JPS6139734B2 - - Google Patents

Info

Publication number
JPS6139734B2
JPS6139734B2 JP56013908A JP1390881A JPS6139734B2 JP S6139734 B2 JPS6139734 B2 JP S6139734B2 JP 56013908 A JP56013908 A JP 56013908A JP 1390881 A JP1390881 A JP 1390881A JP S6139734 B2 JPS6139734 B2 JP S6139734B2
Authority
JP
Japan
Prior art keywords
substrate
vacuum chuck
semiconductor wafer
wafer
recess
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56013908A
Other languages
English (en)
Japanese (ja)
Other versions
JPS57128939A (en
Inventor
Takuoki Numaga
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shibaura Machine Co Ltd
Original Assignee
Toshiba Machine Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Machine Co Ltd filed Critical Toshiba Machine Co Ltd
Priority to JP56013908A priority Critical patent/JPS57128939A/ja
Publication of JPS57128939A publication Critical patent/JPS57128939A/ja
Publication of JPS6139734B2 publication Critical patent/JPS6139734B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Jigs For Machine Tools (AREA)
JP56013908A 1981-02-02 1981-02-02 Vacuum chuck mechanism of wafer fixing apparatus Granted JPS57128939A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56013908A JPS57128939A (en) 1981-02-02 1981-02-02 Vacuum chuck mechanism of wafer fixing apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56013908A JPS57128939A (en) 1981-02-02 1981-02-02 Vacuum chuck mechanism of wafer fixing apparatus

Publications (2)

Publication Number Publication Date
JPS57128939A JPS57128939A (en) 1982-08-10
JPS6139734B2 true JPS6139734B2 (US07166745-20070123-C00016.png) 1986-09-05

Family

ID=11846265

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56013908A Granted JPS57128939A (en) 1981-02-02 1981-02-02 Vacuum chuck mechanism of wafer fixing apparatus

Country Status (1)

Country Link
JP (1) JPS57128939A (US07166745-20070123-C00016.png)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63201250A (ja) * 1987-02-13 1988-08-19 積水化学工業株式会社 軒先構造
JPH02240357A (ja) * 1989-03-14 1990-09-25 Sekisui Chem Co Ltd 軒先構造
JPH02240356A (ja) * 1989-03-14 1990-09-25 Sekisui Chem Co Ltd 軒先構造
JPH02240354A (ja) * 1989-03-14 1990-09-25 Sekisui Chem Co Ltd 軒先構造
JPH0437723U (US07166745-20070123-C00016.png) * 1990-07-25 1992-03-30

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59191344A (ja) * 1983-04-14 1984-10-30 Toshiba Corp 薄板取着用治具
CN102005395B (zh) * 2009-08-31 2013-03-06 日立设备工程股份有限公司 真空贴装方法及装置
JP5920058B2 (ja) * 2012-06-29 2016-05-18 日本精工株式会社 スピンドル装置、並びにそれを備えた工作機械及び半導体製造装置

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63201250A (ja) * 1987-02-13 1988-08-19 積水化学工業株式会社 軒先構造
JPH02240357A (ja) * 1989-03-14 1990-09-25 Sekisui Chem Co Ltd 軒先構造
JPH02240356A (ja) * 1989-03-14 1990-09-25 Sekisui Chem Co Ltd 軒先構造
JPH02240354A (ja) * 1989-03-14 1990-09-25 Sekisui Chem Co Ltd 軒先構造
JPH0437723U (US07166745-20070123-C00016.png) * 1990-07-25 1992-03-30

Also Published As

Publication number Publication date
JPS57128939A (en) 1982-08-10

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