JPS6141095Y2 - - Google Patents

Description

[Detailed description of the invention] This invention is a printed circuit board, which is used in the production of a film original when printing wiring is applied to a phenolic resin-based or epoxy resin-based board by photolithography. Regarding inch mesh base paper, more specifically, 2.54 inch mesh base paper, which is the basic form of conventional inch mesh base paper, as shown in Figure 1, has vertical lines a and L between a and A 2.54-inch mesh base paper in which the horizontal lines b and b are spaced at 1-inch intervals, and within these 1-inch intervals are nine vertical thin lines a ₁ and horizontal thin lines b ₁ , each with an interval of 2.54 mm. (Note: For example, vertical frame line a and horizontal frame line b are 0.25 mm.
The vertical thin line _a1 and the horizontal thin line _b1 are made with a thickness of 0.075 mm. ) while adopting the mesh of 2.54.
This invention relates to inch mesh base paper for manufacturing printed circuit boards that can be subdivided into meshes of 1/4, that is, 0.635 mm.

In recent years, the introduction of so-called CAD, which uses computer technology, has been progressing in the production of the above-mentioned film base paper, but even when this CAD method is adopted, it is similar to the conventional production of artwork. The original design drawings were created manually based on the electrical circuit diagrams, and then the tageting work was carried out, and the base paper used to create the original designs by hand was 2.54-inch mesh paper. And when using the CAD method, the conventional
Compared to what was written on 2.54 inch mesh paper,
Although it is possible to print at a higher density,
It was difficult to record such high density on conventional mesh base paper.

This idea was created by focusing on the points mentioned above.
The purpose of this is to be able to create fine original design drawings by using the conventional 2.54 inch mesh as well as parts further subdivided by cross lines.
An object of the present invention is to provide inch-type mesh base paper for producing printed circuit boards, which can respond well to high density production using the CAD method.

Next, an embodiment of the present invention that can achieve the above object will be described in detail with reference to FIGS. 2 and 3.

a is the vertical line for the frame, b is the horizontal line for the frame, a ₁ is the vertical thin line, b ₁
indicates a horizontal thin line, and the frame vertical lines a, L between a and horizontal frame lines b, L between b are each 1 inch apart, and within this 1 inch interval are 9 vertical thin lines.
A ₁ and horizontal thin line b ₁ form an interval 1, 1 of 2.54 mm.

c indicates a cross line, and the vertical frame a mentioned above,
Vertical thin line a ₁ and horizontal line b for frame, horizontal thin line b ₁ and vertical thin line a ₁ ,
It is placed at the center of the area defined by a ₁ and horizontal thin lines b ₁ and b ₁ . That is, as shown in the enlarged view of FIG. 3, the length c1 of the vertical and horizontal lines forming the cross line c is set to 1.27 mm, which is 1/2 of the above-mentioned L and 1. Therefore, the length C1 ₁ between the four ends of the cross line c and the vertical frame line a, the horizontal frame line b, the vertical thin line a ₁ , and the horizontal thin line b ₁ is 0.635 mm, and the vertical frame line a , frame horizontal line b,
The thickness of the vertical thin line a ₁ and the horizontal thin line b ₁ is the same as that of the above-mentioned conventional device, and the cross line c is expressed as 0.075 mm.

Although one embodiment of the present invention has been described above, if necessary, the cross line c may be made blue to prevent the cross line c from appearing during copying, that is, to make it easier to see.

According to the product of the present invention as described above, it is possible to create a detailed original design using the 2.54 inch mesh and the parts further subdivided by the cross lines c, and therefore it is possible to create high-density designs using the CAD method. This can be achieved by responding well.

[Brief explanation of the drawing]

FIG. 1 is an explanatory diagram of a conventional inch mesh base paper, FIG. 2 is an explanatory diagram of an inch mesh base paper according to the present invention, and FIG. 3 is an enlarged explanatory diagram of the same. a...Vertical line for frame, b...Horizontal line for frame, _a1 ...Vertical thin line, _b1 ...Horizontal thin line, c...Cross line.

Claims (1)

[Scope of utility model registration request] The vertical frame lines a and L between a and the horizontal frame lines b and L between b are each 1 inch apart, and within this 1 inch interval, nine vertical thin lines a ₁ and horizontal thin lines b ₁ are formed.
2.54 mm spacing 1, 1, and further division by vertical frame line a, vertical thin line _{a 1} , horizontal frame line b, horizontal thin line b ₁ , vertical thin line a ₁ , a ₁ and horizontal thin line b ₁ , b ₁ . Cross line c at the center of
Inch mesh base paper for printed circuit board production.