JPS6138862B2 - - Google Patents

Info

Publication number
JPS6138862B2
JPS6138862B2 JP55005176A JP517680A JPS6138862B2 JP S6138862 B2 JPS6138862 B2 JP S6138862B2 JP 55005176 A JP55005176 A JP 55005176A JP 517680 A JP517680 A JP 517680A JP S6138862 B2 JPS6138862 B2 JP S6138862B2
Authority
JP
Japan
Prior art keywords
lead frame
shaped molded
mold
molded product
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP55005176A
Other languages
English (en)
Japanese (ja)
Other versions
JPS56101760A (en
Inventor
Keiji Hazama
Mitsuyoshi Nakatsuka
Shinichi Oota
Kiichi Kanamaru
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP517680A priority Critical patent/JPS56101760A/ja
Publication of JPS56101760A publication Critical patent/JPS56101760A/ja
Publication of JPS6138862B2 publication Critical patent/JPS6138862B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W95/00—

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP517680A 1980-01-18 1980-01-18 Formation of package of semiconductors Granted JPS56101760A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP517680A JPS56101760A (en) 1980-01-18 1980-01-18 Formation of package of semiconductors

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP517680A JPS56101760A (en) 1980-01-18 1980-01-18 Formation of package of semiconductors

Publications (2)

Publication Number Publication Date
JPS56101760A JPS56101760A (en) 1981-08-14
JPS6138862B2 true JPS6138862B2 (cg-RX-API-DMAC10.html) 1986-09-01

Family

ID=11603922

Family Applications (1)

Application Number Title Priority Date Filing Date
JP517680A Granted JPS56101760A (en) 1980-01-18 1980-01-18 Formation of package of semiconductors

Country Status (1)

Country Link
JP (1) JPS56101760A (cg-RX-API-DMAC10.html)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4872825A (en) * 1984-05-23 1989-10-10 Ross Milton I Method and apparatus for making encapsulated electronic circuit devices
US4680617A (en) * 1984-05-23 1987-07-14 Ross Milton I Encapsulated electronic circuit device, and method and apparatus for making same

Also Published As

Publication number Publication date
JPS56101760A (en) 1981-08-14

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