JPS5961563U - Lettering tape for making printed circuit boards - Google Patents

Lettering tape for making printed circuit boards

Info

Publication number
JPS5961563U
JPS5961563U JP15622282U JP15622282U JPS5961563U JP S5961563 U JPS5961563 U JP S5961563U JP 15622282 U JP15622282 U JP 15622282U JP 15622282 U JP15622282 U JP 15622282U JP S5961563 U JPS5961563 U JP S5961563U
Authority
JP
Japan
Prior art keywords
printed circuit
circuit boards
lettering tape
making printed
tape
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15622282U
Other languages
Japanese (ja)
Inventor
公成 河村
Original Assignee
矢崎総業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 矢崎総業株式会社 filed Critical 矢崎総業株式会社
Priority to JP15622282U priority Critical patent/JPS5961563U/en
Publication of JPS5961563U publication Critical patent/JPS5961563U/en
Pending legal-status Critical Current

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  • Manufacturing Of Printed Wiring (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は従来めレタリングテープを使用してプリント基
板作用の結線パターン原紙を作成した一例を示す図、第
2図は本考案によるプリント基板作成用レタリングテー
プの一例をその長さ方向に沿って縦断して示す断面図、
第3図は本考案によるレタリングテープを使用してプリ
ント基板製作用の結線パターン原紙を作成し、そのパタ
ーン校正の方法の一例を示す図、第4図及び第5図は第
3図のA部及びB部のそれぞれの縦断面図である。 4・・・・・・レタリングテープ、5・・・・・・テー
プ部、6・・・二接着剤部。
Figure 1 shows an example of a conventional lettering tape used to create a connection pattern base paper for a printed circuit board, and Figure 2 shows an example of the lettering tape for creating a printed circuit board according to the present invention, along its length. A cross-sectional view shown longitudinally,
Fig. 3 is a diagram showing an example of a method for creating a connection pattern base paper for printed circuit board production using the lettering tape according to the present invention and calibrating the pattern, and Figs. 4 and 5 are part A of Fig. 3. and FIG. 7 is a vertical cross-sectional view of part B. 4... Lettering tape, 5... Tape part, 6... Second adhesive part.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 導電性を有するテープ部とこのテープ部の下面に施した
導電性を有する接着剤部とからなること、を特徴とする
プリント基板作成用レタリングテープ。
1. A lettering tape for making a printed circuit board, comprising a conductive tape part and a conductive adhesive part applied to the lower surface of the tape part.
JP15622282U 1982-10-18 1982-10-18 Lettering tape for making printed circuit boards Pending JPS5961563U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15622282U JPS5961563U (en) 1982-10-18 1982-10-18 Lettering tape for making printed circuit boards

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15622282U JPS5961563U (en) 1982-10-18 1982-10-18 Lettering tape for making printed circuit boards

Publications (1)

Publication Number Publication Date
JPS5961563U true JPS5961563U (en) 1984-04-23

Family

ID=30344780

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15622282U Pending JPS5961563U (en) 1982-10-18 1982-10-18 Lettering tape for making printed circuit boards

Country Status (1)

Country Link
JP (1) JPS5961563U (en)

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