CN217536210U - Bonding wire plating bath - Google Patents
Bonding wire plating bath Download PDFInfo
- Publication number
- CN217536210U CN217536210U CN202221099095.3U CN202221099095U CN217536210U CN 217536210 U CN217536210 U CN 217536210U CN 202221099095 U CN202221099095 U CN 202221099095U CN 217536210 U CN217536210 U CN 217536210U
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- Prior art keywords
- bonding wire
- groove
- inner groove
- plating bath
- outer groove
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- 238000007747 plating Methods 0.000 title claims abstract description 41
- 238000009713 electroplating Methods 0.000 claims abstract description 54
- 239000007788 liquid Substances 0.000 claims abstract description 28
- 230000007246 mechanism Effects 0.000 claims description 12
- 238000009434 installation Methods 0.000 claims description 8
- 238000005192 partition Methods 0.000 claims description 7
- 229910000831 Steel Inorganic materials 0.000 claims description 6
- 239000010959 steel Substances 0.000 claims description 6
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 6
- 229910052721 tungsten Inorganic materials 0.000 claims description 6
- 239000010937 tungsten Substances 0.000 claims description 6
- 238000007789 sealing Methods 0.000 claims description 5
- 238000004804 winding Methods 0.000 claims description 5
- 238000009826 distribution Methods 0.000 claims description 3
- 239000003344 environmental pollutant Substances 0.000 claims description 3
- 231100000719 pollutant Toxicity 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 12
- 238000007654 immersion Methods 0.000 abstract description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 11
- 239000010936 titanium Substances 0.000 description 11
- 229910052719 titanium Inorganic materials 0.000 description 11
- 238000004519 manufacturing process Methods 0.000 description 6
- 239000011347 resin Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 230000009471 action Effects 0.000 description 4
- 230000000149 penetrating effect Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 230000009467 reduction Effects 0.000 description 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000003139 buffering effect Effects 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 238000007599 discharging Methods 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910001069 Ti alloy Inorganic materials 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
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- Electroplating Methods And Accessories (AREA)
Abstract
The utility model provides a bonding wire plating bath, which relates to the technical field of electroplating devices and comprises an inner groove and an outer groove, wherein the inner groove and the outer groove are both hollow components, the top of the inner groove is provided with an opening, the volume of the inner groove is smaller than that of the outer groove, the inner groove is arranged inside the outer groove, and the top edges of the inner groove and the outer groove are provided with through openings for passing bonding wires in a straight line; the bottom of the inner groove is provided with a liquid inlet pipe for inputting electroplating liquid, and the bottom of the outer groove is provided with a return pipe for recovering the electroplating liquid. The device has the advantage of improving the immersion effect of the bonding wire in the electroplating solution so as to improve the processing quality of the product.
Description
Technical Field
The utility model relates to an electroplate device's technical field, especially relate to a bonding wire plating bath.
Background
In the processing process of electronic components, a semiconductor wafer and pins need to be connected by using a bonding wire, and the bonding wire is usually stretched by adopting gold, silver, copper or alloy and the like to manufacture a silk thread; when the bonding wire is manufactured, a palladium plating layer is required to be plated on the bonding wire to enhance the mechanical performance of the bonding wire.
In the prior art, when the bonding wire is electroplated, because the liquid level of the electroplating pool is lower than the edge of the electroplating pool, and the length of the bonding wire is very long, the bonding wire is usually received and discharged by adopting a mode of winding one end of the discharging pool and one end of the discharging pool, and the middle part of the bonding wire is electroplated during electroplating, so that the effect of the immersed bonding wire in electroplating solution is poor, the electroplating effect of the bonding wire is poor, and the product quality of the bonding wire is reduced.
SUMMERY OF THE UTILITY MODEL
Aiming at the defects in the prior art, the scheme provides a bonding wire electroplating bath which solves the problem that the electroplating quality of the bonding wire is reduced due to the poor immersion effect of the bonding wire.
According to the embodiment of the utility model, the bonding wire plating bath comprises an inner groove and an outer groove, wherein the inner groove and the outer groove are both hollow components, the top of the inner groove is provided with an opening, the volume of the inner groove is smaller than that of the outer groove, the inner groove is arranged inside the outer groove, and the top edges of the inner groove and the outer groove are provided with through openings for the bonding wire to pass through in a straight line; the bottom of the inner groove is provided with a liquid inlet pipe for inputting electroplating liquid, and the bottom of the outer groove is provided with a return pipe for recovering the electroplating liquid.
Through the technical scheme, when the bonding wire is electroplated by using the electroplating bath, electroplating solution is continuously input towards the inner groove by using the liquid inlet pipe, so that the liquid level of the electroplating solution in the inner groove is higher than the through opening arranged at the top of the inner groove, and the overflowing electroplating solution reenters the liquid inlet pipe under the external power through the return pipe; when the bonding wire to be electroplated passes through the opening, the bonding wire can be completely immersed in electroplating solution, so that the electroplating effect of the bonding wire is better, and the production quality of the bonding wire is improved.
Preferably, the middle part level of inside groove is provided with the air brake that is used for carrying out the buffering to the plating solution that gets into, has vertically seted up a plurality of perforation on the air brake, and the air brake is higher than the export of feed liquor pipe.
Through above technical scheme, when the plating solution passes through the continuous entering of feed liquor pipe to the inside groove, utilize the brake can reduce the kinetic energy of plating solution for the liquid level of the plating solution in the inside groove is close the horizontal plane more, in order to guarantee that the bonding wire can submerge completely in the plating solution, guarantees the electroplating effect of bonding wire, can also play the effect of filtering the granular impurity in the plating solution simultaneously.
Preferably, the through opening of the inner groove is a U-shaped opening, a stop block is detachably mounted at the through opening, and slots matched with the through opening are formed in the two sides of the stop block; a plurality of gaps for the bonding wires to penetrate through are arranged on the stop block at intervals.
Through above technical scheme, utilize the dog that is provided with the breach to install in the crossing department of inside groove, can reduce the flow that the plating solution passes through the opening part, further promote the liquid level of the plating solution in the inside groove, guarantee that the bonding wire can be better submergence in the plating solution, further guarantee the electroplating effect of bonding wire.
Preferably, the notch is a vertically arranged opening, one side of the stop block close to the inside of the inner groove is vertically provided with a plurality of sockets, the sockets and the notch are arranged alternately, and a partition board used for separating the top space of the inner groove is inserted into each socket.
Through above technical scheme, utilize the baffle that sets up on the dog to separate into different spaces with the inside groove, can form the vortex under the combined action of the inner wall of baffle and inside groove when the plating solution gets into, kinetic energy when further reducing the plating solution and getting into the inside groove, and then the liquid level that maintains the plating solution tends to the horizontality.
Preferably, a guide mechanism for guiding the bonding wire is arranged at the gap of the outer groove, the guide mechanism comprises an installation seat with a U-shaped cross section, a plurality of guide wheels for winding the bonding wire are rotatably installed in the installation seat, the rotating direction of the guide wheels is perpendicular to the distribution direction of the plurality of gaps, and the guide wheels are in one-to-one correspondence with the gaps and are arranged linearly.
Through the technical scheme, when the bonding wire is electroplated, the bonding wire can be guided by the guide mechanism, so that the possibility of interference between the bonding wire and the inner groove and/or the outer groove is reduced, the possibility of breakage of the bonding wire is further reduced, and the production quality of the bonding wire is ensured.
Preferably, the inner walls of the mounting seats which are arranged oppositely are respectively vertically provided with sliding grooves which are arranged oppositely, sliding blocks are arranged in the sliding grooves in a sliding manner, and a rotating shaft is fixed between the two sliding blocks; a long hole is vertically formed in the mounting seat, the guide wheel is rotatably arranged on the rotating shaft, and the long hole is communicated with the bottom of the sliding groove; an adjusting bolt penetrates through the long hole and is in threaded connection with the sliding block.
Through above technical scheme, utilize the sliding block that sets up in the spout, can conveniently adjust the relative height between sliding block and the mount pad, can adjust the relative position of sliding block and setting up the mouth of crossing on inside groove, water jacket, use adjusting bolt to fix the sliding block, further reduce bonding wire and the possibility that the mouth of crossing of inside groove and/or water jacket takes place to interfere, improved the practicality of device.
Preferably, the rotating shaft is made of tungsten steel.
Through the technical scheme, the wear resistance of the rotating shaft can be improved by adopting the tungsten steel and the rotating shaft manufactured by the tungsten steel, so that the wear resistance and the service life of the device are prolonged.
Preferably, a threaded hole is vertically formed in the sliding block, a positioning bolt is connected to the threaded hole in a threaded mode, the end portion of the positioning bolt is abutted to the bottom of the mounting seat, and the positioning bolt is used for conveniently adjusting the relative height between the sliding block and the mounting seat.
Through above technical scheme, when adjusting the relative position of sliding block and mount pad, can rotate positioning bolt according to actual conditions, can order about the sliding block and move along the length direction of spout for the process of adjusting the sliding block is more convenient, further improves the practicality of device.
Preferably, the top of the inner and outer tanks is provided with a sealing cap for preventing external contaminants from entering the plating solution.
Through the technical scheme, when the bonding wire is electroplated and produced by using the electroplating bath, the possibility that external pollutants pollute electroplating solution can be reduced by using the sealing cover, and the electroplating quality of the bonding wire is further ensured.
Compared with the prior art, the utility model discloses one of following beneficial effect has at least:
1. when the device is used for electroplating the bonding wire, the bonding wire can be completely immersed, and the production quality of the bonding wire is ensured;
2. the speed reducing plate arranged on the inner groove can be used for reducing the speed of the electroplating solution entering the inner groove, so that the kinetic energy of the electroplating solution is reduced, the electroplating solution in the inner groove tends to be in a horizontal state, the bonding wire can be completely immersed in the electroplating solution, and the electroplating quality of the bonding wire is ensured;
3. the bonding wire entering the electroplating pool can be guided by the guide mechanism, so that the possibility of breakage of the bonding wire and the electroplating pool is reduced, and the production quality of products is further ensured.
Drawings
FIG. 1 is a schematic overall structure diagram of an embodiment of the present application;
FIG. 2 is a schematic view of the structure of FIG. 1 with the cover removed;
FIG. 3 is a schematic view of the structure of FIG. 1 from another angle;
FIG. 4 is a partial exploded view of the inner tank, guide mechanism and titanium basket;
FIG. 5 is a schematic structural view of a stopper;
fig. 6 is an exploded view of the guide mechanism.
In the above drawings: 1. an inner tank; 11. a liquid inlet pipe; 2. an outer tank; 21. a return pipe; 3. passing through the opening; 4. a speed reduction plate; 5. a stopper; 51. a slot; 52. a notch; 53. a bell and spigot joint; 6. a partition plate; 7. a guide mechanism; 71. a mounting seat; 711. a chute; 712. a long hole; 72. a guide wheel; 73. a sliding block; 731. a threaded hole; 74. a rotating shaft; 75. adjusting the bolt; 76. positioning a bolt; 8. sealing the cover; 9. a titanium basket; 91. and (4) a conductive bar.
Detailed Description
The technical solution of the present invention will be further explained with reference to the accompanying drawings and embodiments.
A bonding wire electroplating bath, refer to fig. 1-6, including inner tank 1 and outer tank 2, both of them are the hollow and open-topped components, the volume of the inner tank 1 is smaller than the outer tank 2, the inner tank 1 is set up in the inner of the outer tank 2, there are through openings 3 used for the bonding wire to pass in the straight line in the top edge of the inner tank 1 and outer tank 2; a liquid inlet pipe 11 for introducing the plating liquid is provided at the bottom of the inner tank 1, and a return pipe 21 for recovering the plating liquid is provided at the bottom of the outer tank 2.
When the electroplating bath is used for electroplating the bonding wire, the bonding wire is arranged in the through opening 3 of the inner groove 1 and the outer groove 2 in a penetrating mode, electroplating solution is continuously filled into the inner groove 1 by the liquid inlet pipe 11, the electroplating solution overflows from the through opening 3, when the electroplating solution overflows the inner groove 1, the liquid level of the electroplating solution in the inner groove 1 is higher than the through opening 3, when the bonding wire is electroplated through the through opening 3, the bonding wire can be completely immersed in the electroplating solution, the surface of the bonding wire can be completely electroplated, and the improvement of the production quality of the bonding wire is facilitated.
The inner tank 1 and the outer tank 2 can be made into cuboid members by adopting resin plates for bonding, and the service life and the reliability of the device can be improved by utilizing the characteristics of corrosion resistance and high temperature resistance of the resin plates; the inner groove 1 is fixedly bonded inside the outer groove 2, and the inner groove 1 is positioned in the middle of the bottom surface of the outer groove 2. The liquid inlet pipe 11 and the return pipe 21 can be made of corrosion-resistant and high-temperature-resistant material conveying pipes, the liquid inlet pipe 11 is fixed at the bottom of the inner groove 1 in the bonding and fixing direction, and the bottom of the inner groove 1 is provided with two liquid inlet pipes 11; the return pipes 21 are disposed at the bottom of the outer tank 2 and are not communicated with the inner tank 1, and the number of the return pipes is made as required so that the flow rate of the liquid inlet pipe 11 is not less than the flow rate of the return pipes 21.
The middle part of the inner groove 1 is horizontally provided with a speed reducing plate 4 for buffering the entering electroplating solution, the speed reducing plate 4 is a flat-plate-shaped member, a plurality of through holes are vertically formed in the speed reducing plate 4, and the speed reducing plate 4 is higher than the outlet of the liquid inlet pipe 11. When the plating solution got into interior groove 1, the action of slowing down can be played in the reduction gear 4, reduces the kinetic energy of plating solution for the plating solution gets into can be quick after interior groove 1 makes the liquid level of interior groove 1 tend to the horizontality, makes the effect of bonding wire submergence in the plating solution better.
It can make as required to cross mouthful 3, can make into perforation or U-shaped opening, the mouth 3 of crossing of inside groove 1 is the U-shaped opening, the rectangle form opening is makeed into to this department, 3 demountable installation has dog 5 in this crossing, dog 5 can adopt the resin plate preparation, be provided with in the both sides of dog 5 with the slot 51 of crossing a 3 adaptations, dog 5 inserts the mouth 3 department of crossing of establishing inside groove 1 through the slot 51 that sets up in its both sides, the interval is provided with a plurality of breachs 52 that are used for wearing to establish the bonding wire on dog 5, breach 52 is long banding U-shaped opening, its opening sets up towards the bottom.
A plurality of bell sockets 53 are vertically arranged on one side of the stop block 5 close to the inner part of the inner groove 1, the bell sockets 53 and the notches 52 are arranged alternately, and a partition plate 6 for separating the top space of the inner groove 1 is inserted in the bell sockets 53; the partition plates 6 may be made of a long resin plate, and the partition plates 6 partition the top space of the inner tank 1, thereby further reducing the kinetic energy of the plating solution entering the inner tank 1 and further leveling the surface of the plating solution in the inner tank 1.
A guide mechanism 7 for guiding the bonding wire is arranged at the opening 3 of the outer groove 2, the guide mechanism 7 comprises an installation seat 71 with a U-shaped cross section, and the installation seat 71 can be fixed on the outer side wall of the outer groove 2 by adopting a bolt; a plurality of guide wheels 72 for winding the bonding wires are rotatably mounted in the mounting seat 71, the guide wheels 72 are disk-shaped members, the rotating direction of the guide wheels 72 is perpendicular to the distribution direction of the plurality of through openings 3, and the guide wheels 72 are in one-to-one correspondence with the notches 52 and are arranged linearly.
The inner walls of the mounting seats 71 which are arranged oppositely are respectively vertically provided with sliding grooves 711, the two sliding grooves 711 are arranged oppositely, sliding blocks 73 are arranged in the sliding grooves 711 in a sliding manner, a rotating shaft 74 is fixed between the two sliding blocks 73, the rotating shaft 74 is made of tungsten steel, and the rotating shaft 74 made of tungsten steel is more wear-resistant and is beneficial to prolonging the service life of the device; a long hole 712 is vertically arranged on the mounting seat 71, the guide wheel 72 is rotatably arranged on the rotating shaft 74, and the long hole 712 is communicated with the bottom of the sliding groove 711; an adjusting bolt 75 penetrates through the long hole 712, the adjusting bolt 75 is in threaded connection with the sliding block 73, the adjusting bolt 75 is available in the prior art and can be purchased in the market, and the adjusting bolt 75 is in threaded connection with the sliding block 73; after the position of the sliding block 73 is adjusted, the sliding block 73 and the mounting seat 71 can be fastened by using the adjusting bolt 75, so that the possibility of relative positions of the sliding block 73 and the mounting seat is reduced, and the reliability of the device is improved.
A threaded hole 731 is vertically formed in the sliding block 73, a positioning bolt 76 is connected to the threaded hole 731 in an internal thread mode, and the positioning bolt 76 is in the prior art and can be obtained through market purchase; one end of the positioning bolt 76 is abutted against the bottom of the mounting seat 71, when the relative position of the sliding block 73 and the mounting seat 71 is adjusted, after the adjusting bolt 75 is loosened, the positioning bolt 76 is rotated, the sliding block 73 slides along the length direction of the sliding groove 711 under the interaction of the positioning bolt 76 and the mounting seat 71, and the positioning bolt 76 is used for conveniently adjusting the relative height between the sliding block 73 and the mounting seat 71, so that the adjusting process of the sliding block 73 is more convenient and faster; after the adjusting bolt 75 is used for fastening the sliding block 73, the positioning bolt 76 can also play a certain supporting role for the sliding block 73, so that the possibility of relative displacement between the sliding block 73 and the mounting seat 71 is further reduced, and the reliability of the device is further improved.
Be provided with closing cap 8 at the top of inner groove 1 and outer groove 2, closing cap 8 can adopt the resin board preparation, and closing cap 8 can adopt fixed or bolt fastening's mode demountable installation in the top of this plating bath of joint, and closing cap 8 is used for preventing external pollutant from getting into the plating solution.
In order to further improve the electroplating effect of the bonding wire, a titanium basket 9 is further installed in the inner groove 1, the titanium basket 9 is made of titanium alloy to be a net-shaped component, the titanium basket 9 is arranged above the speed reduction plate 4, the titanium basket 9 is arranged in the inner groove 1 in a bolt fixing mode, the size of the titanium basket 9 is made according to needs, the titanium basket 9 is connected with a conductive bar 91 for conveniently connecting a power supply anode, and the conductive bar 91 is a long-strip-shaped metal component; the reticular titanium basket 9 can make the charge ions in the electroplating solution more uniform, improve the conductivity, and then improve the electroplating effect of the device, and the titanium basket 9 is adopted as the anode to effectively prevent the anode from passivating, thereby improving the service life of the anode.
The application principle of the bonding wire electroplating bath is as follows:
the electroplating solution is input into the inner tank 1 by using the liquid inlet pipe 11, and can overflow into the outer tank 2 through the notch 52 on the stop block 5 after entering the inner tank 1, and is connected to the return pipe 21 by using a pump machine and communicated with the inner tank 1 by using a pipeline, and under the action of the pump machine, the overflowing electroplating solution is transmitted to the inner tank 1 again through the return pipe 21 by the action of the pump machine, so that the liquid level of the electroplating solution is higher than the through opening 3 of the inner tank 1; winding the bonding wires to be electroplated on a guide wheel 72 of the guide mechanism 7, and then penetrating and arranging the bonding wires in the notches 52 of the stop blocks 5 arranged on the inner groove 1 and the outer groove 2, so that the bonding wires are linearly distributed in the inner groove 1; and after the bonding wire is arranged in a penetrating way, the bonding wire and the titanium basket 9 are connected with a power supply, and the bonding wire is subjected to electroplating processing. The bonding wire can be better immersed in the electroplating solution by using the device, and the processing quality of products is improved.
When the bonding wire is arranged in a penetrating way, the possibility of interference between the bonding wire and the electroplating bath can be reduced by adjusting the relative height between the sliding block 73 and the mounting seat 71, and the possibility of breakage of the bonding wire is further reduced; meanwhile, the height of the bonding wire can be adjusted, so that the bonding wire can be better immersed in electroplating solution, the electroplating effect of the bonding wire is improved, and the practicability and the reliability of the device are improved.
Finally, although the present invention has been described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that the present invention can be modified or replaced by other means without departing from the spirit and scope of the present invention, which should be construed as limited only by the appended claims.
Claims (9)
1. A bonding wire plating bath is characterized in that: the bonding wire fixing device comprises an inner groove (1) and an outer groove (2), wherein the inner groove (1) and the outer groove (2) are both hollow members, the tops of the inner groove and the outer groove are arranged in an open mode, the volume of the inner groove (1) is smaller than that of the outer groove (2), the inner groove (1) is arranged inside the outer groove (2), and through openings (3) for bonding wires to pass through are linearly arranged at the top edges of the inner groove (1) and the outer groove (2); a liquid inlet pipe (11) for inputting the plating solution is arranged at the bottom of the inner tank (1), and a return pipe (21) for recovering the plating solution is arranged at the bottom of the outer tank (2).
2. The bonding wire plating bath of claim 1, wherein: the middle part level of inside groove (1) is provided with and is used for carrying out the air brake (4) that cushion to the plating solution that gets into, and a plurality of perforation have vertically been seted up on air brake (4), and air brake (4) are higher than the export of feed liquor pipe (11).
3. The bonding wire plating bath of claim 1, wherein: the through opening (3) of the inner groove (1) is a U-shaped opening, a stop block (5) is detachably mounted at the through opening (3), and inserting grooves (51) matched with the through opening (3) are formed in two sides of the stop block (5); a plurality of notches (52) for the bonding wires to penetrate through are arranged on the stop block (5) at intervals.
4. The bonding wire plating bath of claim 3, wherein: the notch (52) is a vertically arranged opening, one side of the stop block (5) close to the interior of the inner groove (1) is vertically provided with a plurality of bell sockets (53), the bell sockets (53) and the notch (52) are arranged alternately, and a partition plate (6) used for separating the top space of the inner groove (1) is inserted into the bell sockets (53).
5. The bonding wire plating bath of claim 1, wherein: the bonding wire guiding device is characterized in that a guiding mechanism (7) used for guiding the bonding wire is arranged at the position of the through hole (3) of the outer groove (2), the guiding mechanism (7) comprises an installation seat (71) with a U-shaped cross section, a plurality of guiding wheels (72) used for winding the bonding wire are rotatably installed on the installation seat (71), the rotating direction of the guiding wheels (72) is perpendicular to the distribution direction of the through holes (3), and the guiding wheels (72) correspond to the notches (52) one to one and are arranged in a straight line.
6. The bonding wire plating bath as claimed in claim 5, wherein: the inner walls of the mounting seats (71) which are arranged oppositely are respectively vertically provided with sliding grooves (711), the sliding grooves (711) are arranged oppositely, sliding blocks (73) are arranged in the sliding grooves (711) in a sliding manner, and a rotating shaft (74) is fixed between the two sliding blocks (73); a long hole (712) is vertically formed in the mounting seat (71), the guide wheel (72) is rotatably arranged on the rotating shaft (74), and the long hole (712) is communicated with the bottom of the sliding groove (711); an adjusting bolt (75) penetrates through the long hole (712), and the adjusting bolt (75) is in threaded connection with the sliding block (73).
7. The bonding wire plating bath as claimed in claim 6, wherein: the rotating shaft (74) is made of tungsten steel.
8. The bonding wire plating bath as claimed in claim 6, wherein: sliding block (73) are gone up and vertically are provided with screw hole (731), have positioning bolt (76) at screw hole (731) female connection, and positioning bolt (76)'s tip and the bottom butt of mount pad (71), and positioning bolt (76) are used for conveniently adjusting the relative height between sliding block (73) and mount pad (71).
9. The bonding wire plating bath of claim 1, wherein: and sealing covers (8) are arranged at the tops of the inner groove (1) and the outer groove (2), and the sealing covers (8) are used for preventing external pollutants from entering the electroplating solution.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221099095.3U CN217536210U (en) | 2022-05-09 | 2022-05-09 | Bonding wire plating bath |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221099095.3U CN217536210U (en) | 2022-05-09 | 2022-05-09 | Bonding wire plating bath |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217536210U true CN217536210U (en) | 2022-10-04 |
Family
ID=83433670
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221099095.3U Expired - Fee Related CN217536210U (en) | 2022-05-09 | 2022-05-09 | Bonding wire plating bath |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217536210U (en) |
-
2022
- 2022-05-09 CN CN202221099095.3U patent/CN217536210U/en not_active Expired - Fee Related
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Granted publication date: 20221004 |