CN209759625U

CN209759625U - Electroplating bath

Info

Publication number: CN209759625U
Application number: CN201920566816.9U
Authority: CN
Inventors: 王伏志
Original assignee: Suzhou Shanchuan Mechanical Equipment Co Ltd
Current assignee: Suzhou Shanchuan Mechanical Equipment Co Ltd
Priority date: 2019-04-24
Filing date: 2019-04-24
Publication date: 2019-12-10
Anticipated expiration: 2029-04-24

Abstract

The utility model discloses an electroplating bath, which comprises a bath body, a clapboard, a perfusion tube, a first guide plate and a second guide plate, wherein the clapboard divides the bath body into an electroplating area and a buffer area, and the edge part of the clapboard is provided with a through hole for communicating the electroplating area and the buffer area; the buffer area is provided with a transfusion tube; a gap is reserved between the lower bottom surface of the second guide plate and the upper surface of the partition plate, and the gap is lower than the upper surface of the first guide plate; the first guide plate and the side wall of the tank body form an upper water flow channel; the first guide plate and the second guide plate form a lower water flow channel. The electroplating solution passes through the buffer zone, the upper water flow channel and the lower water flow channel to be slowly and stably injected into the electroplating zone, so that bubbles generated in the electroplating solution injection process are reduced, and the electroplating quality is improved.

Description

Electroplating bath

Technical Field

The utility model relates to the technical field of electroplating, in particular to electroplating bath.

background

When electroplating, the bubble in the plating solution can be attached to the surface of plated item to influence electroplating quality, conventional plating bath is with the direct pouring of plating solution in the plating bath, and the plating solution is at the in-process of pouring, and the plating solution can produce and roll and the torrent, can lead to inhaling more air, produces more bubbles, and the quality of electroplating is influenced to such plating solution.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a plating bath, plating bath are equipped with the runner of going up water and the lower runner that buffer zone and first guide plate and second guide plate formed, make the slow steady pouring of plating solution go into the electroplating zone, have solved the direct pouring of plating solution and have electroplated the district and the gassing of electroplating into, influence the problem of electroplating the quality.

To achieve the purpose, the utility model adopts the following technical proposal:

The electroplating bath comprises a bath body, a partition plate, a liquid conveying pipe, a first guide plate and a second guide plate, wherein the bath body is divided into an electroplating area and a buffer area by the partition plate, and a through hole for communicating the electroplating area with the buffer area is formed in the edge part of the partition plate; the buffer area is provided with a transfusion tube;

the first guide plate is fixed on the upper surface of the partition plate, the through hole is formed in one side of the first guide plate, and the second guide plate is arranged on the other side of the first guide plate;

A gap is reserved between the lower bottom surface of the second guide plate and the upper surface of the partition plate, and the gap is lower than the upper surface of the first guide plate;

The first guide plate and the side wall of the tank body form an upper water flow channel; the first guide plate and the second guide plate form a lower water flow channel.

From this, the buffer is filled earlier to the plating solution, through the perforating hole upstream advance first guide plate and the last rivers way that the lateral wall of cell body formed, after the plating solution rises to the upper surface of first guide plate, overflow to the lower rivers way that first guide plate and second guide plate formed in and the downward flow pours into the electroplating zone into, the plating solution passes through the buffer in proper order, go up the circuitous runner that rises earlier of rivers way and lower rivers way and descend again, pour into the electroplating zone into at last, the slow steady flow of whole process plating solution, avoid the direct slope of plating solution to pour into the electroplating zone and produce the bubble, influence electroplating quality. Moreover, the buffer area and the circuitous flow passage are arranged to prolong the time of injecting the electroplating solution into the electroplating area, so that bubbles in the electroplating solution can be effectively released, the flowing stability is improved, and the electroplating quality is improved.

in some embodiments, the gap between the first baffle and the second baffle is between 6mm to 12 mm. Therefore, the gap is arranged between 6mm and 12mm, so that the electroplating solution can flow downwards along the flow channel formed by the first guide plate and the second guide plate, if the gap is too large, the flow direction of the electroplating solution can not be limited, and if the gap is too small, the flow of the electroplating solution can not be facilitated. The gap is the transverse width of the sewer flow channel, namely the distance between two opposite surfaces of the first guide plate and the second guide plate.

In some embodiments, a side of the first baffle adjacent to the second baffle is provided with a sloped flow directing surface. Therefore, the electroplating solution flows towards the direction of the second guide plate after overflowing the upper surface of the first guide plate, the drainage surface is favorable for smoothly leading the electroplating solution into a lower water flow channel formed by the first guide plate and the second guide plate, and bubbles generated by sputtering of the electroplating solution generated in side overflow and downward flow are reduced.

In some embodiments, the infusion tube includes a plurality of water outlet holes and a liquid inlet, wherein the water outlet direction of the water outlet holes is obliquely arranged downwards, and the liquid inlet extends to the outer side of the trough body. From this, the inlet links to each other with the delivery pump, carries the plating solution to the buffer, and the play water direction of apopore sets up the steady buffer of filling by supreme down of convenient plating solution to reduce and roll and torrent, thereby reduce the bubble.

In some embodiments, the electroplating area is provided with a shielding device, the shielding device comprises a detachable shielding block, and the shielding block is provided with a clamping groove. Therefore, the clamping groove is matched with the electroplating workpiece, the edge of the electroplating workpiece or a certain part of the electroplating workpiece is placed in the clamping groove, and the effect that the part of the electroplating workpiece is not electroplated or electroplating is reduced is achieved. The material of the shielding block is epoxy resin.

In some embodiments, the shielding device further includes a base and a positioning block, the base is disposed on the partition, the positioning block is disposed on an upper surface of the base, and the shielding block is provided with a positioning groove matched with the positioning block. From this, the shielding piece passes through the constant head tank joint on the locating piece of base, and the installation is very convenient with the dismantlement. The base and the positioning block are both made of epoxy resin.

In some embodiments, the shield block is provided with a removal threaded hole that disengages the shield block from the base. Therefore, the screw is screwed in and detached from the threaded hole, the bottom surface of the screw is abutted to the upper surface of the base, the shielding block is ejected from the base by intermittently rotating the screw under the reaction force, the positioning groove is finally separated from the positioning block to complete detachment, and the detachment mode is very convenient.

In some embodiments, the electroplating device further comprises a liquid level adjusting device, the liquid level adjusting device comprises an overflow port and a baffle gate, the overflow port is arranged on the side wall of the tank body and is communicated with the electroplating area, and the baffle gate movably adjusts the opening degree of the overflow port. Therefore, different heights of the electroplating solution are adjusted according to the working conditions of different electroplated parts, and the application range of the electroplating bath is expanded.

In some embodiments, the liquid level adjusting device further includes an adjusting screw, a support block, and a sliding groove, the sliding groove is disposed on the side wall of the tank body, the barrier gate is slidably disposed in the sliding groove, the barrier gate is provided with a threaded hole matched with the adjusting screw, the support block is disposed on the upper surface of the tank body, and the adjusting screw is rotatably connected to the support block. From this, drive the fender floodgate through screw rod helicitic texture and remove along the spout to adjust the aperture of overflow mouth, realize regulating and control the liquid level of plating solution.

In some embodiments, the electrode device comprises an electrode frame and a lifting frame, the electrode frame is provided with a hanging buckle, and the lifting frame is fixed on the upper surface of the tank body; the side of the groove body is provided with a fixed groove. Whereby the electrode frame is used for placing electrodes; the lifting frame is convenient for fixing the electrode frame in the electroplating bath and also convenient for extracting and transferring the electrode frame. The fixing groove is used for fixing the electroplating workpiece.

The utility model has the advantages that: the electroplating bath is provided with a buffer area and a circuitous flow passage of an upper flow passage and a lower flow passage formed by a first flow guide plate and a second flow guide plate, so that the electroplating solution passes through the buffer area, the upper flow passage and the lower flow passage in sequence and is slowly and stably injected into the electroplating area, and bubbles generated in the process of pouring the electroplating solution into the electroplating area are avoided; moreover, the buffer area is beneficial to relieving turbulence and rolling phenomena generated in the flowing of the electroplating solution and releasing internal bubbles; moreover, the circuitous flow channel which ascends and then descends is beneficial to the smooth injection of the electroplating solution, so that the electroplating bath has a simple structure, the generation of bubbles is effectively avoided, and the electroplating quality is effectively improved. Finally, the electroplating bath is also provided with a shielding device and a liquid level adjusting device, so that the use range is expanded, and the electroplating bath is more suitable for electroplating of different workpieces.

Drawings

FIG. 1 is a view showing a structure of an electroplating bath according to an embodiment of the present invention;

FIG. 2 is a partial enlarged structural view at C of FIG. 1;

FIG. 3 is a top view of an electroplating bath according to an embodiment of the present invention;

FIG. 4 is a sectional view taken along line A-A of FIG. 3;

FIG. 5 is a view showing a cross section B-B of FIG. 3;

FIG. 6 is a partial enlarged view of the structure of FIG. 5 at D;

wherein: 1. a trough body; 11. fixing grooves; 2. a partition plate; 21. a through hole; 3. a transfusion tube; 31. a water outlet hole; 32. a liquid inlet; 4. a first baffle; 41. a drainage surface; 5. a second baffle; 6. a shielding device; 61. a shielding block; 611. a card slot; 612. positioning a groove; 613. disassembling the threaded hole; 62. a base; 63. positioning blocks; 7. an electrode arrangement; 71. an electrode frame; 711. hanging and buckling; 72. lifting the frame; 8. a liquid level regulating device; 81. an overflow port; 82. blocking; 83. adjusting the screw rod; 84. a support block; 85. a chute; 100. a buffer area; 200. an electroplating area; 210. a water feeding flow passage; 220. a sewage runner.

Detailed Description

The present invention will be described in further detail with reference to the accompanying drawings.

as shown in fig. 1 to 5, the electroplating tank comprises a tank body 1, a partition plate 2, a liquid conveying pipe 3, a first flow guide plate 4 and a second flow guide plate 5, wherein the tank body 1 is divided into an electroplating area 200 and a buffer area 100 by the partition plate 2, and a through hole 21 communicating the electroplating area 200 and the buffer area 100 is arranged at the edge part of the partition plate 2; the buffer area 100 is provided with a transfusion tube 3; the first guide plate 4 is fixed on the upper surface of the baffle plate 2, the through hole 21 is arranged on one side of the first guide plate 4, and the second guide plate 5 is arranged on the other side of the first guide plate 4; a gap is reserved between the lower bottom surface of the second guide plate 5 and the upper surface of the partition plate 2 and is lower than the upper surface of the first guide plate 4;

The first guide plate 4 and the side wall of the tank body 1 form an upper water flow channel 210; the first guide plate 4 and the second guide plate 5 form a lower water flow passage 220.

Further, the gap between the first guide plate 4 and the second guide plate 5 is between 6mm and 12 mm.

Further, as shown in fig. 4, the first baffle 4 has an inclined flow-guiding surface 41 on a side thereof close to the second baffle 5.

Further, as shown in fig. 4 and 5, the infusion tube 3 includes a plurality of water outlet holes 31 and a liquid inlet 32, the water outlet direction of the water outlet holes 31 is set obliquely downward, and the liquid inlet 32 extends to the outside of the tank body 1.

Further, as shown in fig. 4 and 5, the electroplating area 200 is provided with a shielding device 6, the shielding device 6 includes a detachable shielding block 61, and the shielding block 61 is provided with a clamping groove 611.

further, the shielding device 6 further includes a base 62 and a positioning block 63, the base 62 is disposed on the partition board 2, the positioning block 63 is disposed on the upper surface of the base 62, and the shielding block 61 is provided with a positioning groove 612 engaged with the positioning block 63.

Further, as shown in fig. 6, the shield block 61 is provided with a removal screw hole 613 for detaching the shield block 61 from the base 62.

further, as shown in fig. 1 and 2, the electroplating tank further includes a liquid level adjusting device 8, the liquid level adjusting device 8 includes an overflow port 81 and a damper 82, the overflow port 81 is disposed on a side wall of the tank body 1 and is communicated with the electroplating area 200, and the damper 82 movably adjusts an opening degree of the overflow port 81.

Further, as shown in fig. 1 and fig. 2, the liquid level adjusting device 8 further includes an adjusting screw 83, a supporting block 84, and a sliding slot 85, the sliding slot 85 is disposed on the side wall of the tank body 1, the damper 82 is slidably disposed in the sliding slot 85, the damper 82 is provided with a threaded hole matched with the adjusting screw 83, the supporting block 84 is disposed on the upper surface of the tank body 1, and the adjusting screw 83 is rotatably connected to the supporting block 84.

Further, as shown in fig. 1, 4 and 5, the electroplating bath further includes an electrode assembly 7 and a fixing groove 11, the electrode assembly 7 includes an electrode frame 71 and a lifting frame 72, the electrode frame 71 is provided with a hanging buckle 711, and the lifting frame 72 is fixed on the upper surface of the bath body 1; the side of the tank body 1 is provided with a fixing groove 11.

The working principle is as follows: the electroplating area 200 of the electroplating bath is provided with a shielding device 6, a base 62 is fixed on the partition plate 2 through a titanium material screw, a positioning block 63 is fixed on the base 62 through a titanium material screw, a proper shielding block 61 is firstly installed on the base 62 before electroplating, the shielding block 61 is provided with a positioning groove 612, and installation can be completed as long as the positioning groove 612 is pressed into the positioning block 63.

The two end parts of the electroplating workpiece are respectively placed in the fixing grooves 11, and the edge or part of the surface of the electroplating workpiece, which does not need to be electroplated, is clamped into the clamping groove 611 of the shielding block 61, so as to shield the electroplating solution from contacting. After the plating work is fixed, the electrode unit 7 with the electrodes placed thereon is placed in the plating zone 200.

Then, the plating solution flows from the liquid inlet 32 of the liquid conveying pipe 3 to the water outlet hole 31 under the action of the conveying pump, flows out downwards from the water outlet hole 31, fills the buffer area 100 from bottom to top, flows into the upper water flow channel 210 formed by the first guide plate and the side wall of the tank body 1 through the through hole 21 of the partition plate 2 and flows upwards, when the electroplating solution overflows the upper surface of the first flow guide plate 4, the electroplating solution flows along the flow guide surface 41 to the direction of the second flow guide plate 5, and flows down into the plating zone 200 in the lower water flow passage 220 formed by the second guide plate 5 and the first guide plate 4, therefore, the whole injection process of the electroplating solution is very slow and stable, the generation of bubbles is effectively reduced, in addition, turbulence and tumbling of the plating solution generated during the flow process are reduced in the buffer area 100, bubbles in the plating solution are partially released, and the plating solution is smoothly injected into the plating area 200 without being affected by the flow direction in the buffer area 100 by the upward and downward circuitous flow.

finally, the adjusting screw 83 is rotated to adjust the position of the damper 82 to make the liquid level of the plating solution appropriate, so that the workpiece can be plated.

The whole electroplating bath has complete functions, is convenient to use, is suitable for electroplating workpieces of various specifications, and has good electroplating quality.

What has been described above are only some embodiments of the invention. For those skilled in the art, without departing from the inventive concept, several modifications and improvements can be made, which are within the scope of the invention.

Claims

1. The electroplating bath is characterized by comprising a bath body (1), a partition plate (2), an infusion tube (3), a first guide plate (4) and a second guide plate (5), wherein the bath body (1) is divided into an electroplating area (200) and a buffer area (100) by the partition plate (2), a through hole (21) communicating the electroplating area (200) with the buffer area (100) is formed in the edge part of the partition plate (2), and the infusion tube (3) is arranged in the buffer area (100);

The first guide plate (4) is fixed on the upper surface of the partition plate (2), the through hole (21) is formed in one side of the first guide plate (4), and the other side of the first guide plate (4) is provided with a second guide plate (5);

A gap is reserved between the lower bottom surface of the second guide plate (5) and the upper surface of the partition plate (2), and the gap is lower than the upper surface of the first guide plate (4);

The first guide plate (4) and the side wall of the tank body (1) form an upper water flow channel (210), and the first guide plate (4) and the second guide plate (5) form a lower water flow channel (220).

2. the plating cell of claim 1, wherein the gap between the first flow deflector (4) and the second flow deflector (5) is between 6mm and 12 mm.

3. The plating tank of claim 1, wherein the side of the first flow guide plate (4) close to the second flow guide plate (5) is provided with an inclined flow guide surface (41).

4. the electroplating bath according to claim 1, wherein the liquid conveying pipe (3) comprises a plurality of water outlet holes (31) and a liquid inlet (32), the water outlet direction of the water outlet holes (31) is obliquely arranged downwards, and the liquid inlet (32) extends to the outer side of the tank body (1).

5. The electroplating tank according to claim 1, characterized in that the electroplating area (200) is provided with a shielding device (6), the shielding device (6) comprises a detachable shielding block (61), and the shielding block (61) is provided with a clamping groove (611).

6. The electroplating tank according to claim 5, wherein the shielding device (6) further comprises a base (62) and a positioning block (63), the base (62) is arranged on the partition plate (2), the positioning block (63) is arranged on the upper surface of the base (62), and the shielding block (61) is provided with a positioning groove (612) matched with the positioning block (63).

7. The plating cell of claim 6, wherein the shield block (61) is provided with a removal threaded hole (613) for detaching the shield block (61) from the base (62).

8. The electroplating tank as claimed in claim 1, further comprising a liquid level adjusting device (8), wherein the liquid level adjusting device (8) comprises an overflow port (81) and a baffle gate (82), the overflow port (81) is arranged on the side wall of the tank body (1) and is communicated with the electroplating area (200), and the baffle gate (82) movably adjusts the opening degree of the overflow port (81).

9. the electroplating tank as claimed in claim 8, wherein the liquid level adjusting device (8) further comprises an adjusting screw (83), a supporting block (84) and a sliding groove (85), the sliding groove (85) is formed in the side wall of the tank body (1), the baffle gate (82) is slidably arranged in the sliding groove (85), the baffle gate (82) is provided with a threaded hole matched with the adjusting screw (83), the supporting block (84) is arranged on the upper surface of the tank body (1), and the adjusting screw (83) is rotatably connected to the supporting block (84).

10. The electroplating tank according to any one of claims 1 to 9, further comprising an electrode device (7) and a fixing groove (11), wherein the electrode device (7) comprises an electrode frame (71) and a lifting frame (72), the electrode frame (71) is provided with a hanging buckle (711), and the lifting frame (72) is fixed on the upper surface of the tank body (1); and a fixing groove (11) is arranged on the side of the groove body (1).