JPS6144403A - Thick film resistance element - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION (Technical Field) The present invention relates to a thick film resistive element, and more particularly to a thick film resistive element formed on an insulating substrate forming a hybrid integrated circuit (IC) or the like.

(Prior Art) Conventionally, as shown in FIG. 1, this type of thick film resistance element has a conductor electrode 1 formed on an insulating base [(18!Q not shown) made of a material such as alumina. .2, one resistor M4.3 is printed and baked, and this resistive film 3 is shaved with a laser or sandblast as shown by the dotted line to form a conductive electrode L.

It is generally known that the resistive film 3 is trimmed so that the resistance value between the resistive film 3 and the resistive film 3 becomes a desired value. In the trimming, the resistive film 3 is initially trimmed to a value close to a desired resistance value according to a value determined in advance by calculation,
Next, the resistive film 3 is functionally trimmed until the electrical characteristics of the circuit formed on the insulating substrate become specified characteristics.

By the way, in the above-mentioned thick film resistive element, since one resistive film 3 having a fixed area resistance is trimmed by cutting, the trimming sensitivity of the function trimming is equal to the trimming sensitivity of the initial trimming, and the function trimming is performed. By trimming, the S film 3 was trimmed so that the resistance value between the conductor electrodes 1 and 2 became a specified value.

Therefore, as shown in FIG. 2, a middle @tlr1 pole 4 is formed between the conductor electrodes 1 and 2, and a first resistive film 3a is formed between the relay electrode 4 and the conductor electrode 1. In addition, between the pole 4 and the conductor electrode 2, a first resistive film 3 is provided between the pole 4 and the conductor electrode 2.
a, which has a sheet resistance R2 lower than the sheet resistance R2 of a.
A resistive film 3b is formed, and as shown by the dotted line, the first resistive film 3
It is also generally known that after the initial trimming of a, the second resistive film 3b is funkun-contrimmed to improve trimming accuracy.

In the thick film resistive element shown in FIG. 2, the trimming sensitivity of the second resistive film 3b is reduced to Rt/R+ compared to the first resistive film 3a, and due to funkun contour trimming, the trimming sensitivity of the second resistive film 3b is reduced to Rt/R+.
．． 2 can be adjusted more precisely than the thick film resistive element shown in FIG. A hybrid integrated circuit that requires the pole 4 and uses the thick film resistive element shown in FIG. 2 has the disadvantage that the relay electrode 4 increases the cost and increases the size.

(Object of the Invention) The present invention has been made in view of the above-mentioned circumstances regarding conventional thick film resistive elements, and the purpose is to By providing a section, the first resistive film and the second resistive film are connected to each other at this overlapping part, eliminating the relay electrode, reducing the cost of the thick film resistive element, reducing the size, and reducing the area. The purpose of this invention is to improve trimming accuracy by utilizing the overlapping portion of a first resistive film with low resistance and a second low resistive film.

(Structure of the Invention) For this reason, the present invention is characterized in that a first resistive film and a second resistive film having different sheet resistances are formed over two conductive electrodes on an insulating substrate, with parts thereof overlapping each other. It is characterized by

(Example) Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

In FIG. 3, 11 and 12 are conductor electrodes formed substantially parallel to an insulating substrate (not shown), 13 is a first resistive film, and 14
15 is the second resistor film, and 15 is the first resistor M13 and the second resistor film.
This is the overlapped portion with the resistive film 14.

The first resistor 113 and the second resistor film I4 are both formed by printing a resistive material on the insulating plate and then baking it, and extend over the conductor electrodes 11 and 12, and a part of the resistor film I4 is formed by printing a resistive material on the insulating plate and then baking it. They overlap each other.

The area resistance R1 of the second resistor 114 is the first resistor M41.
It is smaller than the area resistance R1jl of No. 3.

In the above manner, as shown in the fourth rgJ, the area resistance RIB of the overlapping portion 15 between the first resistance resistance 113 and the second resistance resistance WA14 becomes smaller than both of the area resistances RI3 and R24.

Therefore, at the time of trimming, as shown in FIG. 3, the first resistor 1i1+3 is initially trimmed to a specified length between the conductor electrodes 11 and 12 in the direction of arrow A1, and then the The second arrow is in the direction of arrow A, which is opposite to arrow A.
Resistance g! 14 is subjected to funkun contour trimming in the same manner as in FIG.

If the resistance value between the conductor electrodes 11 and 12 does not reach a predetermined resistance value due to this funkun trimming, if the molded portion 15 is funkun trimmed beyond the second resistor [14], this can be fixed. Since the sheet resistance RI5 of the overlapping portion 15 is smaller than the sheet resistance RI3 of the first resistive film 13 and the sheet resistance R14 of the second resistor 1@14, the funk'n contour trimming described above can be performed more precisely.

In addition, the thick film resistor element shown in FIG. 3 does not require the middle a electrode 4 like the thick film resistor element shown in FIG. .

The present invention can be applied to circuits such as resistor networks in addition to hybrid integrated circuits.

(Effects of the Invention) As is clear from the detailed description above, the present invention has the following effects:
In the thick film resistor element, since the first resistive film and the second resistive film formed on the resistive substrate are provided with an overlapping portion to form regions with three types of sheet resistance, trimming regions with different sheet resistances are formed. This increases trimming accuracy, and by selecting the trimming area, it is possible to use two-stage and three-stage trimming. Furthermore, there is no need for a relay electrode between the ml resistive film and the second resistive bladder, and there is an advantage that the cost of the thick film resistive element can be reduced, and the dimensions of the thick film resistive element can also be reduced.

[Brief explanation of the drawing]

1 and 2 are respectively plan views of conventional thick film resistive elements, FIG. 3 is a plan view of an embodiment of the thick film resistive element according to the present invention, and FIG. 4 is the thick film resistor of FIG. 3. FIG. 3 is an explanatory diagram showing the relationship between the position of a resistive film of an element and its resistance value. 11.12... Conductor electrode, 13... First resistive film, 1
4...Second resistance film, 15...Overlapping portion. Patent Applicant Murata Manufacturing Co., Ltd. Agent Patent Attorney Aoyama Aoyama and 2 others Figure 1 WJ2 Figure → ↑6 Jυ℃ key ifL location

Claims (1)

[Claims] (1) A thick film resistive element characterized in that a first resistive film and a second resistive film having different sheet resistances are formed over two conductor electrodes on an insulating substrate, with parts of the resistive films overlapping each other.