JPS6141774A - 水性・無電解ニツケル改良浴及び方法 - Google Patents

水性・無電解ニツケル改良浴及び方法

Info

Publication number
JPS6141774A
JPS6141774A JP12499584A JP12499584A JPS6141774A JP S6141774 A JPS6141774 A JP S6141774A JP 12499584 A JP12499584 A JP 12499584A JP 12499584 A JP12499584 A JP 12499584A JP S6141774 A JPS6141774 A JP S6141774A
Authority
JP
Japan
Prior art keywords
bath
nickel
ions
amount
betaine compound
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12499584A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0144790B2 (de
Inventor
エドワード・ピー・ハーブラツク
シンシア・エイ・ハリデイ・スタンツ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
OMI International Corp
Original Assignee
OMI International Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US06/583,759 external-priority patent/US4483711A/en
Application filed by OMI International Corp filed Critical OMI International Corp
Publication of JPS6141774A publication Critical patent/JPS6141774A/ja
Publication of JPH0144790B2 publication Critical patent/JPH0144790B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
    • C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
JP12499584A 1984-03-05 1984-06-18 水性・無電解ニツケル改良浴及び方法 Granted JPS6141774A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US583759 1984-03-05
US06/583,759 US4483711A (en) 1983-06-17 1984-03-05 Aqueous electroless nickel plating bath and process

Publications (2)

Publication Number Publication Date
JPS6141774A true JPS6141774A (ja) 1986-02-28
JPH0144790B2 JPH0144790B2 (de) 1989-09-29

Family

ID=24334446

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12499584A Granted JPS6141774A (ja) 1984-03-05 1984-06-18 水性・無電解ニツケル改良浴及び方法

Country Status (8)

Country Link
JP (1) JPS6141774A (de)
AU (1) AU555641B2 (de)
CA (1) CA1225501A (de)
DE (1) DE3421646A1 (de)
ES (1) ES534703A0 (de)
FR (1) FR2560609B1 (de)
GB (1) GB2155041B (de)
IT (1) IT1181810B (de)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013012740A (ja) * 2011-06-28 2013-01-17 Samsung Electro-Mechanics Co Ltd プリント回路基板の無電解表面処理めっき層及びその製造方法
KR20140041762A (ko) * 2011-07-26 2014-04-04 아토테크더치랜드게엠베하 무전해 니켈 도금욕 조성물

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4983428A (en) * 1988-06-09 1991-01-08 United Technologies Corporation Ethylenethiourea wear resistant electroless nickel-boron coating compositions
ES2027496A6 (es) * 1989-10-12 1992-06-01 Enthone Metodo para precipitar una capa metalica no electrica lisa sobre un substrato de aluminio.
DE102004047423C5 (de) * 2004-09-28 2011-04-21 AHC-Oberflächentechnik GmbH & Co. OHG Außenstromlos aufgebrachte Nickellegierung und ihre Verwendung
US11685999B2 (en) 2014-06-02 2023-06-27 Macdermid Acumen, Inc. Aqueous electroless nickel plating bath and method of using the same

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1001078B (de) * 1953-08-13 1957-01-17 Dehydag Gmbh Galvanische Baeder zur Herstellung von Metallueberzuegen
US3489576A (en) * 1966-08-04 1970-01-13 Gen Motors Corp Chemical nickel plating
US3515564A (en) * 1968-05-27 1970-06-02 Allied Res Prod Inc Stabilization of electroless plating solutions

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013012740A (ja) * 2011-06-28 2013-01-17 Samsung Electro-Mechanics Co Ltd プリント回路基板の無電解表面処理めっき層及びその製造方法
US9150002B2 (en) 2011-06-28 2015-10-06 Samsung Electro-Mechanics Co., Ltd. Electroless surface treatment plated layers of printed circuit board and method for preparing the same
KR20140041762A (ko) * 2011-07-26 2014-04-04 아토테크더치랜드게엠베하 무전해 니켈 도금욕 조성물
JP2014521834A (ja) * 2011-07-26 2014-08-28 アトテツク・ドイチユラント・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツング 無電解ニッケルめっき浴組成物

Also Published As

Publication number Publication date
JPH0144790B2 (de) 1989-09-29
DE3421646A1 (de) 1985-09-05
CA1225501A (en) 1987-08-18
IT1181810B (it) 1987-09-30
AU2903584A (en) 1985-09-12
IT8448657A0 (it) 1984-07-27
FR2560609B1 (fr) 1987-03-27
FR2560609A1 (fr) 1985-09-06
GB2155041B (en) 1987-06-03
GB8414601D0 (en) 1984-07-11
AU555641B2 (en) 1986-10-02
GB2155041A (en) 1985-09-18
ES8506109A1 (es) 1985-06-16
ES534703A0 (es) 1985-06-16
DE3421646C2 (de) 1987-01-02

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