JPS6139734B2 - - Google Patents
Info
- Publication number
- JPS6139734B2 JPS6139734B2 JP56013908A JP1390881A JPS6139734B2 JP S6139734 B2 JPS6139734 B2 JP S6139734B2 JP 56013908 A JP56013908 A JP 56013908A JP 1390881 A JP1390881 A JP 1390881A JP S6139734 B2 JPS6139734 B2 JP S6139734B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- vacuum chuck
- semiconductor wafer
- wafer
- recess
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000853 adhesive Substances 0.000 claims description 43
- 230000001070 adhesive effect Effects 0.000 claims description 43
- 239000000758 substrate Substances 0.000 claims description 43
- 230000003028 elevating effect Effects 0.000 claims description 12
- 238000009423 ventilation Methods 0.000 claims description 9
- 235000012431 wafers Nutrition 0.000 description 62
- 239000004065 semiconductor Substances 0.000 description 52
- 239000000428 dust Substances 0.000 description 8
- 238000004140 cleaning Methods 0.000 description 4
- 239000012790 adhesive layer Substances 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 238000004891 communication Methods 0.000 description 2
- 238000010894 electron beam technology Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Jigs For Machine Tools (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56013908A JPS57128939A (en) | 1981-02-02 | 1981-02-02 | Vacuum chuck mechanism of wafer fixing apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56013908A JPS57128939A (en) | 1981-02-02 | 1981-02-02 | Vacuum chuck mechanism of wafer fixing apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57128939A JPS57128939A (en) | 1982-08-10 |
| JPS6139734B2 true JPS6139734B2 (en, 2012) | 1986-09-05 |
Family
ID=11846265
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56013908A Granted JPS57128939A (en) | 1981-02-02 | 1981-02-02 | Vacuum chuck mechanism of wafer fixing apparatus |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57128939A (en, 2012) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63201250A (ja) * | 1987-02-13 | 1988-08-19 | 積水化学工業株式会社 | 軒先構造 |
| JPH02240357A (ja) * | 1989-03-14 | 1990-09-25 | Sekisui Chem Co Ltd | 軒先構造 |
| JPH02240356A (ja) * | 1989-03-14 | 1990-09-25 | Sekisui Chem Co Ltd | 軒先構造 |
| JPH02240354A (ja) * | 1989-03-14 | 1990-09-25 | Sekisui Chem Co Ltd | 軒先構造 |
| JPH0437723U (en, 2012) * | 1990-07-25 | 1992-03-30 |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59191344A (ja) * | 1983-04-14 | 1984-10-30 | Toshiba Corp | 薄板取着用治具 |
| CN102005395B (zh) * | 2009-08-31 | 2013-03-06 | 日立设备工程股份有限公司 | 真空贴装方法及装置 |
| JP5920058B2 (ja) * | 2012-06-29 | 2016-05-18 | 日本精工株式会社 | スピンドル装置、並びにそれを備えた工作機械及び半導体製造装置 |
-
1981
- 1981-02-02 JP JP56013908A patent/JPS57128939A/ja active Granted
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63201250A (ja) * | 1987-02-13 | 1988-08-19 | 積水化学工業株式会社 | 軒先構造 |
| JPH02240357A (ja) * | 1989-03-14 | 1990-09-25 | Sekisui Chem Co Ltd | 軒先構造 |
| JPH02240356A (ja) * | 1989-03-14 | 1990-09-25 | Sekisui Chem Co Ltd | 軒先構造 |
| JPH02240354A (ja) * | 1989-03-14 | 1990-09-25 | Sekisui Chem Co Ltd | 軒先構造 |
| JPH0437723U (en, 2012) * | 1990-07-25 | 1992-03-30 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57128939A (en) | 1982-08-10 |
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