JPS6141249Y2 - - Google Patents

Info

Publication number
JPS6141249Y2
JPS6141249Y2 JP221680U JP221680U JPS6141249Y2 JP S6141249 Y2 JPS6141249 Y2 JP S6141249Y2 JP 221680 U JP221680 U JP 221680U JP 221680 U JP221680 U JP 221680U JP S6141249 Y2 JPS6141249 Y2 JP S6141249Y2
Authority
JP
Japan
Prior art keywords
bonding
electrode
current
semiconductor device
transistor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP221680U
Other languages
English (en)
Japanese (ja)
Other versions
JPS56104148U (enrdf_load_stackoverflow
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP221680U priority Critical patent/JPS6141249Y2/ja
Publication of JPS56104148U publication Critical patent/JPS56104148U/ja
Application granted granted Critical
Publication of JPS6141249Y2 publication Critical patent/JPS6141249Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Wire Bonding (AREA)
JP221680U 1980-01-11 1980-01-11 Expired JPS6141249Y2 (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP221680U JPS6141249Y2 (enrdf_load_stackoverflow) 1980-01-11 1980-01-11

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP221680U JPS6141249Y2 (enrdf_load_stackoverflow) 1980-01-11 1980-01-11

Publications (2)

Publication Number Publication Date
JPS56104148U JPS56104148U (enrdf_load_stackoverflow) 1981-08-14
JPS6141249Y2 true JPS6141249Y2 (enrdf_load_stackoverflow) 1986-11-25

Family

ID=29599073

Family Applications (1)

Application Number Title Priority Date Filing Date
JP221680U Expired JPS6141249Y2 (enrdf_load_stackoverflow) 1980-01-11 1980-01-11

Country Status (1)

Country Link
JP (1) JPS6141249Y2 (enrdf_load_stackoverflow)

Also Published As

Publication number Publication date
JPS56104148U (enrdf_load_stackoverflow) 1981-08-14

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