CN217203034U - Plating bath capable of improving flow path and flow velocity of plating solution - Google Patents

Plating bath capable of improving flow path and flow velocity of plating solution Download PDF

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Publication number
CN217203034U
CN217203034U CN202220523327.7U CN202220523327U CN217203034U CN 217203034 U CN217203034 U CN 217203034U CN 202220523327 U CN202220523327 U CN 202220523327U CN 217203034 U CN217203034 U CN 217203034U
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spray gun
plating
electroplating bath
plate
limiting
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CN202220523327.7U
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王军
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Hunan Changde Pinwang Electroplating Technology Co ltd
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Hunan Changde Pinwang Electroplating Technology Co ltd
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P10/00—Technologies related to metal processing
    • Y02P10/20—Recycling

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Abstract

The utility model discloses an improve plating bath of plating solution flow path velocity of flow, include: the electroplating bath comprises an electroplating bath body, wherein the left side of the electroplating bath body is provided with an installation shell, the inner side of the installation shell is provided with a side spray gun, the lower side of the side spray gun is provided with a circulating pipe communicated with the inner side of the electroplating bath body, and the left side of the side spray gun is provided with a circulating pump box body for circulating electroplating solution; the cover sealing mechanism is arranged on the upper side of the electroplating bath body, a material placing mechanism is arranged on the lower side of the cover sealing mechanism, and a lower spray gun communicated with the lower end of the side spray gun is arranged on the lower side of the material placing mechanism; and the separation plate is arranged on the inner side of the electroplating bath body, the rear side of the separation plate is provided with a guide plate, and the left side of the inner end of the guide plate is provided with a guide block. This improve plating bath of plating solution flow path velocity of flow has improved the velocity of flow of plating solution, ensures the electroplating effect, and can carry out certain sealed to the plating bath, avoids the harmful substance that probably exists to spill over in the plating solution.

Description

Plating bath capable of improving flow path and flow velocity of plating solution
Technical Field
The utility model relates to an electroplate relevant technical field, specifically be an improve plating bath of plating solution flow velocity of flow.
Background
Electroplating is a process of plating a thin layer of other metals or alloys on the surface of some metals by using the principle of electrolysis, and is a process of attaching a layer of metal film on the surface of a metal or other material product by using the action of electrolysis, thereby having the effects of preventing metal oxidation (such as corrosion), improving wear resistance, conductivity, light reflection, corrosion resistance (such as copper sulfate and the like), enhancing the appearance and the like.
An environment-friendly electroplating bath convenient to clean, which is disclosed as CN208701243U in the granted publication of Chinese patent, and relates to the technical field of electroplating baths. The environment-friendly electroplating bath convenient to clean comprises an upper electroplating bath and a lower electroplating bath, wherein the bottom of the lower electroplating bath is communicated with a filtering chamber through a pipeline, a connecting part of the filtering chamber and the lower electroplating bath is communicated with a bottom valve, a filtering screen is fixedly mounted at the bottom of the filtering chamber, and a solution neutralizing chamber is fixedly connected to one side, far away from the filtering chamber, of the filtering screen. This environmental protection plating bath convenient to clearance, through last plating bath, lower plating bath, fixed guide, slider, central fixed tube, the joint setting of water service pipe and water jet, make the device can pour into the clear water into in the water service pipe through the water service port in the inside clearance process of plating bath carrying out, then clear water sprays on the plating bath inner wall through the water jet and carries out the inside clearance work of plating bath, the in-process water service pipe of plating bath rotates thereupon on rotating, makes abluent more comprehensive.
The above prior art solutions have the following drawbacks: it is not convenient for to the velocity of flow that improves the plating solution, leads to electroplating the effect relatively poor, and is not convenient for carry out certain sealed to the plating bath, leads to the harmful substance that probably exists in the plating solution to spill over easily, consequently, the utility model provides an improve plating bath of plating solution flow path velocity to solve the above-mentioned problem that proposes.
Disclosure of Invention
An object of the utility model is to provide an improve plating bath of plating solution flow path velocity of flow to the flow velocity of improving the plating solution is not convenient for that provides in solving above-mentioned background art, and is not convenient for carry out certain sealed problem to the plating bath.
In order to achieve the above object, the utility model provides a following technical scheme: a plating cell for improving a flow rate of a plating solution flow path, comprising:
the electroplating bath comprises an electroplating bath body, wherein the left side of the electroplating bath body is provided with an installation shell, the inner side of the installation shell is provided with a side spray gun, the lower side of the side spray gun is provided with a circulating pipe communicated with the inner side of the electroplating bath body, and the left side of the side spray gun is provided with a circulating pump box body for circulating electroplating solution;
the sealing mechanism is arranged on the upper side of the electroplating bath body, a material placing mechanism is arranged on the lower side of the sealing mechanism, and a lower spray gun communicated with the lower end of the side spray gun is arranged on the lower side of the material placing mechanism;
and the separation plate is arranged on the inner side of the electroplating bath body, the rear side of the separation plate is provided with a guide plate, and the left side of the inner end of the guide plate is provided with a guide block.
Preferably, the material placing mechanism comprises a limiting plate and a limiting rod;
and the lower end of the limiting plate is provided with a limiting rod.
Preferably, the gag lever post is equidistant setting around the downside of limiting plate, and the gag lever post all is equidistant crisscross setting with side spray gun and lower spray gun.
Preferably, the sealing mechanism comprises a mounting plate, a limiting column, a connecting column and a sealing ring;
the mounting plate is arranged on the upper side of the limiting plate;
the limiting column is arranged at the lower end of the mounting plate;
a connecting column mounted on the inner side of the limiting column;
and the single bodies of the sealing rings are respectively arranged on the upper side and the lower side of the limiting plate.
Preferably, the lower end longitudinal section of the limiting column is conical, the limiting column penetrates through the inner side of the limiting plate, and the connecting column penetrates through the mounting plate and the limiting column simultaneously and is in threaded connection with the electroplating bath body.
Preferably, the outlets of the side spray guns are uniformly arranged on the left side in the plating bath body.
Preferably, the outer side of the guide block is arranged in an inclined shape, and the cross section of the guide plate welded and fixed at the left end of the guide block is in an L shape.
Compared with the prior art, the beneficial effects of the utility model are that: the electroplating bath capable of improving the flow velocity of the electroplating solution flow path improves the flow velocity of the electroplating solution, ensures the electroplating effect, can carry out certain sealing on the electroplating bath, and avoids the overflow of harmful substances possibly existing in the electroplating solution;
1. the left side of the inside of the electroplating bath body is uniformly arranged through the outlet of the side spray gun, and the lower spray gun is arranged at equal intervals at the lower side of the inside of the electroplating bath body, so that the flow velocity in the electroplating bath body can be kept at the same speed, the same flow velocity of the electroplating solution is ensured, and the electroplating effect is ensured;
2. the longitudinal section of the lower end of the limiting column is conical, the limiting column penetrates through the inner side of the limiting plate, and the connecting column simultaneously penetrates through the mounting plate and the limiting column and is in threaded connection with the electroplating bath body, so that the sealing cover mechanism can limit the position of the material placing mechanism and compensate the existing gap by using the sealing ring, the sealing effect on the upper side of the electroplating bath body is ensured, and the overflow of harmful substances possibly existing in the electroplating bath is avoided;
3. the outside through the guide block is the transversal personally submitting "L" type of slope form setting and guide block left end welded fastening's guide board, can guide the plating solution that flows to this internal right side of plating bath, avoids it directly to carry out palirrhea and influence the plating solution velocity of flow to the left side.
Drawings
Fig. 1 is a schematic view of the front cross-sectional structure of the present invention;
FIG. 2 is a schematic view of the top view structure of the guide plate and the guide block of the present invention;
FIG. 3 is a schematic side view of the connection between the guiding plate and the plating bath body according to the present invention;
fig. 4 is an enlarged schematic structural view of a portion a in fig. 1 according to the present invention.
In the figure: 1. a plating bath body; 2. a material placement mechanism; 201. a limiting plate; 202. a limiting rod; 3. installing a shell; 4. a side spray gun; 5. a lower spray gun; 6. a capping mechanism; 601. mounting a plate; 602. a limiting column; 603. connecting columns; 604. a seal ring; 7. a circulating pump tank body; 8. a guide block; 9. a partition plate; 10. a circulation pipe; 11. a guide plate.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-4, the present invention provides a technical solution: the utility model provides an improve plating bath of plating solution flow path velocity of flow, includes that plating bath body 1 left side is installed and is installed installation shell 3, and the inboard of installation shell 3 is provided with side spray gun 4, and the circulating pipe 10 with plating bath body 1 inboard intercommunication is installed to the downside of side spray gun 4, and the left side of side spray gun 4 is installed and is used for the circulating pump box 7 of plating solution circulation. The sealing cover mechanism 6 is installed on the upper side of the electroplating bath body 1, the material placing mechanism 2 is arranged on the lower side of the sealing cover mechanism 6, the lower spray gun 5 communicated with the lower end of the side spray gun 4 is arranged on the lower side of the material placing mechanism 2, the material placing mechanism 2 comprises a limiting plate 201 and a limiting rod 202, the limiting rod 202 is installed at the lower end of the limiting plate 201, the sealing cover mechanism 6 comprises a mounting plate 601, a limiting column 602, a connecting column 603 and a sealing ring 604, the mounting plate 601 is arranged on the upper side of the limiting plate 201, the limiting column 602 is installed at the lower end of the mounting plate 601, the connecting column 603 is installed on the inner side of the limiting column 602, single bodies of the sealing rings 604 are respectively arranged on the upper side and the lower side of the limiting plate 201, the partition plate 9 is installed on the inner side of the electroplating bath body 1, a guide plate 11 is arranged on the rear side of the partition plate 9, and a guide block 8 is arranged on the left side of the inner end of the guide plate 11;
when the device is used, as shown in fig. 1, fig. 2 and fig. 4 specifically, after a material to be electroplated is placed in the material placing mechanism 2, the material placing mechanism 2 is integrally placed in the electroplating bath body 1, then the upper side of the material placing mechanism 2 is covered with the capping mechanism 6, the longitudinal section of the lower end of the limiting column 602 is tapered, the limiting column 602 penetrates through the inner side of the limiting plate 201, and the connecting column 603 simultaneously penetrates through the mounting plate 601 and the limiting column 602 and forms threaded connection with the electroplating bath body 1, so that the capping mechanism 6 can limit the material placing mechanism 2, and gaps among the limiting plate 201, the mounting plate 601 and the electroplating bath body 1 are compensated by using the sealing rings 604 arranged on the upper side and the lower side of the limiting plate 201, and the sealing performance is ensured;
as shown in FIGS. 1 and 2, the circulation pump installed in the circulation pump tank 7 is started to discharge the plating liquid circulated from the circulation pipe 10 into the plating vessel body 1 by the side lance 4 installed in the installation casing 3, thereby flowing the plating liquid in the plating vessel body 1, the outlet of the side spray gun 4 is evenly arranged at the left side in the plating bath body 1, the lower spray gun 5 is arranged at the lower side in the plating bath body 1 at equal intervals, so that the flow velocity in the plating bath body 1 can be kept at the same speed, the flow velocity of the plating solution is ensured to be the same, the plating effect is ensured, and after the plating solution flows to the plating bath body 1 right side, cross the outside of guide piece 8 and be the setting of slope form and the cross section of guide plate 11 of guide piece 8 left end welded fastening personally submits "L" type, can guide the plating solution that flows to the plating bath body 1 inside right side, avoid it directly to carry out backward flow to the left side and influence the plating solution velocity of flow.
The utility model discloses the standard part that uses all can purchase from the market, and dysmorphism piece all can be customized according to the description with the record of drawing of description, and the concrete connected mode of each part all adopts conventional means such as ripe bolt, rivet, welding among the prior art, and machinery, part and equipment all adopt among the prior art, and conventional model, including the conventional connected mode among the circuit connection adoption prior art, and the details are not repeated here, and the content that does not make detailed description in this description belongs to the prior art that skilled person in the art knows.
Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments or portions thereof without departing from the spirit and scope of the invention.

Claims (7)

1. A plating cell for improving a flow rate of a plating solution flowing through a plating path, comprising:
the electroplating bath comprises an electroplating bath body, a mounting shell is mounted on the left side of the electroplating bath body, a side spray gun is arranged on the inner side of the mounting shell, a circulating pipe communicated with the inner side of the electroplating bath body is mounted on the lower side of the side spray gun, and a circulating pump box body for circulating electroplating solution is mounted on the left side of the side spray gun;
the sealing mechanism is arranged on the upper side of the electroplating bath body, a material placing mechanism is arranged on the lower side of the sealing mechanism, and a lower spray gun communicated with the lower end of the side spray gun is arranged on the lower side of the material placing mechanism;
and the separation plate is arranged on the inner side of the electroplating bath body, the rear side of the separation plate is provided with a guide plate, and the left side of the inner end of the guide plate is provided with a guide block.
2. A plating tank as set forth in claim 1, wherein: the material placing mechanism comprises a limiting plate and a limiting rod;
and the lower end of the limiting plate is provided with a limiting rod.
3. A plating tank for improving a flow path of a plating solution according to claim 2, wherein: the gag lever post is equidistant setting around the downside of limiting plate is, and the gag lever post all is equidistant crisscross setting with side spray gun and lower spray gun.
4. A plating tank as set forth in claim 1, wherein: the sealing mechanism comprises a mounting plate, a limiting column, a connecting column and a sealing ring;
the mounting plate is arranged on the upper side of the limiting plate;
the limiting column is arranged at the lower end of the mounting plate;
a connecting column mounted on the inner side of the limiting column;
and the single bodies of the sealing rings are respectively arranged on the upper side and the lower side of the limiting plate.
5. A plating tank for improving a flow path of a plating solution according to claim 4, wherein: the lower end longitudinal section of the limiting column is conical, the limiting column penetrates through the inner side of the limiting plate, and the connecting column penetrates through the mounting plate and the limiting column simultaneously and is in threaded connection with the electroplating bath body.
6. A plating tank as set forth in claim 1, wherein: the outlets of the side spray guns are uniformly arranged on the left side in the electroplating bath body.
7. A plating tank as set forth in claim 1, wherein: the outside of guide block is the slope form setting, and the cross section of guide plate of guide block left end welded fastening is "L" type.
CN202220523327.7U 2022-03-11 2022-03-11 Plating bath capable of improving flow path and flow velocity of plating solution Active CN217203034U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202220523327.7U CN217203034U (en) 2022-03-11 2022-03-11 Plating bath capable of improving flow path and flow velocity of plating solution

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202220523327.7U CN217203034U (en) 2022-03-11 2022-03-11 Plating bath capable of improving flow path and flow velocity of plating solution

Publications (1)

Publication Number Publication Date
CN217203034U true CN217203034U (en) 2022-08-16

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN202220523327.7U Active CN217203034U (en) 2022-03-11 2022-03-11 Plating bath capable of improving flow path and flow velocity of plating solution

Country Status (1)

Country Link
CN (1) CN217203034U (en)

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