JPS6139145A - Small-sized electronic equipment - Google Patents

Abstract

PURPOSE:To facilitate the manufacture of the electronic equipment in lamination structure by forming openings where an integrated circuit chip, display body, and battery are fitted in a substrate and making connections among those chip, display body, and battery through wiring on the substrate, and then forming a surface film of a coating material on the surface of the substrate. CONSTITUTION:An opening 13 for fitting plural touch electrodes 11 as a key input part and the LSI chip 20, an opening 14 for fitting a liquid-crystal display panel 30, and an opening 15 for fitting the paper type battery 40 are formed in the substrate 10 made of resin. The chip 20, panel 30, and battery 40 are fitted in those openings 13-15, and connection terminals 16, 17, and 18 and touch electrodes 11 at end parts of the openings 13-15 are connected mutually through the wiring 19 on the substrate 10. A reverse surface sheet 52 as the reverse surface of the electronic equipment is provided on the reverse surface side of the substrate 10 and the top surface side of the substrate 10 is coated with an insulating material to use the coating film 50 as the top surface of the electronic equipment. Then, the manufacture of the small-sized electronic equipment in the laminate structure is facilitated.

Description

[Detailed description of the invention] [Technical field of invention] This invention relates to small electronic equipment.

[Technical background of the invention and its problems]

Recently, small electronic devices such as small electronic calculators have become thinner and thinner, and especially those that use thin batteries such as peno zigzag cells and solar cells as power batteries are using button-type batteries. It is much thinner than those used as power batteries.

There are various structures for small electronic devices that use thin batteries as power batteries, but among them, the so-called laminated structure has the thinnest thickness of about 0.8 trtm.

This small electronic device with a laminated structure has an integrated circuit chip, a display body such as a liquid crystal display panel whose display is driven by a drive signal from the integrated circuit chip, and a wiring board on which the thin battery is attached, which is fitted into a frame. , a top sheet and a back sheet that form the front and back surfaces of the device are layered and adhered above and below, and the space inside the frame is filled with a filler, and at least among the integrated circuit chip, display body, and thin battery, The integrated circuit 7 degrees and the display body are fitted into openings provided in the wiring board in order to reduce the mounting height.

In this small electronic device with a laminated structure, a top sheet and a back sheet are stacked on both sides of a wiring board, and the device case is made up of these sheets. Therefore, the wiring board, etc. is stored inside the thin box-shaped device case. However, the thickness of the entire device can be made much thinner than the small electronic devices that have the same structure. Since the internal space is filled with a filler material, the assembly is done by gluing one sheet on top of one side of the wiring board, filling the filler material from the other side of the wiring board, and then The process of bonding one layer to the other by polymerization has to be carried out, and as a result, this small electronic device having a laminated structure has the problem of being troublesome to manufacture.

[Purpose of the invention]

This invention was made in view of the above-mentioned circumstances, and its purpose is that although it has a substantially laminated structure, it is easier to use than small electronic devices with a conventional laminated structure. The objective is to provide small electronic devices that can be manufactured in a number of ways.

[Summary of the invention]

That is, the present invention includes mounting an integrated circuit chip, a display body, and a battery on a substrate on which wiring is formed to connect the integrated circuit chip, the display body, and the battery, and fitting at least the integrated circuit chip and the display body into an opening provided in the substrate. As well as
A back sheet forming the back side of the device is provided on the bottom side of the substrate, an insulating material is coated on the top side of the substrate, and this coating film forms the front side of the device.

[Embodiments of the invention]

Embodiments of the present invention will be described below with reference to the drawings, taking a small electronic calculator as an example.

1 to 5 show a first embodiment of the present invention, and the small electronic calculator of this embodiment is of an input type using a resistor detection type switch.

To explain this first embodiment, in FIGS. 1 to 4, reference numeral 10 in the figure is a board made of polyester or polysulfone resin, and on the top surface of this board 10, a key is provided. Touch electrodes 11.11. ... are arranged in an array, and on the back surface of the substrate 10, each touch electrode 11, 11°...
The key codes 12 and 12 correspond to .

...is printed. Note that the board 10 has key codes 12, 12 . A transparent substrate is used so that the touch electrodes 11, 11 . . . are visible from the upper surface side of the substrate. A pair of electrodes 118 forming...
．． 11b is also a transparent electrode made of indium oxide or the like. In addition, in FIG. 2, the touch electrodes 11.11. ...
is omitted and the key code 12, 12 . It only shows...

FIG. 5 shows the circuit configuration of a resistance detection type touch switch, in which a pair of electrodes 11 forming a touch electrode 11 is shown.
*, one 11h of 11b is connected to the high potential vllS side, and the other touch electrode 11b is connected to the input side of the CMOS inverter 1, and the connection point between this touch electrode 11b and the inverter 1 is connected via a resistor R. and is connected to the low potential VDD side.

To explain the operation of this circuit, electrode 1 of touch electrode 11
When you are not touching 1a and llb, inverter 1
The input voltage vA of the inverter 1 is at a low potential, so the output voltage VOUT of the inverter 1 is at a high potential. Furthermore, when both electrodes 11g and 11b of the touch electrode 11 are touched with a finger as shown in the figure, since the two electrodes 11a and llb are connected through the human body resistance 2, the input side voltage of the inverter 1 is is the voltage divided by the resistors Z and R.If the value of the resistor is determined so that this divided voltage is equal to or higher than the threshold voltage of the inverter 1, the output voltage VOUT of the inverter 1 will be low. Therefore, when the output voltage vOUT of the inverter 1 becomes a high potential, the switch is turned off, and the inverter output voltage vo
If the switch is turned on when u'r becomes a low potential, then
When you touch the touch electrode 11 with your finger, the touch switch turns O.
When the touch switch is in the N state, if you release your finger, the touch switch will be in the OFF state.

The substrate 10 also has an opening 13 for mounting a large-scale integrated circuit chip (hereinafter referred to as an LSI chip) into which a large-scale integrated circuit chip (hereinafter referred to as an LSI chip) 20 is inserted, and a display body such as a liquid crystal display panel 30.
An aperture 14 is provided for display mounting, into which a thin battery such as a paper battery 40 is inserted, and an aperture 15 is provided for battery mounting, into which a thin battery such as a paper-like battery 40 is inserted. Chip connection terminal 16°16,・
... are formed into an array.

-! , In addition, display body connection terminals 11, 17. . . are arranged in an array, and a pair of battery connection terminals 18*, 18b are formed at one end edge of the battery mounting opening 15, and the display body connection terminals 1'l, 17. ...and battery connection terminal 18m, 18
b and the electrodes 11h, 11b of the touch electrodes J1, J1, . . . are connected to LSI chip connection terminals 16.degree. It is connected.

The LSI chip 20 is fitted into the opening 13 for mounting the LSI chip on the substrate 10, and the terminal electrodes of the LSI chip 20 are connected to the LSI chip connection terminals 16, 16.
．． ... and attached to the board 10.

To explain the connection between the terminal electrode of this LSI chip f2o and the LSI chip connection terminal 16, FIGS.
In the figure, 21.21. ... is LSI chip 20
This lead is attached by pulse heating to the top of a gold wire 22.22 which is bent into an inverted U-shape and inserted onto each terminal electrode (not shown) of the leads 21.21. ... is LSI Chi, 7p2 o
After heating the wires 22 and 22 in a lead frame with a large number of lead parts corresponding to each terminal electrode, the wires were individually separated by cutting off the frame part of the lead frame. It is something. The lead frame is made by laminating copper foil so as to cover the opening and etching it to form a large number of lead parts corresponding to each terminal electrode of the LSI chip 20, and each IJ
- The lead portion is tin-plated, and the carrier chive is separated from the lead 21.21 by cutting off the frame portion after pulse heating the lead portion to the wire 22.22. Therefore, the lead 2
1.21. ... has a two-layer structure consisting of a copper foil and a tin plating layer.

1 and 3, reference numeral 28 indicates each connection terminal 16, 16, . ..., 17°17 + ”・
, 18 a + 18 b, and the leads 2 are connected to each terminal electrode of the LSI chip 20 using a hot melt type anisotropic conductive adhesive applied to the upper surface of the portion.
1*21+... is the anisotropic conductive adhesive 28
LSI chip connection terminal 16.16. It is adhesively connected to... The hot-melt anisotropically conductive adhesive is an insulating hot-melt adhesive mixed with conductive particles, and the anisotropically conductive adhesive 28 applied to the substrate 10 is screen printed. It was applied and then dried. In this state, the anisotropic conductive adhesive 2
8 indicates insulating properties (the conductive particles are spaced apart from each other), and the leads 21, 21,
. . , and when heated and pressed, the insulating hot melt adhesive is reactivated and the pressurized parts (LSI chip connection terminals 16, 16, . . . and leads 21, 21, . . . The conductive particles in the pressurized part overlap as the adhesive in the part in between is pushed laterally, and only this part becomes conductive.

On the other hand, the liquid crystal display channel 30 includes a resin transparent film substrate 31 a with display electrodes (not shown) formed on the inner surface.
+ J 1 b around the sealing material 32t-
Glue through, and 9 both boards 31&.

31b is filled with liquid crystal 33, and side substrate 31a is filled with liquid crystal 33.
, 31b with polarizing plates 34th and 34b adhered to the outer surfaces of T.
It is Nffi (twisted nematic type),
A reflecting plate 35 is adhered to the lower surface thereof.

The terminal electrodes (not shown) of this liquid crystal display panel 30 are connected to the upper film substrate 31 which is wider than the lower film substrate 31b.
They are arranged on the lower surface of one side part of g (the part protruding outside of the lower film substrate 31b).

Further, the display mounting opening 14 provided in the substrate 10 is sized to accommodate the lower part of the liquid crystal display panel 30 excluding the upper film substrate 31m, and the liquid crystal display panel 30 is attached to the lower part thereof. The terminal arrangement portion of the upper film substrate 31a is inserted into the display body mounting opening 14, and the terminal arrangement portion of the upper film substrate 31a is inserted into the substrate 10.
The terminal electrodes on the display panel 30 side are bonded to the display panel 30 side using the hot melt type anisotropic conductive adhesive 28 applied to the surface of the substrate 10 by applying heat and pressure from the bottom side of the substrate 10 over the display body connection terminal arrangement area. Display body connection terminal 17 on the board 10 side
,17. ... and is attached to the substrate 10 by adhering the opposite side of the upper film substrate 31a to the upper surface of the substrate with an insulating adhesive 29.

Next, the structure of the peno or one-state battery 4o will be explained with reference to FIG. 4.

This paper-like battery 4o is provided with an electromotive unit 42t between a negative electrode sheet 41a and a positive electrode sheet 41b made of a conductive metal sheet such as aluminum or stainless steel, and a negative electrode sheet 41h and a positive electrode sheet 41b at their outer periphery. The electromotive unit 4 is bonded with a sealing material 43.
The electromotive unit 42 is made by impregnating a polyglobylene nonwoven fabric or the like with an organic electrolyte solution, and a negative electrode active material 44 made of metallic lithium and a positive electrode active material 45 made of manganese dioxide. It has a structure in which the separators 46'f are stacked on both sides.

The electromotive principle of the -/4'-shaped battery 40 is the same as that of a button-shaped lithium battery, but the total thickness of the battery is 400 to 40 mm.
50μ and button type lithium battery (the thinnest one is 1.6cm thick)
It is much thinner than M).

Further, on one end side of this E-G type battery 40, a negative electrode terminal 47a (see FIG. 1) extending from the negative electrode sheet 41a on the upper surface and a negative electrode terminal 41h extending from the positive electrode sheet 41b on the lower surface are provided. A positive electrode terminal 47b is formed and bent so as to be lined up at the same height.
0, the lower side of the upper negative electrode sheet 41* is inserted into the battery mounting opening 15 of the board 10, and the negative electrode terminal 47a and the positive electrode terminal 47b are connected to the hot melt applied to the battery connection terminal forming part of the board 10. The anisotropically conductive adhesive 28 is used to adhesively connect the battery connecting terminals 18h and 18b on the substrate 10 side, and the other end of the negative electrode sheet 41a is adhered to the upper surface of the substrate using an insulating adhesive 29 to attach the substrate 10. installed on.

On the other hand, in FIGS. 1 to 4, 50 is an LSI chip 2.
A coating film is formed by coating the surface side of the substrate 10 on which the liquid crystal display panel 30 and the battery 40 are mounted by means of insulating material tube printing or roll coating. Materials for 50 include epoxy, acrylic, and vinyl chloride.
Polyester or polyester-based polymer resins are used.

This coating film 50 is applied to each opening 13, 14 of the substrate 10.
．． There are also LSI chips 20, liquid crystal displays, and panels 30 fitted in each opening 13° and 14.15.
The outer surface of the coating film 50 is a smooth surface and is used as the surface of a small electronic calculator. Note that this coating film 50 is an opaque film colored in an arbitrary color.

Further, the coating film 50 is applied to the liquid crystal display panel 30.
display surface and each touch electrode 11.11. The entire upper surface of the substrate 10 is coated except for the corresponding portions, and the display surface of the liquid crystal display panel 30 is coated with a transparent protective layer made of a polymeric resin coated on this portion by means such as screen printing. It is covered with a membrane 51. Note that this protective film 51 may not be provided.

Further, in FIGS. 1 to 4, 52 is a back sheet provided on the lower surface side of the substrate 10, and this back sheet 52 is made of a metal sheet such as stainless steel. This back sheet 52 forms the back surface of this JI 52td-1 small electronic calculator, and is laminated to the entire bottom surface of the substrate 1o. Further, this back sheet 52 also serves as an electrostatic shielding film, and the positive electrode sheet 41b of the penocou-shaped battery 40 is in contact with this back sheet 52.

Note that the back sheet 51 is not limited to a metal sheet, but may be a resin sheet.

This small electronic calculator is constructed by laminating a back sheet 52 on the bottom surface of the substrate 1o, and then opening each opening 13, 14 of the substrate 1°.
, 15 into which the LSI chip 20, liquid crystal display spring A/3θ, peno or linear battery 40 are fitted (liquid crystal display panel 30
(the back side of which is adhered to the back sheet 52 with adhesive tape 36) These are attached to each connection terminal 16° 16 on the board 10.
, 'r1.1rll+...'+18hr18b and attached to the substrate 10, the upper surface of the substrate 10 is coated with an insulating material so that the outer surface is smooth to form a coating film 5o, and the liquid crystal It is manufactured by coating the display surface of the display panel 30 with a transparent protective film 5 flush with the surface side coating film 50, and this small electronic calculator has a substantially laminated structure. However, it is easier to manufacture than conventional devices in which both the front and back surfaces of the device are made of sheet members.

Regarding the thickness of the above-mentioned small electronic calculator, the thickness of the substrate 10 is approximately 400 μm, and the thickness of the LSI chip 20 is 250 to 300 μm (leads 21 overlapping the substrate 10).
．． 21. ... has a thickness of approximately 50μ), liquid crystal display panel 3
0 has a thickness of 450 to 500μ (the thickness of the part protruding onto the substrate 10 is approximately 150μ), and the thickness of the 'ze-shaped battery 40 is 400 to 450μ (the thickness of the part protruding onto the substrate 10 is approximately 150μ). 50 μ), the thickness of the coating film 50 is 200 to 25
The thickness of the back sheet 52 is 100-150μ, and the total thickness of this small electronic calculator is 0.7-0.8 days.

6 to 10 show a second embodiment-1 of the present invention, and the small electronic calculator of this embodiment is of an input type using a capacitive touch switch.

The small electronic calculator of this embodiment is the same as the first embodiment except for the input method of the key input section, so the explanation thereof will be omitted by assigning the same reference numerals to the figures. do. In this embodiment, a metal sheet 52 is used as the back sheet 52, and the back sheet 52 is integrated with the board 10 by injection molding during molding of the substrate 10, so that lamination of the back sheet 52 during assembly is unnecessary. There is. Further, this back sheet 52 has a shape in which its outer peripheral portion is bent upward, and this bent portion 52a is embedded in the substrate 10 and is firmly coupled to the substrate 10.

That is, the small electronic calculator of this embodiment is shown in FIGS.
As shown in FIG. 8, a pair of electrodes 60a are provided on the upper surface of the portion of the board 10 that will become the key operator.

Electrode 60 for capacitive touch switch consisting of 60b
, 60 j . are associated with the respective touch switch electrodes 60, 60, . . . key symbols 61, 6.1. ... is printed, and the coating film part of the key manpower part is formed thinner than other parts.

FIG. 9 shows a circuit constituting a capacitive touch switch, in which a pair of electrodes 60g, 6 formed on the substrate 10 and covered with an insulating coating film 50 is shown.
Among 0b, one electrode 60m is connected to the high potential Vile side, the other electrode 60b is connected to the input side of CMOS inverter 2, and 17'i - this electrode 60b.
A drive pulse signal a output from an A' pulse generator 3 is applied to the connection point between the A' pulse generator 3 and the inverter 2 via a resistor R. Further, the output signal of the inverter 2 is applied to the reset terminal R of the RS flip-flop f4, and the pulse signal C output from the pulse generator 3 is applied to the set terminal S of the C1Rs7 flip-flop 4. Furthermore, R
The Q terminal output of the S flip-flop 7°4 is given to the delay terminal of the D-type flip-flop 5, and the clock terminal C of this D-type flip-flop 5 receives the pulses output from the pulse generator 3. Signals are given.

Q terminal output 'l'OUT of this D type flip-flop 5
is sent as a switch operation signal to a switch input circuit (not shown). The switch input circuit operates in such a manner that it turns ON when the switch operation signal VOUT from the output terminal is at a high potential, and turns OFF when the switch operation signal '10UT has a low potential.

The operation of this capacitive detection type touch switch will be explained with reference to the operation timing chart in FIG.
The drive pulse signal a output from the drive pulse signal a has a pulse width (low potential period) tw of approximately 120 μS, and when the surface of the coating film 50 on the touch switch electrode 60 is not touched by a finger, this drive pulse signal Since the pulse signal a is input to the inverter 2 only through the resistor R, the inverter 2 is A? A waveform signal obtained by inverting the drive pulse a from the pulse generator is output.

In addition, the pulse signal S, c output from the pulse generator 3
is outputted prior to the drive pulse signal a.

Therefore, when the surface of the coating film 50 on the touch switch electrode 60 is not touched by a finger, the RS flip-flop 4 is set by the pulse signal C from the pulse generator 3 and reset by the output signal from the inverter 2. will be done. At this time, i from the pulse generator 3
D-type flip flop clocked by 4 pulse signal 5
The output from the Q terminal remains at a low potential, and therefore the switch operation signal your sent to the switch input circuit is at a low potential, so at this time, the switch is switched.

The switch is kept in the OFF state.

Moreover, the coating film 5 on the touch switch electrode 60
When a finger touches surface 0, a resistance component RF due to the human body and a capacitor component CF due to the human body and the coating film 51 are formed between the pair of electrodes 60m and 60m, and therefore a driving pulse is output from the pulse generator 3. When the input voltage applied to the input side of the inverter 2 is
*The voltage is divided by RF. This divided voltage is input to the inverter 2 in a form in which the multiple waveforms are blunted due to the charging action of the capacitor component CF.

Since the drive pulse signal a has a pulse width tw of only 120 μB, the inverter input does not reach a high potential before the input voltage of the inverter 2 exceeds the threshold voltage vth of the inverter 2. The output of No. 2 remains at a low potential even when the driving pulse signal is output from the pulse generator 3.

Therefore, while the finger is touching the surface of the coating film 50 on the touch switch electrode 60,
4I/'i is not reset and the Q terminal output remains in the state of ``1''. Therefore, the D-type free and Zoflozzo 5 are set to the pulse signal from the pulse generator 3. Since it outputs a high potential signal from the Q terminal,
Switch operation signal VOUT sent to switch input circuit
becomes a high potential and the switch is turned on.

As described above, the small electronic calculator of this embodiment uses an input method using a capacitive touch switch.
This small electronic calculator also has an insulating material coated on the top surface of a substrate 10 on which an LSI chip 20, a liquid crystal display panel 30, and a paper battery 40 are attached, and this coating film 50 forms the bottom surface of the device. Said first
It can be easily manufactured in the same manner as in the embodiment.

In addition, in each of the above embodiments, the power supply battery and! Although the power supply battery 40 is used, a solar battery may also be used as the power supply battery. In that case, a large light-extracting window is provided on the surface side coating film 5Q to allow the solar battery to receive light. Just set it up. In addition, the Toa Mitsutori large window can be used as an opening, and a transparent protective film for the surface of the solar cell may be fitted into this opening, or the opening can be coated with a transparent resin and this transparent resin can also serve as a transparent protective film for the surface of the solar cell. You may let them.

In addition, since the solar cell is very thin at about 200 μm in thickness (the actual thickness excluding the transparent protective film is about 120 μm), when using this solar cell, a 15-t opening is provided in the substrate 10 for mounting the battery. Alternatively, the solar cell may be bonded to the top surface of the substrate.

Further, in each of the above embodiments, the LSI chip 20, the liquid crystal display panel 30, and the battery 40 are connected to the connection terminal 16 on the substrate 10.
,16. ..., 17.1? ,...

Although an anisotropic conductive adhesive is used to connect 18 a y 18 b, each terminal may be connected individually using a normal conductive adhesive instead of this, or each terminal may be connected individually using an ordinary conductive adhesive. You may also contact them and fix them with a UV fixer.

Note that the present invention can be widely applied not only to small electronic calculators but also to other small electronic devices.

〔Effect of the invention〕

Although the small electronic device of the present invention has a substantially laminated structure, it can be manufactured more easily than conventional small electronic devices with a laminated structure.

[Brief explanation of drawings]

1 to 5 show a first embodiment of the present invention, and FIGS. 1 and 2 are an exploded perspective view of a small electronic calculator and an external view of the completed product, and FIGS. FIG. 4 is an enlarged sectional view taken along lines AA and B-B in FIG. 2, and FIG. 5 is a circuit diagram of the resistance detection type touch switch. 6 to 10 show a second embodiment of the present invention. FIGS. 6 and 7 are an exploded perspective view of a small electronic calculator and an external view of the completed product, and FIG. 7, and FIGS. 9 and 10 are a circuit diagram and an operation timing chart of the capacitive touch switch. 10...F+ board, J g...Opening for LSI and Z installation, 14...Opening for display unit installation, 15...Opening for battery installation, 19...Wiring, 20. ...LSI chip, 30°...Liquid crystal display panel, 40...Paper battery, 50...Coating film, 52...Back sheet. Applicant's agent Patent attorney Takehiko Suzue Figure 4 Figure 5 Vo. Figure 6

Claims (1)

[Claims] Forming wiring that connects the integrated circuit chip, the display body, and the battery in a small electronic device that includes an integrated circuit chip, a display body whose display is driven by a drive signal from the integrated circuit chip, and a thin battery for power supply. An integrated circuit chip, a display body, and a battery are attached to the substrate, and at least the integrated circuit chip and the display body are fitted into an opening provided in the substrate, and a back sheet that becomes the back surface of the device is provided on the bottom side of the substrate. A small electronic device characterized by coating the upper surface of the substrate with an insulating material and forming the surface of the device with this coating film.