JPS6141706B2 - - Google Patents
Info
- Publication number
- JPS6141706B2 JPS6141706B2 JP56092290A JP9229081A JPS6141706B2 JP S6141706 B2 JPS6141706 B2 JP S6141706B2 JP 56092290 A JP56092290 A JP 56092290A JP 9229081 A JP9229081 A JP 9229081A JP S6141706 B2 JPS6141706 B2 JP S6141706B2
- Authority
- JP
- Japan
- Prior art keywords
- workpiece
- polishing
- thickness
- carrier
- surface plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000005498 polishing Methods 0.000 claims description 45
- 239000007788 liquid Substances 0.000 claims description 27
- 238000005259 measurement Methods 0.000 claims description 21
- 238000009826 distribution Methods 0.000 claims description 14
- 238000007494 plate polishing Methods 0.000 claims description 3
- 239000000969 carrier Substances 0.000 claims description 2
- 239000000463 material Substances 0.000 description 8
- 238000000034 method Methods 0.000 description 5
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
- B24B37/013—Devices or means for detecting lapping completion
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56092290A JPS57211471A (en) | 1981-06-17 | 1981-06-17 | High accuracy polishing device for thin board member |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56092290A JPS57211471A (en) | 1981-06-17 | 1981-06-17 | High accuracy polishing device for thin board member |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57211471A JPS57211471A (en) | 1982-12-25 |
| JPS6141706B2 true JPS6141706B2 (enExample) | 1986-09-17 |
Family
ID=14050273
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56092290A Granted JPS57211471A (en) | 1981-06-17 | 1981-06-17 | High accuracy polishing device for thin board member |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57211471A (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH066259B2 (ja) * | 1986-08-13 | 1994-01-26 | 株式会社日立製作所 | 両面研削装置の砥石形状検出方法および砥石形状検出手段を備えた両面研削装置 |
| JPH0160860U (enExample) * | 1987-05-21 | 1989-04-18 |
-
1981
- 1981-06-17 JP JP56092290A patent/JPS57211471A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57211471A (en) | 1982-12-25 |
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