20
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 239000011295 pitch Substances 0.000 description 5
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- 229910000365 copper sulfate Inorganic materials 0.000 description 4
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- PEVJCYPAFCUXEZ-UHFFFAOYSA-J dicopper;phosphonato phosphate Chemical compound [Cu+2].[Cu+2].[O-]P([O-])(=O)OP([O-])([O-])=O PEVJCYPAFCUXEZ-UHFFFAOYSA-J 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 235000017166 Bambusa arundinacea Nutrition 0.000 description 1
- 235000017491 Bambusa tulda Nutrition 0.000 description 1
- 241001330002 Bambuseae Species 0.000 description 1
- 235000015334 Phyllostachys viridis Nutrition 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 239000011425 bamboo Substances 0.000 description 1
- 230000003796 beauty Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000009291 secondary effect Effects 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- RYCLIXPGLDDLTM-UHFFFAOYSA-J tetrapotassium;phosphonato phosphate Chemical compound [K+].[K+].[K+].[K+].[O-]P([O-])(=O)OP([O-])([O-])=O RYCLIXPGLDDLTM-UHFFFAOYSA-J 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroplating Methods And Accessories (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12027083A JPS6013096A (ja) | 1983-07-04 | 1983-07-04 | 高速電鍍方法及びそのための装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12027083A JPS6013096A (ja) | 1983-07-04 | 1983-07-04 | 高速電鍍方法及びそのための装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6013096A JPS6013096A (ja) | 1985-01-23 |
| JPS6147918B2 true JPS6147918B2 (nl) | 1986-10-21 |
Family
ID=14782062
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12027083A Granted JPS6013096A (ja) | 1983-07-04 | 1983-07-04 | 高速電鍍方法及びそのための装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6013096A (nl) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0765209B2 (ja) * | 1985-12-06 | 1995-07-12 | ヤマハ発動機株式会社 | 電気めっき装置 |
| JPH0680199B2 (ja) * | 1987-12-21 | 1994-10-12 | イビデン株式会社 | プリント配線基板用のめっき処理装置 |
| US6048584A (en) * | 1998-05-13 | 2000-04-11 | Tyco Printed Circuit Group, Inc. | Apparatus and method for coating multilayer article |
| EP1230442B1 (de) * | 1999-11-09 | 2003-07-16 | Siemens Aktiengesellschaft | Vorrichtung zur elektrolytischen behandlung von plattenförmigen werkstücken, insbesondere von leiterplatten |
| JP2011256444A (ja) * | 2010-06-10 | 2011-12-22 | Sumitomo Bakelite Co Ltd | 基板の処理方法および処理装置 |
| JP6890528B2 (ja) * | 2017-12-15 | 2021-06-18 | 株式会社荏原製作所 | パドルに取り付け可能な消波部材および消波部材を備えるめっき装置 |
-
1983
- 1983-07-04 JP JP12027083A patent/JPS6013096A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6013096A (ja) | 1985-01-23 |
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