GB8810333D0 - Thermal flow sensor - Google Patents

Thermal flow sensor

Info

Publication number
GB8810333D0
GB8810333D0 GB888810333A GB8810333A GB8810333D0 GB 8810333 D0 GB8810333 D0 GB 8810333D0 GB 888810333 A GB888810333 A GB 888810333A GB 8810333 A GB8810333 A GB 8810333A GB 8810333 D0 GB8810333 D0 GB 8810333D0
Authority
GB
United Kingdom
Prior art keywords
flow sensor
thermal flow
thermal
sensor
flow
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
GB888810333A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Apthorp M L
Original Assignee
Apthorp M L
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Apthorp M L filed Critical Apthorp M L
Priority to GB888810333A priority Critical patent/GB8810333D0/en
Publication of GB8810333D0 publication Critical patent/GB8810333D0/en
Priority to GB8910014A priority patent/GB2218261B/en
Pending legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01KMEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K17/00Measuring quantity of heat
    • G01K17/06Measuring quantity of heat conveyed by flowing media, e.g. in heating systems e.g. the quantity of heat in a transporting medium, delivered to or consumed in an expenditure device
    • G01K17/08Measuring quantity of heat conveyed by flowing media, e.g. in heating systems e.g. the quantity of heat in a transporting medium, delivered to or consumed in an expenditure device based upon measurement of temperature difference or of a temperature
    • G01K17/20Measuring quantity of heat conveyed by flowing media, e.g. in heating systems e.g. the quantity of heat in a transporting medium, delivered to or consumed in an expenditure device based upon measurement of temperature difference or of a temperature across a radiating surface, combined with ascertainment of the heat transmission coefficient
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/17Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80Constructional details
    • H10N10/81Structural details of the junction
    • H10N10/817Structural details of the junction the junction being non-separable, e.g. being cemented, sintered or soldered
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80Constructional details
    • H10N10/85Thermoelectric active materials
    • H10N10/851Thermoelectric active materials comprising inorganic compositions
    • H10N10/854Thermoelectric active materials comprising inorganic compositions comprising only metals

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Combustion & Propulsion (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Inorganic Chemistry (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
GB888810333A 1988-04-29 1988-04-29 Thermal flow sensor Pending GB8810333D0 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
GB888810333A GB8810333D0 (en) 1988-04-29 1988-04-29 Thermal flow sensor
GB8910014A GB2218261B (en) 1988-04-29 1989-05-02 Heat flow sensor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB888810333A GB8810333D0 (en) 1988-04-29 1988-04-29 Thermal flow sensor

Publications (1)

Publication Number Publication Date
GB8810333D0 true GB8810333D0 (en) 1988-06-02

Family

ID=10636201

Family Applications (2)

Application Number Title Priority Date Filing Date
GB888810333A Pending GB8810333D0 (en) 1988-04-29 1988-04-29 Thermal flow sensor
GB8910014A Expired - Lifetime GB2218261B (en) 1988-04-29 1989-05-02 Heat flow sensor

Family Applications After (1)

Application Number Title Priority Date Filing Date
GB8910014A Expired - Lifetime GB2218261B (en) 1988-04-29 1989-05-02 Heat flow sensor

Country Status (1)

Country Link
GB (2) GB8810333D0 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112816103A (en) * 2021-02-05 2021-05-18 中国空气动力研究与发展中心超高速空气动力研究所 Hot wall heat flow sensor and testing method thereof

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH680541A5 (en) * 1990-07-12 1992-09-15 Landis & Gyr Betriebs Ag
JPH09186368A (en) * 1995-10-31 1997-07-15 Technova:Kk Thick film thermoelectric element
NL1012709C2 (en) * 1999-07-26 2001-02-01 Berkin Bv Method for manufacturing a thermopile on an electrically insulating support.
DE10112383B4 (en) * 2001-03-15 2004-01-29 Forschungszentrum Karlsruhe Gmbh Thermocouple and thermogenerator built from it
FR2970778B1 (en) * 2011-01-21 2015-08-07 Commissariat Energie Atomique DEVICE FOR MEASURING OR DETERMINING A CHARACTERISTIC OF A THERMAL FLOW EXCHANGE BETWEEN A FIRST MEDIUM AND A SECOND MEDIUM
CH710704A1 (en) 2015-02-09 2016-08-15 Greenteg Ag Thermoelectric sensor and manufacturing process.
DE102022205124A1 (en) * 2022-05-23 2023-11-23 Contitech Ag Thermocouple

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE329870B (en) * 1967-10-31 1970-10-26 Asea Ab
JPS5672321A (en) * 1979-11-20 1981-06-16 Kensetsusho Kenchiku Kenkyu Shocho Radiation thermocouple and its manufacture

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112816103A (en) * 2021-02-05 2021-05-18 中国空气动力研究与发展中心超高速空气动力研究所 Hot wall heat flow sensor and testing method thereof
CN112816103B (en) * 2021-02-05 2024-04-26 中国空气动力研究与发展中心超高速空气动力研究所 Hot wall heat flow sensor and testing method thereof

Also Published As

Publication number Publication date
GB2218261B (en) 1991-09-18
GB8910014D0 (en) 1989-06-21
GB2218261A (en) 1989-11-08

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