JPS6119117B2 - - Google Patents
Info
- Publication number
- JPS6119117B2 JPS6119117B2 JP54126114A JP12611479A JPS6119117B2 JP S6119117 B2 JPS6119117 B2 JP S6119117B2 JP 54126114 A JP54126114 A JP 54126114A JP 12611479 A JP12611479 A JP 12611479A JP S6119117 B2 JPS6119117 B2 JP S6119117B2
- Authority
- JP
- Japan
- Prior art keywords
- plate
- shaped molded
- mold
- lead frame
- molded product
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H10W95/00—
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12611479A JPS5648155A (en) | 1979-09-27 | 1979-09-27 | Package forming method for semiconductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12611479A JPS5648155A (en) | 1979-09-27 | 1979-09-27 | Package forming method for semiconductor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5648155A JPS5648155A (en) | 1981-05-01 |
| JPS6119117B2 true JPS6119117B2 (cg-RX-API-DMAC10.html) | 1986-05-15 |
Family
ID=14926974
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12611479A Granted JPS5648155A (en) | 1979-09-27 | 1979-09-27 | Package forming method for semiconductor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5648155A (cg-RX-API-DMAC10.html) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5919359A (ja) * | 1982-07-23 | 1984-01-31 | Hitachi Chem Co Ltd | 半導体類のパツケ−ジ成形方法 |
| JPS62224949A (ja) * | 1986-03-27 | 1987-10-02 | S M C:Kk | Ｉｃパツケ−ジ |
| US5156983A (en) * | 1989-10-26 | 1992-10-20 | Digtial Equipment Corporation | Method of manufacturing tape automated bonding semiconductor package |
| JPH06252283A (ja) * | 1993-02-24 | 1994-09-09 | Kyocera Corp | 半導体装置 |
| TW466720B (en) * | 2000-05-22 | 2001-12-01 | Siliconware Precision Industries Co Ltd | Semiconductor package with flash-prevention structure and manufacture method |
| KR100415281B1 (ko) * | 2001-06-29 | 2004-01-16 | 삼성전자주식회사 | 양면 실장형 회로 기판 및 이를 포함하는 멀티 칩 패키지 |
-
1979
- 1979-09-27 JP JP12611479A patent/JPS5648155A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5648155A (en) | 1981-05-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP0084631A1 (en) | Laser joining of thermoplastic and non-thermoplastic materials | |
| US4305897A (en) | Packaging process for semiconductors | |
| JPS6119117B2 (cg-RX-API-DMAC10.html) | ||
| US5348214A (en) | Method of mounting semiconductor elements | |
| JPS6333298B2 (cg-RX-API-DMAC10.html) | ||
| JP4248226B2 (ja) | レーザ溶着された組立体 | |
| JP2561546B2 (ja) | プラスチックと金属箔の複合体からなる箱状成形品の製造方法 | |
| JPS6138862B2 (cg-RX-API-DMAC10.html) | ||
| JPS58185B2 (ja) | 半導体類のパッケ−ジ成形方法 | |
| JPS6161965B2 (cg-RX-API-DMAC10.html) | ||
| JPS6434722A (en) | Fusing of thermoplastic resin molded body | |
| CN113938581B (zh) | 光学组件及其组装方法 | |
| JPS5851423B2 (ja) | 半導体類のパッケ−ジ成形方法 | |
| TW201924315A (zh) | 攝像模組及其感光元件、電子設備、成型模具和製造方法 | |
| JPS59118426A (ja) | プラスチツク体の接合方法 | |
| JP2003276087A (ja) | 樹脂材の接合方法 | |
| JPS6140135B2 (cg-RX-API-DMAC10.html) | ||
| JPS6271626A (ja) | 異種合成樹脂材料の接合方法 | |
| JP3077530B2 (ja) | 灯具用レンズの振動溶着構造 | |
| JPS6022819B2 (ja) | 半導体素子のモ−ルド用金型 | |
| JPS6012784B2 (ja) | 半導体類のパツケ−ジ成形方法 | |
| CN222105803U (zh) | 一种用于相机的交接装置 | |
| JPS6019662B2 (ja) | 半導体類のパツケ−ジ成形方法 | |
| JPS6262734A (ja) | レ−ザによる熱可塑性樹脂の接合方法 | |
| JP4254487B2 (ja) | 半導体装置 |