GB2218261A - Thermoelectric device - Google Patents
Thermoelectric device Download PDFInfo
- Publication number
- GB2218261A GB2218261A GB8910014A GB8910014A GB2218261A GB 2218261 A GB2218261 A GB 2218261A GB 8910014 A GB8910014 A GB 8910014A GB 8910014 A GB8910014 A GB 8910014A GB 2218261 A GB2218261 A GB 2218261A
- Authority
- GB
- United Kingdom
- Prior art keywords
- substrate
- sensor according
- metals
- sensor
- alternate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims abstract description 56
- 229910052751 metal Inorganic materials 0.000 claims abstract description 19
- 239000002184 metal Substances 0.000 claims abstract description 19
- 150000002739 metals Chemical class 0.000 claims abstract description 18
- 230000005676 thermoelectric effect Effects 0.000 claims abstract description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 22
- 238000000034 method Methods 0.000 claims description 15
- 229910052709 silver Inorganic materials 0.000 claims description 13
- 239000004332 silver Substances 0.000 claims description 13
- 229910052759 nickel Inorganic materials 0.000 claims description 11
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 238000007650 screen-printing Methods 0.000 claims description 4
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 2
- 239000004593 Epoxy Substances 0.000 claims description 2
- 239000004411 aluminium Substances 0.000 claims description 2
- 229910052782 aluminium Inorganic materials 0.000 claims description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
- 239000000919 ceramic Substances 0.000 claims description 2
- 239000011651 chromium Substances 0.000 claims description 2
- 229910052804 chromium Inorganic materials 0.000 claims description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 12
- 229920000642 polymer Polymers 0.000 description 7
- 239000000463 material Substances 0.000 description 4
- 238000012544 monitoring process Methods 0.000 description 4
- 230000035945 sensitivity Effects 0.000 description 4
- 239000011195 cermet Substances 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000001419 dependent effect Effects 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 206010028980 Neoplasm Diseases 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000001311 chemical methods and process Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005670 electromagnetic radiation Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910052573 porcelain Inorganic materials 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011343 solid material Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K17/00—Measuring quantity of heat
- G01K17/06—Measuring quantity of heat conveyed by flowing media, e.g. in heating systems e.g. the quantity of heat in a transporting medium, delivered to or consumed in an expenditure device
- G01K17/08—Measuring quantity of heat conveyed by flowing media, e.g. in heating systems e.g. the quantity of heat in a transporting medium, delivered to or consumed in an expenditure device based upon measurement of temperature difference or of a temperature
- G01K17/20—Measuring quantity of heat conveyed by flowing media, e.g. in heating systems e.g. the quantity of heat in a transporting medium, delivered to or consumed in an expenditure device based upon measurement of temperature difference or of a temperature across a radiating surface, combined with ascertainment of the heat transmission coefficient
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
- H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/80—Constructional details
- H10N10/81—Structural details of the junction
- H10N10/817—Structural details of the junction the junction being non-separable, e.g. being cemented, sintered or soldered
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/80—Constructional details
- H10N10/85—Thermoelectric active materials
- H10N10/851—Thermoelectric active materials comprising inorganic compositions
- H10N10/854—Thermoelectric active materials comprising inorganic compositions comprising only metals
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Combustion & Propulsion (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Inorganic Chemistry (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
Abstract
A heat flow sensor 11 comprises a non-conductive substrate 12 with a plurality of generally regularly spaced feed through holes 13 therein providing feed-through tracks for two different metals 14, 16 the arrangement being such that alternate functions 23, 27 of the metals 14, 16 are provided on both sides of the substrate 12, allowing the temperature difference across the substrate 12 to be measured using the thermo-electric effect. <IMAGE>
Description
HEAT FLOW SENSOR
This invention relates to heat flow sensors.
Conventional heat flow sensors comprise a substrate onto which a themopile arrangement is provided to measure the temperature difference across the thermopile. Knowing the thickness and thermal conductivity of the substrate, together with the measured temperature difference across the substrate, the heat flow through the substrate can be measured directly. The substrate of the heat flow sensor is preferably made thin, so that the substrate itself has a low thermal impedance to reduce any disturbance to the heat flow being measured, and so that the temperature difference across the substrate changes rapidly in response to a change in heat flow.
The disadvantage of using thin substrates is that the temperature difference across the substrate is very small, so that many junctions are required for the thermopile arrangement to increase the sensitivity of the sensor to give a larger voltage output from the thermopile. The cost of manufacture of the heat flow sensor is dependent upon the number of junctions required, increasing with the sensitivity of the sensor.
It is an object of the present invention to provide a heat flow sensor which is relatively easy to manufacture.
According to the present invention there is provided a heat flow sensor comprising a non-conductive substrate with a plurality of generally regularly spaced feed through holes therein, providing feed-through tracks for two different metals, the arrangement being such that alternate junctions of the metals are provided on both sides of the substrate, allowing the temperature difference across the substrate to be measured using the thermo-electric effect.
The substrate is preferably between 5mm and 0.5mm in thickness.
The substrate is preferably made from a printed circuit board, pcb, epoxy (trade mark) laminate. The substrate may also be made from any suitable non conducting material such as ceramic, alumina or an enamelled substance. The area of the substrate is preferably between 3cm squared and locum squared.
The substrate may further comprise either rigid or flexible pcb materials or other insulators using plated through hole pcb manufacturing techniques. Variations include: polymer thick film on pcb laminate,~ polymer thick film on other materials; cermet thick film on alumina; cermat thick film on porcelain enamelled steel; cermet thick film on glass; cermet thick film on other materials; plated through hole pcb techniques on rigid boards; plated through hole pcb techniques on flexible substrates; and plated through hole pcb techniques on other materials.
Most of these techniques, including the polymer thick film, enable multiple sensors to be manufactured on one blank substrate, with typically fifty sensors per blank.
The two different metals are preferably laid down using silk screen printing, to a thickness of between 20 and 40 microns.
Alternatively electroplating may be used, with an initial seed layer for the metal being formed by evaporation, sputtering or electroless deposition. The two different metals are preferably nickel and silver. Alternatively chromium and aluminium can be used, or any other suitable combination of metals giving a large thermo-electric effect.
The junctions are preferably arranged so that alternate junctions are sequentially formed on alternate surfaces of the substrate, enabling alternate junctions to be at different temperatures, so that the total series voltage output from the junctions is directly proportional to the temperature difference. The junctions are preferably arranged in a pattern on the substrate that reduces electromagnetic interference effects.
The output from the junctions is preferably fed to an integrated amplifier laid down on the substrate by connections also laid down on the substrate.
According to a second aspect of the present invention there is provided a method of fabricating a heat flow sensor, comprising forming generally regularly spaced apart holes in a non-conductive substrate, applying two different metals to both surfaces of the substrate by a silk screen process or any other suitable process, such that alternate holes provide conductive feed through holes for one or other of the metals, and such that junctions are formed between the metals on alternate sides of the substrate.
An embodiment of the present invention will now be described by way of example with reference to the accompanying drawings in which:
Figure 1 is a cross-sectional view through a substrate;
Figure 2 is cross-sectional view through a heat flow sensor, according to the invention;
Figures 3 to 7 are a series of cross-sectional views of a substrate in a process of construction;
Figure 8 is a representation of the electrical path through a sensor;
Figure 9 is a plan view of the heat flow sensor of Figure 2; and
Figure 10 is a side view of the heat flow sensor of Figure 2.
Figure 1 illustrates the principle of heat flow sensors in which heat represented by the arrows flows through a solid material 10 of thickness, L, causing a temperature difference across the solid of, T1-T2. Knowing the thermal conductivity, G, of the solid 10, and measuring the temperature difference gives the heat flow in watts per square metre as:
Heat Flow=(Tl-T2).#/L N
Figure 2 shows a heat flow sensor 11 in cross-section. The sensor 11 comprises a substrate 12 made from a pcb laminate, with holes 13 formed therein. Each alternate hole 13 is coated on its inside with either silver 14 shown in shaded cross-hatching or nickel 16. On the surfaces 17,18 of the substrate 12 the silver 14 and nickel 16 touch one another to form an electrical contact on alternate surfaces of the substrate 12.
Figures 3 to 7 show a process for fabricating the heat flow sensor of Fgure 2. In Figure 3 regularly spaced apart holes are drilled in the substrate 12. In Figure 4, the substrate is held under vacuum onto a silk screen printing base (not shown). A silk screen printing mask (not shown) is then placed over the surface 17 and a silver based polymer ink 19 is scrapped over the mask to form the pattern of ink 19 shown in Figure 4, with a short track 20 extending from each alternate hole 13a on the surface 17. The suction on the substrate 12 from the vacuum causes the polymer ink 19 to be drawn down through alternate holes 13a to allow the formation of a conductive feed through path from surface 17 to surface 18. The substrate is then placed in an oven (not shown) for curing the ink 19 at an elevated temperature of about 150 degrees celsius, to form part of the silver coating 14.In Figure 5, the process of Figure 4 is repeated on surface 17 using a second mask with a nickel based polymer ink 21. The second mask (not shown) used causes the rest of the holes 13b to be coated inside with ink 21 with a short track 22 extending from each hole hole 13b toward each short silver track 20, to form a junction 23. The nickel based polymer ink 21 is then cured as before so that each junction 23 between the silver 14 and nickel 16 forms an electrical contact 23.
In Figure 6, the process of Figure 4 is repeated using a third mask to form silver tracks 24 on surface 18, in which each track 24 extends from each feed through hole 13a in the opposite direction to the tracks 20. In Figure 7, a fourth mask is used to form nickel tracks 26 on the surface 18 and to form electrical contacts 27 with the silver tracks 24.
Figure 8 illustrates the electrical path through the holes 13 and along the surfaces 17,18, with alternate contacts 23,27 between the silver 14 and nickel 16, to form a thermopile arrangement.
Figures 9 and 10 show the heat flow sensor 11, which is about 25mmx50mm in area. The active heat flow measuring part of the sensor 11 is shown on the left-hand side which is about 25mmx25mm in area. Four hundred holes 13 are drilled in the pcb substrate 12 which is about 1.lem thick, and the silver 14 and nickel 16 coatings are laid down in a pattern which reduces electromagnetic interference as show in Figure 9. The dotted lines between the holes 13 represent the silver 14 and nickel 16 tracks underneath the substrate on surface 18. The second mask used in the process of Figure 5 is also used to provide tracks for circuitry 28 used on the right-hand side of the substrate to amplify the voltage output 29 from the thermopile arrangement, which is about luV for a heat flow of lW/m2. The circuitry 28 includes a chopper stabilised amplifier 31 with temperature compensation (using a temperature dependent resistor) having a gain of between 100 and 1000, and other associated surface mounted components 32. The gain of the amplifier 31 may be adjusted to standardise the output sensitivity of each sensor 11. The circuitry 28 is surrounded on the substrate with a ground plane to reduce electromagnetic interference and the circuitry 28 is encapsulated in a non-conducting resin, which is also coated over the sensing part of the substrate 12, to protect it in use.
In use the described sensor 11 is able to detect temperature differences as small as 0.0025 degree celsius corresponding to a heat flow of 1 watt per square metre. This sensitivity enables the measurement of most heat flows found in the normal environment. The signal from the circuitry 28 is fed by the cable 33, which also supplies power to the circuitry 28, to a display on a digital volt meter oroto a data logger or computer.
The sensor 12 responds to changes in temperature within a second.
The sensor 12 is not only cheap and relatively easy to manufacture but it is robust as well. This gives it many areas of application including: measuring heat loss in buildings; teaching energy conservation courses; monitoring thermal insulation in say deep freezers; monitoring chemical processes, including exothermal reactions in storage silos; monitoring heat exchanger efficiency; medical applications, such as detecting tumours and monitoring them; and fire detection.
Finally, the sensor can be buried in an object to measure thermal conductivity directly. It can be attached to a surface to measure the heat flow at the surface but care is required to match the emissivity of sensor and surface. It can also measure electromagnetic radiation which falls upon its surface and is absorbed.
Claims (12)
1. A heat flow sensor comprising a non-conductive substrate with a plurality of generally regularly spaced feed through holes therein, providing feed-through tracks for two different metals, the arrangement being such that alternate junctions of the metals are provided on both sides of the substrate, allowing the temperature difference across the substrate to be measured using the thermo-electric effect.
2. A sensor according to claim 1, in which the substrate is between 5mm and 0.5mm in thickness.
3. A sensor according to claim 1 or 2, in which the substrate is made from a printed circuit board epoxy (trade mark) laminate.
4. A sensor according to claim 1 or 2, in which the substrate is made from ceramic.
5. A sensor according to any previous claim, in which the area of the substrate is between 3cm squared and locum squared.
6. A sensor according to any previous claim, in which the two different metals are laid down using silk screen printing, to a thickness of between 20 and 40 microns.
7. A sensor according to any previous claim, in which the two different metals are nickel and silver.
8. A sensor according to any of claims 1 to 6, in which the two metals are chromium and aluminium.
9. A sensor according to any previous claim, in which the junctions are arranged so that alternate junctions are sequentially formed on alternate surfaces of the substrate.
10. A sensor according to any previous claim, in which the output from the junctions is fed to an integrated amplifier laid down on the substrate by connections also laid down on the substrate.
11. A method of fabricating a heat flow sensor, comprising forming generally regularly spaced apart holes in a non-conductive substrate, applying two different metals to both surfaces of the substrate by a silk screen process or any other suitable process, such that alternate holes provide conductive feed through holes for one or other of the metals, and such that junctions are formed between the metals on alternate sides of the substrate.
12. A sensor and/or a method' of fabricating a sensor substantially as hereinbefore described with reference to any one or more of Figures 2 to 10 of the accompanying drawings.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB888810333A GB8810333D0 (en) | 1988-04-29 | 1988-04-29 | Thermal flow sensor |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| GB8910014D0 GB8910014D0 (en) | 1989-06-21 |
| GB2218261A true GB2218261A (en) | 1989-11-08 |
| GB2218261B GB2218261B (en) | 1991-09-18 |
Family
ID=10636201
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB888810333A Pending GB8810333D0 (en) | 1988-04-29 | 1988-04-29 | Thermal flow sensor |
| GB8910014A Expired - Lifetime GB2218261B (en) | 1988-04-29 | 1989-05-02 | Heat flow sensor |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB888810333A Pending GB8810333D0 (en) | 1988-04-29 | 1988-04-29 | Thermal flow sensor |
Country Status (1)
| Country | Link |
|---|---|
| GB (2) | GB8810333D0 (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2664745A1 (en) * | 1990-07-12 | 1992-01-17 | Landis & Gyr Betriebs Ag | Thermoelectric converter and method for manufacturing it |
| EP0801428A1 (en) * | 1995-10-31 | 1997-10-15 | Technova Inc. | Thick-film thermoelectric element |
| EP1073126A2 (en) * | 1999-07-26 | 2001-01-31 | Berkin B.V. | Method for manufacturing a thermopile on an electrically insulating substrate |
| EP1249878A2 (en) * | 2001-03-15 | 2002-10-16 | Forschungszentrum Karlsruhe GmbH | Thermoelectric element and thermoelectric generator |
| WO2012098228A1 (en) * | 2011-01-21 | 2012-07-26 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Device for measuring or determining a characteristic of a heat flow exchanged between a first medium and a second medium |
| WO2016128247A1 (en) | 2015-02-09 | 2016-08-18 | Greenteg Ag | Thermoelectric sensor and production method |
| EP4283270A1 (en) * | 2022-05-23 | 2023-11-29 | ContiTech AG | Thermocouple |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112816103B (en) * | 2021-02-05 | 2024-04-26 | 中国空气动力研究与发展中心超高速空气动力研究所 | Hot wall heat flow sensor and testing method thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3726100A (en) * | 1967-10-31 | 1973-04-10 | Asea Ab | Thermoelectric apparatus composed of p-type and n-type semiconductor elements |
| US4343960A (en) * | 1979-11-20 | 1982-08-10 | Building Research Institute, Ministry Of Construction | Thermopile and process for manufacturing same |
-
1988
- 1988-04-29 GB GB888810333A patent/GB8810333D0/en active Pending
-
1989
- 1989-05-02 GB GB8910014A patent/GB2218261B/en not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3726100A (en) * | 1967-10-31 | 1973-04-10 | Asea Ab | Thermoelectric apparatus composed of p-type and n-type semiconductor elements |
| US4343960A (en) * | 1979-11-20 | 1982-08-10 | Building Research Institute, Ministry Of Construction | Thermopile and process for manufacturing same |
Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2664745A1 (en) * | 1990-07-12 | 1992-01-17 | Landis & Gyr Betriebs Ag | Thermoelectric converter and method for manufacturing it |
| DE4110653A1 (en) * | 1990-07-12 | 1992-01-23 | Landis & Gyr Betriebs Ag | Thermoelectric transducer with several thermoelement pairs - has first junction points with rows of first and second conductive material w.r.t. reference direction |
| EP0801428A1 (en) * | 1995-10-31 | 1997-10-15 | Technova Inc. | Thick-film thermoelectric element |
| EP0801428A4 (en) * | 1995-10-31 | 1999-02-10 | Technova Inc | Thick-film thermoelectric element |
| US6511860B1 (en) | 1999-07-26 | 2003-01-28 | Berkin, B.V. | Method for manufacturing a thermopile on an electrically insulating substrate |
| NL1012709C2 (en) * | 1999-07-26 | 2001-02-01 | Berkin Bv | Method for manufacturing a thermopile on an electrically insulating support. |
| EP1073126A3 (en) * | 1999-07-26 | 2002-03-13 | Berkin B.V. | Method for manufacturing a thermopile on an electrically insulating substrate |
| EP1073126A2 (en) * | 1999-07-26 | 2001-01-31 | Berkin B.V. | Method for manufacturing a thermopile on an electrically insulating substrate |
| US6713833B2 (en) | 1999-07-26 | 2004-03-30 | Berkin B.V. | Thermopile on an electrical insulating substrate |
| EP1249878A2 (en) * | 2001-03-15 | 2002-10-16 | Forschungszentrum Karlsruhe GmbH | Thermoelectric element and thermoelectric generator |
| EP1249878A3 (en) * | 2001-03-15 | 2006-05-24 | Forschungszentrum Karlsruhe GmbH | Thermoelectric element and thermoelectric generator |
| WO2012098228A1 (en) * | 2011-01-21 | 2012-07-26 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Device for measuring or determining a characteristic of a heat flow exchanged between a first medium and a second medium |
| FR2970778A1 (en) * | 2011-01-21 | 2012-07-27 | Commissariat Energie Atomique | DEVICE FOR MEASURING OR DETERMINING A CHARACTERISTIC OF A THERMAL FLOW EXCHANGE BETWEEN A FIRST MEDIUM AND A SECOND MEDIUM |
| US9599522B2 (en) | 2011-01-21 | 2017-03-21 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Device for measuring or evaluating a characteristic of a heat flux exchanged between a first medium and a second medium |
| WO2016128247A1 (en) | 2015-02-09 | 2016-08-18 | Greenteg Ag | Thermoelectric sensor and production method |
| EP4283270A1 (en) * | 2022-05-23 | 2023-11-29 | ContiTech AG | Thermocouple |
Also Published As
| Publication number | Publication date |
|---|---|
| GB8910014D0 (en) | 1989-06-21 |
| GB2218261B (en) | 1991-09-18 |
| GB8810333D0 (en) | 1988-06-02 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 20020502 |