JPS6138810B2 - - Google Patents
Info
- Publication number
- JPS6138810B2 JPS6138810B2 JP54149464A JP14946479A JPS6138810B2 JP S6138810 B2 JPS6138810 B2 JP S6138810B2 JP 54149464 A JP54149464 A JP 54149464A JP 14946479 A JP14946479 A JP 14946479A JP S6138810 B2 JPS6138810 B2 JP S6138810B2
- Authority
- JP
- Japan
- Prior art keywords
- metal
- plating
- substrate
- resist
- etching
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000007747 plating Methods 0.000 claims description 85
- 229910052751 metal Inorganic materials 0.000 claims description 66
- 239000002184 metal Substances 0.000 claims description 65
- 239000000758 substrate Substances 0.000 claims description 59
- 238000005530 etching Methods 0.000 claims description 47
- 238000000034 method Methods 0.000 claims description 36
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 34
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 30
- 239000010949 copper Substances 0.000 claims description 29
- 229910052802 copper Inorganic materials 0.000 claims description 26
- 238000004519 manufacturing process Methods 0.000 claims description 16
- 229910052759 nickel Inorganic materials 0.000 claims description 16
- 150000002739 metals Chemical class 0.000 claims description 12
- 238000007772 electroless plating Methods 0.000 claims description 8
- 239000002131 composite material Substances 0.000 claims description 5
- 238000009713 electroplating Methods 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 239000010410 layer Substances 0.000 description 23
- 239000011889 copper foil Substances 0.000 description 5
- 229910001006 Constantan Inorganic materials 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- 238000001259 photo etching Methods 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- 238000010306 acid treatment Methods 0.000 description 2
- ROOXNKNUYICQNP-UHFFFAOYSA-N ammonium persulfate Chemical compound [NH4+].[NH4+].[O-]S(=O)(=O)OOS([O-])(=O)=O ROOXNKNUYICQNP-UHFFFAOYSA-N 0.000 description 2
- 230000003197 catalytic effect Effects 0.000 description 2
- 238000005238 degreasing Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- UOCLXMDMGBRAIB-UHFFFAOYSA-N 1,1,1-trichloroethane Chemical compound CC(Cl)(Cl)Cl UOCLXMDMGBRAIB-UHFFFAOYSA-N 0.000 description 1
- 240000000489 Agave utahensis Species 0.000 description 1
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 1
- 108010010803 Gelatin Proteins 0.000 description 1
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 229910001870 ammonium persulfate Inorganic materials 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- BGTFCAQCKWKTRL-YDEUACAXSA-N chembl1095986 Chemical compound C1[C@@H](N)[C@@H](O)[C@H](C)O[C@H]1O[C@@H]([C@H]1C(N[C@H](C2=CC(O)=CC(O[C@@H]3[C@H]([C@@H](O)[C@H](O)[C@@H](CO)O3)O)=C2C=2C(O)=CC=C(C=2)[C@@H](NC(=O)[C@@H]2NC(=O)[C@@H]3C=4C=C(C(=C(O)C=4)C)OC=4C(O)=CC=C(C=4)[C@@H](N)C(=O)N[C@@H](C(=O)N3)[C@H](O)C=3C=CC(O4)=CC=3)C(=O)N1)C(O)=O)=O)C(C=C1)=CC=C1OC1=C(O[C@@H]3[C@H]([C@H](O)[C@@H](O)[C@H](CO[C@@H]5[C@H]([C@@H](O)[C@H](O)[C@@H](C)O5)O)O3)O[C@@H]3[C@H]([C@@H](O)[C@H](O)[C@@H](CO)O3)O[C@@H]3[C@H]([C@H](O)[C@@H](CO)O3)O)C4=CC2=C1 BGTFCAQCKWKTRL-YDEUACAXSA-N 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 150000001879 copper Chemical class 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- PEVJCYPAFCUXEZ-UHFFFAOYSA-J dicopper;phosphonato phosphate Chemical compound [Cu+2].[Cu+2].[O-]P([O-])(=O)OP([O-])([O-])=O PEVJCYPAFCUXEZ-UHFFFAOYSA-J 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000008273 gelatin Substances 0.000 description 1
- 229920000159 gelatin Polymers 0.000 description 1
- 235000019322 gelatine Nutrition 0.000 description 1
- 235000011852 gelatine desserts Nutrition 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- KERTUBUCQCSNJU-UHFFFAOYSA-L nickel(2+);disulfamate Chemical compound [Ni+2].NS([O-])(=O)=O.NS([O-])(=O)=O KERTUBUCQCSNJU-UHFFFAOYSA-L 0.000 description 1
- 239000012811 non-conductive material Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 238000002203 pretreatment Methods 0.000 description 1
- 239000013049 sediment Substances 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 230000001568 sexual effect Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- -1 that is Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 238000004073 vulcanization Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/80—Constructional details
- H10N10/81—Structural details of the junction
- H10N10/817—Structural details of the junction the junction being non-separable, e.g. being cemented, sintered or soldered
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/01—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/80—Constructional details
- H10N10/85—Thermoelectric active materials
- H10N10/851—Thermoelectric active materials comprising inorganic compositions
- H10N10/854—Thermoelectric active materials comprising inorganic compositions comprising only metals
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Photometry And Measurement Of Optical Pulse Characteristics (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14946479A JPS5672321A (en) | 1979-11-20 | 1979-11-20 | Radiation thermocouple and its manufacture |
| US06/206,257 US4343960A (en) | 1979-11-20 | 1980-11-12 | Thermopile and process for manufacturing same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14946479A JPS5672321A (en) | 1979-11-20 | 1979-11-20 | Radiation thermocouple and its manufacture |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5672321A JPS5672321A (en) | 1981-06-16 |
| JPS6138810B2 true JPS6138810B2 (cg-RX-API-DMAC7.html) | 1986-09-01 |
Family
ID=15475695
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14946479A Granted JPS5672321A (en) | 1979-11-20 | 1979-11-20 | Radiation thermocouple and its manufacture |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US4343960A (cg-RX-API-DMAC7.html) |
| JP (1) | JPS5672321A (cg-RX-API-DMAC7.html) |
Families Citing this family (32)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58118924A (ja) * | 1982-01-09 | 1983-07-15 | Kensetsusho Kenchiku Kenkyu Shocho | 熱流放射計パネル |
| US4593456A (en) * | 1983-04-25 | 1986-06-10 | Rockwell International Corporation | Pyroelectric thermal detector array |
| JPH0640031B2 (ja) * | 1985-10-23 | 1994-05-25 | 英弘精機産業株式会社 | 熱流計センサ−及びその製法 |
| US5055140A (en) * | 1987-10-05 | 1991-10-08 | Murata Mfg. Co., Ltd. | Thermoelectric element using semiconductive ceramic material |
| US4779994A (en) * | 1987-10-15 | 1988-10-25 | Virginia Polytechnic Institute And State University | Heat flux gage |
| GB8810333D0 (en) * | 1988-04-29 | 1988-06-02 | Apthorp M L | Thermal flow sensor |
| US5180440A (en) * | 1988-11-23 | 1993-01-19 | Pace Incorporated | Printed circuit thermocouple arrangements for personnel training and equipment evaluation purposes |
| CA2003202A1 (en) * | 1988-11-23 | 1990-05-23 | William J. Siegel | Printed circuit thermocouple arrangements for personnel training and equipment evaluation purposes, and methods of making and using same |
| US5059543A (en) * | 1990-09-21 | 1991-10-22 | The Board Of Regents Acting For And On Behalf Of The University Of Michigan | Method of manufacturing thermopile infrared detector |
| US5286304A (en) * | 1991-10-24 | 1994-02-15 | Enerdyne Corporation | Thermoelectric device and method of manufacturing |
| FR2703833B1 (fr) * | 1993-04-06 | 1995-06-02 | Imra Europe Sa | Dispositif à effet PELTIER, notamment pour la détection d'un risque de condensation sur une surface se trouvant au contact d'un volume d'air humide. |
| US5434744A (en) * | 1993-10-22 | 1995-07-18 | Fritz; Robert E. | Thermoelectric module having reduced spacing between semiconductor elements |
| US5449910A (en) * | 1993-11-17 | 1995-09-12 | Honeywell Inc. | Infrared radiation imaging array with compound sensors forming each pixel |
| US6180867B1 (en) | 1996-04-17 | 2001-01-30 | General Electric Company | Thermal sensor array and methods of fabrication and use |
| US5909004A (en) * | 1996-04-17 | 1999-06-01 | General Electric Company | Thermocouple array and method of fabrication |
| JPH10190071A (ja) * | 1996-12-20 | 1998-07-21 | Aisin Seiki Co Ltd | 多段電子冷却装置 |
| USRE41801E1 (en) | 1997-03-31 | 2010-10-05 | Nextreme Thermal Solutions, Inc. | Thin-film thermoelectric device and fabrication method of same |
| US5982014A (en) * | 1997-05-30 | 1999-11-09 | Thermalytics, Inc. | Microfabricated silicon thermopile sensor |
| NL1012709C2 (nl) * | 1999-07-26 | 2001-02-01 | Berkin Bv | Werkwijze voor het vervaardigen van een thermozuil op een elektrisch isolerende drager. |
| US6717044B2 (en) | 2001-04-18 | 2004-04-06 | Kraus, Ii George William | Thermopile construction with multiple EMF outputs |
| US7726876B2 (en) | 2007-03-14 | 2010-06-01 | Entegris, Inc. | System and method for non-intrusive thermal monitor |
| US8487177B2 (en) * | 2010-02-27 | 2013-07-16 | The Boeing Company | Integrated thermoelectric honeycomb core and method |
| JP5638871B2 (ja) * | 2010-08-18 | 2014-12-10 | 江藤電気株式会社 | 熱流センサ |
| JP5769009B2 (ja) * | 2011-06-09 | 2015-08-26 | 江藤電気株式会社 | 熱流センサ及び熱流センサの製造方法 |
| JP5845499B2 (ja) * | 2011-06-09 | 2016-01-20 | 江藤電気株式会社 | 熱流センサの製造方法 |
| DE102011054739A1 (de) * | 2011-10-24 | 2013-04-25 | O-Flexx Technologies Gmbh | Thermoelement und Herstellungsverfahren |
| US9929332B2 (en) * | 2014-04-25 | 2018-03-27 | North Carolina State University | Flexible thermoelectric devices, methods of preparation thereof, and methods of recovering waste heat therewith |
| DE102015113087A1 (de) * | 2015-08-07 | 2017-02-09 | Neuschäfer Elektronik GmbH | Füllstandsensor und Verfahren zur Herstellung eines solchen |
| US12181351B2 (en) | 2018-02-28 | 2024-12-31 | Arthur Beckman | Thermopile assembly providing a massive electrical series of wire thermocouple elements |
| JP6988693B2 (ja) * | 2018-05-28 | 2022-01-05 | 株式会社Soken | 熱流束センサおよび熱量計測装置 |
| CN112284572A (zh) * | 2020-10-14 | 2021-01-29 | 杭州仰仪科技有限公司 | 一种面向塔式结构差示扫描量热仪的热电堆式热流传感器 |
| CN113503981B (zh) * | 2021-06-22 | 2023-04-25 | 中国科学院上海硅酸盐研究所 | 一种连环垂向锯齿型热电堆热流传感器及其制造方法 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3509624A (en) * | 1967-09-11 | 1970-05-05 | Sanders Associates Inc | Method of making multilayer printed circuits |
| US3626624A (en) * | 1969-03-10 | 1971-12-14 | Franklin C Green | Electro-mechanical free pistol |
| IL45788A (en) * | 1974-10-04 | 1977-11-30 | Yeda Res & Dev | Thermoelectric detector |
| US4050302A (en) * | 1975-02-10 | 1977-09-27 | Aluminum Company Of America | Thermoelectric heat flow transducer |
| US4111717A (en) * | 1977-06-29 | 1978-09-05 | Leeds & Northrup Company | Small-size high-performance radiation thermopile |
| US4276441A (en) * | 1980-02-15 | 1981-06-30 | Wilson International Incorporated | Thermoelectric generator and method of forming same |
-
1979
- 1979-11-20 JP JP14946479A patent/JPS5672321A/ja active Granted
-
1980
- 1980-11-12 US US06/206,257 patent/US4343960A/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| US4343960A (en) | 1982-08-10 |
| JPS5672321A (en) | 1981-06-16 |
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