JPS6145164Y2 - - Google Patents
Info
- Publication number
- JPS6145164Y2 JPS6145164Y2 JP12132782U JP12132782U JPS6145164Y2 JP S6145164 Y2 JPS6145164 Y2 JP S6145164Y2 JP 12132782 U JP12132782 U JP 12132782U JP 12132782 U JP12132782 U JP 12132782U JP S6145164 Y2 JPS6145164 Y2 JP S6145164Y2
- Authority
- JP
- Japan
- Prior art keywords
- plating
- metal strip
- metal
- sides
- plated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000007747 plating Methods 0.000 claims description 40
- 229910052751 metal Inorganic materials 0.000 claims description 29
- 239000002184 metal Substances 0.000 claims description 29
- 239000007788 liquid Substances 0.000 claims description 11
- 238000003756 stirring Methods 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 238000013019 agitation Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
Description
【考案の詳細な説明】
本考案は金属帯のメツキ装置に関し、例えばア
ルミ帯に銅を電気メツキする場合に使用するもの
である。[Detailed Description of the Invention] The present invention relates to a metal strip plating device, and is used, for example, when electroplating copper on an aluminum strip.
アルミ帯の全面に銅をメツキする場合、金属帯
を断面縦向きでメツキ槽内に通過させ、金属帯の
両側に陽極（例えば銅母材）を配置するのが通常
である。この場合、金属帯の上下端部のそれぞれ
の両側には、金属帯縁端でのメツキ電流の高電流
密度化を防止してメツキ電流密度の均一化を図る
ために遮蔽板を設けることが必要である。また、
メツキのむらの防止、メツキピツトの原因となる
水素の発生防止のためにメツキ液の撹拌も必要で
ある。 When plating the entire surface of an aluminum strip with copper, the metal strip is usually passed through a plating bath with its cross section oriented vertically, and anodes (for example, copper base material) are placed on both sides of the metal strip. In this case, it is necessary to provide shielding plates on both sides of the upper and lower ends of the metal strip in order to prevent the plating current from increasing in current density at the edge of the metal strip and to equalize the plating current density. It is. Also,
It is also necessary to stir the plating solution to prevent uneven plating and to prevent the generation of hydrogen that causes plating spots.
而るに、このメツキ液の撹拌には、通常、メツ
キ槽内の底部に孔あき噴出管を設け、該噴出管よ
りメツキ液または空気を噴射し、この噴射流によ
つてメツキ液を撹拌させる方法が用いられるが、
この場合、上記の遮蔽板中、金属帯下端部の遮蔽
板が従来の縦形であると、金属帯表面での撹拌効
果の低下を招き、その結果、メツキむらの発生、
ピツトの発生等の懸念がある。 In order to stir the plating liquid, a perforated jet pipe is usually provided at the bottom of the plating tank, the plating liquid or air is jetted from the jet pipe, and the plating liquid is stirred by this jet stream. method is used,
In this case, if the shielding plate at the lower end of the metal band is of the conventional vertical shape, the agitation effect on the metal band surface will be reduced, and as a result, uneven plating may occur.
There is a concern that pitting may occur.
本考案に係る金属帯のメツキ装置は、遮蔽板使
用によるメツキ電流密度の均一化、メツキ液の充
分な撹拌の何れをも可能とする構成であり、被メ
ツキ板としての金属帯を断面縦向きで走行させる
メツキ槽内の上記金属帯下端部の両側に、メツキ
電流調節用の各遮蔽板を遮蔽板下端ほど金属帯な
ら遠ざけるように傾斜させて設け、これら遮蔽板
の下側にメツキ撹拌用噴出管を設けたことを特徴
とするものである。 The metal strip plating device according to the present invention is configured to make it possible to make the plating current density uniform by using a shield plate and to sufficiently stir the plating solution, and the metal strip as the plate to be plated is oriented vertically in cross section. Shield plates for adjusting the plating current are installed on both sides of the lower end of the metal strip in the plating tank, which is run at an angle, so that the lower end of the shield plate is farther away from the metal strip. It is characterized by being equipped with an ejection pipe.
以下、図面により本考案を説明する。 The present invention will be explained below with reference to the drawings.
第１図において、１はメツキ槽である。２は被
メツキ材としての金属帯であり、断面縦向きでメ
ツキ槽１内に走行される。３，３は銅母材として
の陽極である。４１，４１は金属帯上端の両側に
設けたメツキ電流調節用遮蔽板であり、電界調整
により金属帯上端での電界集中を防止してメツキ
電流密度の均一化を図るものである。４２，４２
は金属帯下端の両側に設けたメツキ電流調節用の
遮蔽板であり、下端ほど金属帯１に遠ざけるよう
に傾斜されている。５，５はメツキ液噴出管であ
り、上記の下部遮蔽板４２，４２の下方に設けら
れている。 In FIG. 1, 1 is a plating tank. Reference numeral 2 denotes a metal strip as a material to be plated, which is run into the plating tank 1 with a vertical cross section. 3, 3 is an anode as a copper base material. Numerals 41, 41 are shielding plates for adjusting plating current provided on both sides of the upper end of the metal strip, and are used to adjust the electric field to prevent concentration of the electric field at the upper end of the metal strip, thereby making the plating current density uniform. 42,42
are shielding plates for adjusting the plating current provided on both sides of the lower end of the metal strip, and are inclined so that the lower end is farther away from the metal strip 1. Reference numerals 5 and 5 designate plating liquid jetting pipes, which are provided below the lower shielding plates 42, 42 mentioned above.
上記において、メツキ液噴出管に代え第２図Ａ
に示すように空気噴出管５０を用いることもでき
る。また、第２図Ｂに示すようにメツキ液面ｌが
金属帯２の上端よりもかなり高い場合は、上部遮
蔽板４１，４１間に天井板４３を設けて金属帯上
端への上方からの電流の廻り込みを防止すること
が有効である。更に、第２図Ｂに示すように、メ
ツキ液撹拌用噴出管５と遮蔽板４２とを一体化す
ることもできる。 In the above, Fig. 2A is used instead of the liquid spouting pipe.
An air ejection tube 50 can also be used as shown in FIG. In addition, if the plating liquid level l is considerably higher than the upper end of the metal strip 2 as shown in FIG. It is effective to prevent this from going around. Furthermore, as shown in FIG. 2B, the plating liquid stirring jet pipe 5 and the shielding plate 42 can be integrated.
本考案に係る金属帯のメツキ装置は、上述した
通り、被メツキ材である断面縦向き金属帯の下端
両側に下端ほど金属帯から遠ざける傾斜遮蔽板を
それぞれ設け、この遮蔽板の下方にメツキ液撹拌
用噴出管を設けた構成であるから、噴出管からの
噴出流は傾斜遮蔽板のために金属帯によく向つて
流され、金属板表面でのメツキ液の撹拌効果を充
分に保障できる。勿論、金属帯下端でのメツキ電
流密度の均一化も下部遮蔽板によつて達成でき
る。 As described above, the metal strip plating device according to the present invention is provided with inclined shielding plates on both sides of the lower end of the metal strip with a vertical cross section, which is the material to be plated, such that the lower end is farther away from the metal strip, and the plating liquid is placed below the shielding plates. Since the stirring jet pipe is provided, the jet stream from the jet pipe is directed toward the metal strip by the inclined shielding plate, and the stirring effect of the plating liquid on the metal plate surface can be sufficiently ensured. Of course, uniformity of the plating current density at the lower end of the metal strip can also be achieved by the lower shielding plate.
従つて本考案によれば、金属帯を均一なメツキ
電流密度並びに充分なメツキ液撹拌のもとでメツ
キでき、秀れた品質の銅メツキアルミ帯等を得る
ことができる。 Therefore, according to the present invention, a metal strip can be plated at a uniform plating current density and with sufficient stirring of the plating solution, and a copper-plated aluminum strip or the like of excellent quality can be obtained.
第１図は本考案に係るメツキ装置を示す斜視説
明図、第２図Ａ並びに第２図Ｂは本考案の別実施
例をそれぞれ示す横断面説明図である。
図において、１はメツキ槽、２は金属帯、４
２，４２は遮蔽板、５，５はメツキ液撹拌用噴出
管である。
FIG. 1 is a perspective explanatory view showing a plating device according to the present invention, and FIGS. 2A and 2B are cross-sectional explanatory views showing other embodiments of the present invention. In the figure, 1 is a plating tank, 2 is a metal band, and 4 is a plating tank.
2 and 42 are shielding plates, and 5 and 5 are jet pipes for stirring the plating liquid.
Claims (1)
させるメツキ槽内の上記金属帯下端部の両側に、
メツキ電流調節用の各遮蔽板を遮蔽板下端ほど金
属帯から遠ざけるように傾斜させて設け、これら
遮蔽板の下側にメツキ液撹拌用噴出管を設けたこ
とを特徴とする金属帯のメツキ装置。 On both sides of the lower end of the metal strip in the plating tank in which the metal strip as the material to be plated runs with its cross section vertically,
A device for plating metal strips, characterized in that each shielding plate for adjusting the plating current is inclined so that the lower end of the shielding plate is farther away from the metal strip, and a spout pipe for stirring the plating liquid is provided below the shielding plates. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12132782U JPS5924767U (en) | 1982-08-09 | 1982-08-09 | Metal strip plating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12132782U JPS5924767U (en) | 1982-08-09 | 1982-08-09 | Metal strip plating device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5924767U JPS5924767U (en) | 1984-02-16 |
| JPS6145164Y2 true JPS6145164Y2 (en) | 1986-12-19 |
Family
ID=30277733
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12132782U Granted JPS5924767U (en) | 1982-08-09 | 1982-08-09 | Metal strip plating device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5924767U (en) |
-
1982
- 1982-08-09 JP JP12132782U patent/JPS5924767U/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5924767U (en) | 1984-02-16 |
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