JPH02304560A - Method for producing film mask used for production of hybrid ic - Google Patents

Abstract

PURPOSE:To perform each of film setting, exposure drawing, film detachment and development only once, and to save an operator trouble by arranging plural pattern data two-dimensionally to subject them to exposure drawing and cutting them to obtain plural film masks. CONSTITUTION:Pattern data of 9 materials of one thick film hybrid IC are prepared with CAD (computer aided design), and these 9 pattern data are converted into pattern data of the whole surface where they are two- dimensionally arranged in three rows and three columns on CAD. This whole surface pattern data is subjected to exposure drawing on the film by a film drawing device, and this film is developed. As the result, one film where patterns 13 are arranged in three rows and three columns is obtained, and the developed film is cut along cutting lines 14 to obtain 9 film masks. Thus, film masks are produced with less trouble.

Description

DETAILED DESCRIPTION OF THE INVENTION INDUSTRIAL APPLICATION J Field of the Invention The present invention relates to a method for creating a film mask used to form a pattern for each material on a substrate in the manufacture of hybrid ICs.

"Prior art" In manufacturing thick film hybrid ICs, on a ceramic substrate, a wiring pattern is formed, a resistance pattern is formed for each resistance value, an insulating pattern is formed at the crossover point of the wiring, and a surface protector pattern is formed. Patterns are printed for each material. In order to form patterns for each material, a pattern is formed on the mask material using a photolithography technique using a film on which a black and white pattern is formed as a mask. Therefore, film masks are required for pattern formation for each material. Generally, about 5 to 15 film masks are required to manufacture one thick film hybrid IC.

In order to create these film masks, conventionally the pattern data corresponding to one film mask is processed using CAD (CAD HCoaputer AidDesi).
gn), inputting the pattern data into a film drawing device, and drawing the pattern on the film with a light beam to obtain one film mask.

This was done for each film mask. In general, CAD and film drawing devices are configured so that they can be used for designing large-area printed circuit boards.
150 x 150 m” film mask 12 in one corner of 1
, and then made as many film masks as needed.

``Problems to be Solved by the Invention'' As stated above, in the past, pattern data for each material is stored on one film, so the number of film masks required for the film drawing device is It was necessary to set the film, expose the film, then remove the film, and develop the film, which required a lot of effort.

An object of the present invention is to provide a method for creating a film mask for use in manufacturing a hybrid IC, which allows film masks to be created with fewer steps than conventional methods.

"Means for Solving the Problem" According to the present invention, pattern data for each material of one hybrid IC is created using CAD, and these plurality of pattern data are arranged as pattern data on one surface on CAD, The arranged pattern data for one surface is drawn on a sheet of film using a film drawing device, and the drawn film is cut into patterns for each material to form a film mask.

"Example J: Create pattern data for each of, for example, nine materials of one thick film hybrid IC using CAD, and convert these nine pattern data into one-sided pattern data arranged two-dimensionally in 3 columns and 3 rows on CAD. The pattern data of this - side is exposed and drawn on a piece of film using a film drawing device, and the exposed and drawn film is developed.As a result, as shown in Fig. 1, for example, 480 x 480 mm.
A film with 150 x 150 fill" patterns 13 arranged in 3 columns and 3 rows is obtained on the film of 2. In addition, cutting lines 14 indicating the boundaries of each pattern 13 are also drawn at the same time during exposure drawing. is cut along cutting line 14 to obtain nine film masks.

"Effects of the Invention" As described above, according to the present invention, a plurality of pattern data are arranged two-dimensionally on a single film, exposed and drawn, and the film is cut to obtain a plurality of film masks. Therefore, setting the film, exposing the image, removing the film, and developing the film only need to be done once each, which is less time-consuming compared to the conventional method in which these steps are performed for each film mask.For example, the conventional method The film production time has been reduced to about 1/2, and the cost has been reduced to about 1/3.

[Brief explanation of the drawing]

FIG. 1 is a diagram showing a film with a plurality of patterns formed thereon obtained by the method of the present invention, and FIG. 2 is a diagram showing a film mask obtained by the conventional method.

Claims (1)

[Claims] (1) Create pattern data for each material of one hybrid IC on CAD, make these multiple pattern data arranged on one side on CAD, and use the arranged pattern data on one side to create a film. A method for creating a film mask used in the production of a hybrid IC, in which a film is drawn on a piece of film using a device, and the film mask is obtained by cutting the drawn film into patterns for each material.