JPS6143857B2 - - Google Patents

Info

Publication number
JPS6143857B2
JPS6143857B2 JP55149777A JP14977780A JPS6143857B2 JP S6143857 B2 JPS6143857 B2 JP S6143857B2 JP 55149777 A JP55149777 A JP 55149777A JP 14977780 A JP14977780 A JP 14977780A JP S6143857 B2 JPS6143857 B2 JP S6143857B2
Authority
JP
Japan
Prior art keywords
heat dissipation
integrated circuit
multilayer wiring
wiring board
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP55149777A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5772357A (en
Inventor
Koichi Yamanaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP14977780A priority Critical patent/JPS5772357A/ja
Publication of JPS5772357A publication Critical patent/JPS5772357A/ja
Publication of JPS6143857B2 publication Critical patent/JPS6143857B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP14977780A 1980-10-24 1980-10-24 Mounting method of integrated circuit Granted JPS5772357A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14977780A JPS5772357A (en) 1980-10-24 1980-10-24 Mounting method of integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14977780A JPS5772357A (en) 1980-10-24 1980-10-24 Mounting method of integrated circuit

Publications (2)

Publication Number Publication Date
JPS5772357A JPS5772357A (en) 1982-05-06
JPS6143857B2 true JPS6143857B2 (fr) 1986-09-30

Family

ID=15482490

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14977780A Granted JPS5772357A (en) 1980-10-24 1980-10-24 Mounting method of integrated circuit

Country Status (1)

Country Link
JP (1) JPS5772357A (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0103068B1 (fr) * 1982-09-09 1989-01-04 Siemens Aktiengesellschaft Dispositif de refroidissement pour une pluralité de composants intégrés, assemblés comme structure plane
JPH07108748B2 (ja) * 1985-07-05 1995-11-22 ミノルタ株式会社 複写機
US4849856A (en) * 1988-07-13 1989-07-18 International Business Machines Corp. Electronic package with improved heat sink
DE4210835C1 (fr) * 1992-04-01 1993-06-17 Siemens Nixdorf Informationssysteme Ag, 4790 Paderborn, De
FR2781924B1 (fr) * 1998-07-30 2002-11-29 St Microelectronics Sa Procede de montage de circuits integres

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS48101085A (fr) * 1972-03-31 1973-12-20
JPS5370672A (en) * 1976-12-06 1978-06-23 Ibm Ic assembly

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5233814Y2 (fr) * 1971-12-29 1977-08-02

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS48101085A (fr) * 1972-03-31 1973-12-20
JPS5370672A (en) * 1976-12-06 1978-06-23 Ibm Ic assembly

Also Published As

Publication number Publication date
JPS5772357A (en) 1982-05-06

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