JPS6145511B2 - - Google Patents
Info
- Publication number
- JPS6145511B2 JPS6145511B2 JP13394177A JP13394177A JPS6145511B2 JP S6145511 B2 JPS6145511 B2 JP S6145511B2 JP 13394177 A JP13394177 A JP 13394177A JP 13394177 A JP13394177 A JP 13394177A JP S6145511 B2 JPS6145511 B2 JP S6145511B2
- Authority
- JP
- Japan
- Prior art keywords
- temperature
- composite sheet
- heat
- manufacturing
- metal foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 18
- 239000002131 composite material Substances 0.000 claims description 16
- 239000011889 copper foil Substances 0.000 claims description 16
- 238000004519 manufacturing process Methods 0.000 claims description 14
- 230000032683 aging Effects 0.000 claims description 13
- 239000002184 metal Substances 0.000 claims description 12
- 229910052751 metal Inorganic materials 0.000 claims description 12
- 239000011888 foil Substances 0.000 claims description 11
- 230000005070 ripening Effects 0.000 claims description 11
- 239000004962 Polyamide-imide Substances 0.000 claims description 10
- 229920002312 polyamide-imide Polymers 0.000 claims description 10
- 238000001035 drying Methods 0.000 claims description 9
- 229920000642 polymer Polymers 0.000 claims description 9
- 239000004033 plastic Substances 0.000 claims description 8
- 229920003023 plastic Polymers 0.000 claims description 8
- 229920001721 polyimide Polymers 0.000 claims description 8
- 238000007711 solidification Methods 0.000 claims description 4
- 230000008023 solidification Effects 0.000 claims description 4
- 239000009719 polyimide resin Substances 0.000 claims description 3
- 239000002966 varnish Substances 0.000 claims description 3
- 239000012298 atmosphere Substances 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 238000000034 method Methods 0.000 description 9
- 239000010410 layer Substances 0.000 description 8
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- 239000004642 Polyimide Substances 0.000 description 5
- 238000005266 casting Methods 0.000 description 5
- 239000002904 solvent Substances 0.000 description 4
- 239000012790 adhesive layer Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 239000002985 plastic film Substances 0.000 description 3
- 229920006255 plastic film Polymers 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000012299 nitrogen atmosphere Substances 0.000 description 2
- 239000002243 precursor Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 230000002431 foraging effect Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 229920005575 poly(amic acid) Polymers 0.000 description 1
- 229920003055 poly(ester-imide) Polymers 0.000 description 1
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Landscapes
- Moulding By Coating Moulds (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Laminated Bodies (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13394177A JPS5466966A (en) | 1977-11-07 | 1977-11-07 | Manufacture of composite sheet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13394177A JPS5466966A (en) | 1977-11-07 | 1977-11-07 | Manufacture of composite sheet |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5466966A JPS5466966A (en) | 1979-05-29 |
| JPS6145511B2 true JPS6145511B2 (zh) | 1986-10-08 |
Family
ID=15116642
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13394177A Granted JPS5466966A (en) | 1977-11-07 | 1977-11-07 | Manufacture of composite sheet |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5466966A (zh) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0264454B1 (en) * | 1986-03-26 | 1992-08-26 | MITSUI TOATSU CHEMICALS, Inc. | Method for correcting curl and improving dimensional stability of flexible metal foil laminated plate |
| KR910008865B1 (ko) * | 1987-09-24 | 1991-10-24 | 미쯔이도오 아쯔가가꾸 가부시기가이샤 | 가요성금속플라스틱적층판, 그 제법 및 그를 위한 장치 |
| JP2761655B2 (ja) * | 1989-11-17 | 1998-06-04 | 鐘淵化学工業株式会社 | フレキシブルプリント基板の製造方法 |
| WO2001047327A2 (en) * | 1999-12-23 | 2001-06-28 | Oak-Mitsui, Inc. | Method for applying polymer film to a metal foil |
| US7662429B2 (en) * | 2000-02-14 | 2010-02-16 | Kaneka Corporation | Laminate comprising polyimide and conductor layer, multi-layer wiring board with the use of the same and process for producing the same |
| JP4906332B2 (ja) * | 2005-12-06 | 2012-03-28 | 三井金属鉱業株式会社 | 複合箔のカール矯正方法、複合箔及び複合箔張積層板 |
| JP4951114B2 (ja) * | 2010-12-24 | 2012-06-13 | 三井金属鉱業株式会社 | 複合箔のカール矯正方法 |
-
1977
- 1977-11-07 JP JP13394177A patent/JPS5466966A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5466966A (en) | 1979-05-29 |
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