JPS6139146A - Small-sized electronic equipment - Google Patents

Abstract

PURPOSE:To facilitate the manufacture of the small-sized electronic equipment in lamination structure by fitting an integrated circuit chip, display body, battery, etc., in openings formed in the substrate of the electronic equipment, and coating both top and reverse surfaces of the substrate with an insulating material and thus forming the top and reverse surfaces of the equipment. CONSTITUTION:An opening 13 for fitting the LSI chip 20, an opening 14 for fitting the display body 30, an opening 15 for fitting the paper type battery 40, and touch electrodes 11 for an input part are formed in the resin-made substrate 10 of the electronic equipment. Further, the chip 20, display body 30, and battery 40 are fitted in the respective openings 13-15. Further, the chip 20, display body 30, battery 40, and touch electrodes 11 are connected mutually through wiring 19 formed on the substrate 10. Then, both top and reverse sides of the substrate 10 are coated with the insulating material to form coating films 50a and 50b as the top surface and reverse surfaces of the small-sized electronic equipment, facilitating the manufacture of the equipment in the lamination structure.

Description

[Detailed Description of the Invention] [Technical Field of the Invention] This invention relates to small-sized electronic equipment.[Technical Background of the Invention and Problems Therewith] Recently, small electronic calculators and other small-sized electronic equipment have become popular. In particular, batteries that use thin batteries such as paper batteries or solar cells as power batteries have become much thinner than those that use button batteries as power batteries. There is.

There are various structures for small electronic devices that use thin batteries as power batteries, but among them, the so-called laminated structure has the thinnest thickness of about 0.8 mm.

This laminated structure electronic device has an integrated circuit chip, a display body such as a liquid crystal display panel whose display is driven by a drive signal from the integrated circuit chip, and a wiring board on which the thin battery is attached, which is fitted into a frame. A top sheet and a back sheet forming the front and back surfaces of the device are layered and adhered to the top and bottom of the frame, and the space inside the frame is filled with a filler material. At least the integrated circuit chip and the display body are fitted into an opening provided in the wiring board in order to reduce the mounting height.

In this small electronic device with a laminated structure, a top sheet and a back sheet are stacked on both sides of a wiring board, and the device case is made up of these sheets. Therefore, the wiring board, etc. can be stored inside the thin box-shaped device case. The overall thickness of the device can be made much thinner than conventional electronic devices.

However, the above-mentioned small electronic device with a laminated structure has a top sheet and a back sheet bonded to both sides of the wiring board, and the internal space is filled with a filler material. One sheet must be stacked and glued on one side of the wiring board, and filler is filled from the other side of the wiring board, and then the other sheet is polymerized and glued on top of it. Structured electronic equipment has had the problem of being cumbersome to manufacture.

[Purpose of the invention]

This invention was made in view of the above-mentioned circumstances, and its purpose is to create a device that is essentially a multilayer structure, but which is easier to use than conventional small electronic devices that have a multilayer structure. The objective is to provide small electronic devices that can be manufactured in a number of ways.

[Summary of the invention]

That is, the present invention provides a method for attaching an integrated circuit chip, a display body, and a battery to a substrate on which wiring is formed to connect the integrated circuit chip, a display body, and a battery, and fitting the integrated circuit chip, a display body, and a battery into at least an opening provided in the display body substrate. With,
Both sides of the substrate are coated with an insulating material, and the two coating films form the front and back surfaces of the device.

[Embodiments of the invention]

Embodiments of the present invention will be described below with reference to the drawings, taking a small electronic calculator as an example.

1 to 5 show a first embodiment of the present invention, and the small electronic calculator of this embodiment is of an input type using a resistance detection type touch switch.

To explain the first embodiment, in FIGS. 1 to 4, reference numeral 10 in the figure is a board made of polyester or polysulfone resin, and a pair of keys are provided on the upper surface of this board 10 in the part that will become the key power part. Touch electrodes 11, 11e, .
.

The key code 12, 12° corresponds to...
・is printed. Note that the substrate 10 is made of a transparent substrate so that the key symbols 1 j + 1 j p... on the back surface thereof can be seen from the upper surface side of the substrate, and the touch electrodes 11, 11,... A pair of electrodes 11armllb forming the same are also transparent electrodes made of indium oxide or the like. In addition, in FIG. 2, touch, electrode 11,
11. ... is omitted and the key code 12.12. It only shows...

FIG. 5 shows a circuit configuration of a resistance detection type touch switch, in which a pair of electrodes 1 forming a touch electrode 11 is shown.
One of touch electrodes 11a of 1h and llb is connected to the high potential Vllll side, and the other touch electrode 11b is connected to the CMOS inverter 1.
The touch electrode Jfb is connected to the input side of the inverter 1, and is connected to the low potential vDD side via a dotted line resistance R connecting the touch electrode Jfb and the inverter 1.

To explain the operation of this circuit, electrode 1 of touch electrode 11
When no finger is touching 1 a e 1 l b, the input side voltage V of the inverter 1 is at a low potential, and therefore the output voltage VOTXT of the inverter 1 is at a high potential. In addition, both electrodes 11** of the touch electrode 11
, 11b are touched with a finger as shown in the figure, since the two electrodes 11a * 11b are connected through the body resistance 2, the input side voltage Vm of the inverter 1 changes to the resistance Z,
If the value of the resistor R is determined so that this divided voltage is equal to or higher than the threshold voltage of the inverter 1, the output voltage of the inverter 1 becomes the voltage VO
UT becomes low potential.

Therefore, when the output potential VOUT of the inverter 1 becomes a high potential, the switch is turned off, and the inverter output voltage VO
If we turn on the switch when UT becomes low potential,
When you touch the touch electrode 11 with your finger, the touch switch turns O.
When the touch switch is in the N state, if you release your finger, the touch switch will be in the OFF state.

The substrate 10 also has an opening 13 for mounting a large-scale integrated circuit chip (hereinafter referred to as an LSI chip) 20 into which a large-scale integrated circuit chip (hereinafter referred to as an LSI chip) is fitted.
An aperture 14 is provided for mounting a display body into which a thin battery such as a thin battery such as a beno-shaped battery 40 is inserted, an aperture 15 is provided for mounting a battery into which a thin battery such as a thin battery 40 is inserted, and an aperture 130 is provided at the periphery for mounting an LSI chip. LSI chip connection terminal 16°16
,... are formed in an array.

Further, display body connection terminals 17, 17e, etc. are formed in an array on one side edge of the opening 14 for mounting the display body, and a pair of battery connection terminals are formed on one edge of the opening 15 for the battery attachment. J JI IL T 18 b is formed, and this display body connection terminal 17.17°... and the battery connection terminal 18
The electrodes 11h, Ilb of the touch electrodes 11, 11, . . . are connected to the LSI chips and connection terminals 16, 16, .

Then, the LSI chip y'to is fitted into the opening 13 for mounting the LSI chip on the board 10, and connects each terminal electrode of the LSI chip 20 to the LSI chip connection terminal 16.1.
6. ... and attached to the board 10.

To explain the connection between the terminal electrodes of the LSI chip 20 and the LSI chip connection terminals 16, FIGS.
In the figure, 21.21. ... is LSI chip 20
The leads 21, 21, ., 21, . . . . After heating the wires 22 and 22 with a lead frame formed with a large number of lead parts corresponding to each terminal electrode of the LSI chip fzo, the frame part of the lead frame was cut off. They are separated into individual parts. Although not shown in the drawings, the lead frame is made by etching a carrier tape with apertures slightly larger than the size of the LSI chip 20 and laminating copper foil to cover the apertures.
A large number of lead parts are formed corresponding to each terminal electrode of the SI chip 20, and each lead part is tin-plated.
The carrier tape is separated from the leads 21.21 by pulse-heating the leads to the wires 22.22 and then cutting off the frame portion.

Accordingly, said lead 21.21. ... has a two-layer structure consisting of a copper foil and a tin plating layer.

Further, in FIGS. 1 and 3, 28 denotes each connection terminal 16 e 16 e . . . , 17° 17, .
... + 18 a p J 8 b is formed with a hot melt type anisotropic conductive adhesive applied to the upper surface of the portion where the leads 21 and 21 s are connected to each terminal electrode of the LSI chip 20. ... is the anisotropic conductive adhesive 28
LSI chip connection terminal 16.1.6. It is adhesively connected to... The hot-melt anisotropically conductive adhesive is an insulating hot-melt adhesive mixed with conductive particles, and the anisotropically conductive adhesive 28 applied to the substrate 10 is screen printed. It was applied thoroughly and then dried. In this state, the anisotropic conductive adhesive 28 exhibits insulating properties (the conductive particles are spaced apart from each other), and the leads 21, 21.・
When heated and pressed together, the insulating hot-melt adhesive reactivates and pressurized parts (between LSI chip connection terminals 16, 16... and leads 21, 21,... The conductive particles in the pressurized part overlap as the adhesive in the part) is pushed laterally, and only this part becomes electrically conductive.

On the other hand, the liquid crystal display panel 30 includes a resin transparent film substrate 31&e3 on which display electrodes (not shown) are formed on the inner surface.
1b is adhered around it through a sealing material 32,
A liquid crystal 33 is filled between the two difference plates 31m3Ib, and polarizing plates 34m,
It is of the TN type (twisted nematic type) to which 34b is glued, and a reflecting plate 35 is glued to the lower surface.

The terminal electrodes (not shown) of this liquid crystal display panel 30 are connected to an upper film substrate 31 which is wider than the lower film substrate sib.
& is arranged on the lower surface of one side part (the part protruding outside of the lower film substrate 31b).

Further, the display mounting opening 14 provided in the substrate 10 is sized to accommodate the lower part of the liquid crystal display panel 30 excluding the upper film substrate 31m.
0, the lower part thereof is fitted into the display mounting opening 14, the terminal arrangement part of the upper film substrate 31a is overlapped with the display connection terminal arrangement part of the board 10, and heat and pressure is applied from the lower surface side of the board 10. Okay, the terminal electrodes on the display panel 30 side are connected to the display body connection terminals 17 on the substrate 10 side using the hot-melt anisotropic conductive adhesive 28 applied to the surface of the substrate 10.
*17 #... and is attached to the substrate 10 by adhering the opposite side of the upper film substrate 31a to the upper surface of the substrate with an insulating adhesive 29.

Next, the structure of the page/quarter-shaped battery 40 will be explained with reference to FIG.

This E/4-shaped battery 4o has a negative electrode sheet 41a made of a conductive metal sheet such as aluminum or stainless steel.
An electromotive unit 42 is provided between the negative electrode sheet 411L and the positive electrode sheet 41b, and the periphery of the electromotive unit 42 is sealed by adhering the negative electrode sheet 411L and the positive electrode sheet 41b at their outer peripheries with a sealing material 43, The electromotive unit 42 has a structure in which a negative electrode active material 44 made of metallic lithium and a positive electrode active material 45 made of manganese dioxide are laminated with a separator 46 made of polypropylene nonwoven fabric impregnated with an organic electrolyte solution sandwiched therebetween. There is.

The electromotive principle of this Eper-shaped battery 4o is the same as that of a wholesaler's lithium battery, but the total thickness of the battery is 400 to 450 mm.
μ and wholesale lithium battery (the thinnest one is 1.6w thick)
It is much thinner than M).

Further, on one end side of this E-shaped battery 40, a negative electrode terminal 471L (
1) and a positive electrode terminal 47b extending from the lower positive electrode sheet 41b and bent so as to be lined up at the same height as the negative electrode terminals 47a. , the upper surface of the negative electrode sheet) 4Ja, and the lower side of the substrate 10
To install the battery, fit it into the opening 15 and connect the negative terminal 47m.
and a hot melt type anisotropic conductive adhesive 28 applied to the battery connection terminal forming portion of the substrate 10 to connect the positive electrode terminal 47b.
Battery connection terminal 18 a t 18 on the side of the board 10
b, and the other end of the negative electrode sheet 41h is attached to the substrate 10 by adhering it to the upper surface of the substrate with an insulating adhesive 29.

On the other hand, in Figures 1 to 4, 60a#sob is LS
The coating film 50 is a coating film formed by coating an insulating material on both sides of the substrate 10 to which the I-chip fzo, liquid crystal display panel 30, and paper battery 40 are attached by means such as printing or roll coating.
Materials for av50b include epoxy, acrylic,
Vinyl chloride-based or polyester-based polymer resins are used.

The coating films 50m and 50b are also applied to each opening 1B and 14.15 of the substrate 10, respectively.
The outer surfaces of the coating films 50h and 50b are smooth so that the LSI chip 20, liquid crystal display nonel 30, and P/4-shaped battery 40 fitted in the housing 5 are fixed. It is said to be the front and back sides of an electronic calculator. The coating films 50a and 50b are opaque films colored in arbitrary colors.

Further, among the coating films 50* and 50b, the coating film sob on the back side is coated on the entire surface of the substrate 10, and the coating film 50a on the front side is coated on the display surface of the liquid crystal display panel 30 and each touch electrode 11.11. ...
The entire upper surface of the substrate 10 except for the corresponding portions is coated, and once the mother panel 30 of the liquid crystal display is displayed, a transparent protective layer made of polymer resin is coated on this portion by means such as screen printing. It is covered with a membrane 51.

Note that this protective film 51 may be omitted.

This small electronic calculator has each opening 13.14 of the substrate 10.
．． 15, the LSI chip 20, the liquid crystal display panel A, the panel 3 Q, and the P14-shaped battery 40 are fitted into the board 10.
Each of the upper connection terminals 16e 16r..., 17, 1
7#..., IIIm, 18b and attached to the substrate 10, coating films 601L and 50b are formed by coating both sides of the substrate 10 with an insulating material so that the outer surfaces thereof are smooth. At the same time,
This small electronic calculator is manufactured by coating the transparent protective film 51 directly on the display of the liquid crystal display/gunnel 30 flush with the surface side coating film 50. However, it is easier to manufacture than conventional devices in which the front and back surfaces of the device are formed of sheet members.

Regarding the thickness of the above-mentioned small electronic calculator, the thickness of the substrate 10 is approximately 400 μm, and the thickness of the LSI chip 20 is 250 to 300 μm (leads 21 overlapping the substrate 10).
．． 21. ... has a thickness of approximately 50μ), liquid crystal display panel 3
0 has a thickness of 450 to 500μ (the thickness of the portion protruding onto the substrate 10 is approximately 150μ), and the thickness of the E-Δ-shaped battery 4o is 400 to 450μ (the thickness of the portion protruding onto the substrate 10 is approximately 150μ). 50μ), and the thickness of the coating film 50& on the surface side is 2
The thickness of the coating film SOB on the back side is 100-150μ, and the total thickness of this small electronic calculator is 0.7m-0.8m.

6 to 10 show a second embodiment of the present invention, and the small-sized electronic computer of this embodiment is of an input type using a capacitive touch switch. The electronic computer calculator of this embodiment is the same as the first embodiment except for the input method of the key manual section, so the explanation thereof will be omitted by assigning the same reference numerals to the figures. do.

That is, the small electronic calculator of this embodiment is shown in FIGS.
As shown in FIG. 8, a pair of electrodes 60a are provided on the upper surface of the portion of the board 10 that will become the key operator.

Capacitive touch switch electrode 60 consisting of 60b,
60. The coating film 50a coated on the upper surface side of the substrate 10 is formed so as to cover the touch switch electrodes 50, 60°... Key code 6 corresponds to touch switch electrode 60°60,...
1.61... is printed, and the coating film part of the key manual part is formed thinner than other parts.

FIG. 9 shows a circuit constituting a capacitive touch switch, in which a pair of electrodes 60h formed on the substrate 10 and covered with an insulating coating film 50&;
Among the electrodes 60b, one electrode 60g is connected to the high potential Vlla side, and the other electrode eob is connected to the input side of the CMOS inverter 2), and a resistor R is connected to the connection point between the electrode 60b and the inverter 2. A driving Norse signal 1 output from a pulse generator 3 is provided via the pulse generator 3. Further, the output signal of the inverter 2 is applied to the reset terminal R of the R87 flip-flop 4, and the pulse signal C output from the Noculus generator 3 is applied to the set terminal S of the RS flip-flop 4. . Furthermore, the Q terminal output of the RS flip f70 is given to the delay terminal of the D type flip 7 of 5.
A Δ pulse signal outputted from the pulse generator 3 is applied to the clock terminal C of the 0-tube 5. The Q terminal output VOU'r of this D-type flip-flop 5 is sent as a switch operation signal to a switch input circuit (not shown). Note that the switch input circuit turns the switch ON when the switch operation signal VOυ from the output terminal is at a high potential, and turns the switch O when the switch operation signal VOUT is at a low potential.
Operates to become FF.

The operation of this capacitance detection type touch switch will be explained with reference to the operation timing chart in FIG. When the surface of the membrane EOh is not touched by a finger, this drive/f pulse signal a is input to the inverter 2 only via the resistor R, and therefore the inverter 2 receives the drive pulse a from the pulse generator 3. Outputs an inverted waveform signal.

In addition, the pulse signal output from the Noculus generator 3,
C is designed to be output prior to the drive/bus pulse signal a.

Therefore, when the finger is not touching the surface of the coating film 50a on the touch switch electrode 60, the RS flip f70
The knob 4 is set by the /J pulse signal C from the pulse generator 3 and reset by the output signal of the inverter 2. At this time, the Q terminal output of the D-type 7 logic flop 5, which is clocked by the pulse signal from the pulse generator 3, remains at a low potential, and therefore the switch operation signal Vo sent to the switch input circuit is at a low level. Since it is at a potential, the switch is kept in an OFF state at this time.

Moreover, the coating film 5 on the touch switch electrode 60
When you touch the 01 surface with your finger, a pair of electrodes 60 m, 60
．． A resistance component R due to the human body and a capacitor component CF due to the human body and the coating film 51a are formed between
Therefore, the input voltage applied to the input side of the inverter 2 when the driving pulse is output from the pulse generator 3 becomes a voltage divided by the resistors R, R. This divided voltage is input to the inverter 2 in a form whose waveform is distorted due to the charging action of the capacitor component cr.

Since the drive/bus pulse signal a has a pulse width tv of only 120 μs, the inverter input reaches a high potential before the input voltage of the inverter 20 exceeds the threshold voltage vth of the inverter 2. Nasi,
Therefore, the output of the inverter 2 remains at a low potential even when the drive pulse signal is output from the pulse generator 3.

Therefore, while the finger is touching the coating film 50 & surface on the touch switch electrode 60, the RS flip 70
The knob 4 is not reset and the Q terminal output remains in the state of '1#. Therefore, the D-type 7 logic flop 5 becomes set state by the pulse signal from the pulse generator 3) and the Q terminal output remains in the state of '1#'. Since a high potential signal is output from the terminal, the switch operation signal VOUT sent to the switch input circuit becomes high potential and the switch is turned on.

As described above, the small electronic calculator of this embodiment uses an input method using a capacitive touch switch.
This small electronic calculator also has a substrate 10 on which an LSI chip 7''20, a liquid crystal display panel 30, and a paper battery 40 are attached.
Since both surfaces of the device are coated with an insulating material and the coating films 5θh and 50b form the front and back surfaces of the device, it can be easily manufactured in the same way as the first embodiment.

11 to 13 show a third embodiment of the present invention, and the small electronic calculator of this embodiment uses a mechanical key switch for input.

To explain this embodiment, fixed contacts 70, 10°, . 10, an LSI chip 20, a liquid crystal display channel 30, and an E-shaped battery 40 are attached in the same manner as in the first embodiment. In this embodiment, the upper surface of the LSI chip 20 is molded with an insulating resin 23 and the leads 21, 21 . The installation of ... protects the parts.

Further, 50* and 50b are coating films that are formed by coating both sides of the substrate 10 with an insulating material, and are used as the front and back surfaces of the device. The coating film 50b on the back side is formed on the entire bottom surface of the substrate 10.

On the other hand, 71 is a coaching film 50a on the upper surface of the substrate 10.
This top sheet 71 is a flexible top sheet made of resin film that covers the parts not covered by the top sheet. It is laminated on the upper surface of the substrate 10 via an insulating adhesive 73 which also serves as a layer. This adhesive 73 is used to attach the LSI chip 0, the liquid crystal display Δ panel 30, and the paper battery 40, and to each fixed contact 70.
,70. .

Further, on the surface of the top sheet 21, each of the fixed contacts 70
,70. . . . key codes 74, 74 .
... is printed on the back side of this part, and when the key part is pressed with a finger, the top sheet 71 deforms downward and comes into contact with the fixed contact 70, and both contacts Electrode 7
oz.

A movable contact 75 is printed to short circuit 70b.

Note that in FIGS. 11 to 13, the same parts as those described in the first embodiment are designated by the same reference numerals, and the description thereof will be omitted.

That is, the small electronic calculator of this embodiment has a substrate 10
A front side coating film 50a covering the upper surface is formed except for the key manpower part, and a top sheet 71 on which a movable contact 75 is formed is provided in the key manpower part, and the movable contact 75 and the substrate 1 are provided.
In this embodiment, a top sheet 71 must be adhered to a part of the upper surface of the substrate 10 via a spacer film 73. However, it is still much easier to manufacture than conventional products in which both the front and back sides are formed of sheet members.

Note that in the third embodiment, the LSI
Although the chip placement area is also covered, this LSI chip placement area may be covered with a surface-side coating film 50& in the same manner as in the first and second embodiments. Although the Δ-shaped battery 40 is used, this power supply battery may also be a solar battery, and in that case, a large light-extracting window may be provided on the surface side coating film 50a to allow the solar battery to receive light. . Note that this large light-extracting window may be used as an opening, and a transparent protective film for the surface of the solar cell may be fitted into this opening, or the opening may be coated with a transparent resin, and this transparent resin may also serve as a transparent protective film for the surface of the solar cell. It's okay.

In addition, since solar cells are very thin, with a thickness of about 200 μm (the actual thickness excluding the transparent protective film is about 120 μm), when using solar cells, an opening 15 is provided for mounting the battery on the substrate 10. A solar cell may be adhered to the upper surface of the substrate without providing it.

Furthermore, in each of the above embodiments, the LSI chip 0, the liquid crystal display panel 30, and the battery 40 are connected to the connection terminal 16 on the substrate 10.
,16. ..., 17, 17. ....

Although an anisotropic conductive adhesive is used to connect the terminals to the terminals 18 a * 18 b, each terminal may be connected individually using a normal conductive adhesive, or each The terminals may be brought into contact and fixed with UV ink.

Note that the present invention can be widely applied not only to small electronic calculators but also to other small electronic devices.

〔Effect of the invention〕

Although the small electronic device of the present invention has a substantially laminated structure, it can be manufactured more easily than conventional small electronic devices with a laminated structure.

[Brief explanation of the drawing]

1 to 5 show a first embodiment of the present invention, and FIGS. 1 and 2 are an exploded perspective view of a small electronic calculator and an external view of the completed product, and FIGS. FIG. 4 is an enlarged cross-sectional view taken along lines AA and B-B of diagram M2, and FIG. 5 is a circuit diagram of the resistance detection type touch switch. 6 to 10 show a second embodiment of the present invention. FIGS. 6 and 7 are an exploded perspective view of a small electronic calculator and an external view of the completed product, and FIG. 7, and FIGS. 9 and 10 are a circuit diagram and an operation timing chart of the capacitive touch switch. 11 to 13 show a third embodiment of the present invention, in which FIGS. 11 and 12 are an exploded perspective view and an external view of the finished product, and FIG. FIG. 13 is an enlarged sectional view taken along line DD in FIG. 12; 10... Board, 13... Opening for LSI chip installation, 14... Opening for display mounting, 15... Opening for battery installation, 19... Wiring, 20... LSI chip ,
30...Liquid crystal display panel, 40...Eper-shaped battery, 50m, 50b...Coating film, 71...Top sheet. Applicant's Patent Attorney Takehiko Suzue Figure 1 11b 11a (-1mer) Figure 2 Figure 4 VDD Figure 6 Figure 7 12 31! ! ! 1st

Claims (1)

[Claims] Forming wiring that connects the integrated circuit chip, the display body, and the battery in a small electronic device that includes an integrated circuit chip, a display body whose display is driven by a drive signal from the integrated circuit chip, and a thin battery for power supply. an integrated circuit chip, a display body, and a battery are mounted on a substrate, and at least the integrated circuit chip and the display body are fitted into an opening provided in the substrate, and both sides of the substrate are coated with an insulating material, and a coating film is applied to the substrate. A small electronic device characterized by forming the front and back sides of the device.