JPS5672321A - Radiation thermocouple and its manufacture - Google Patents
Radiation thermocouple and its manufactureInfo
- Publication number
- JPS5672321A JPS5672321A JP14946479A JP14946479A JPS5672321A JP S5672321 A JPS5672321 A JP S5672321A JP 14946479 A JP14946479 A JP 14946479A JP 14946479 A JP14946479 A JP 14946479A JP S5672321 A JPS5672321 A JP S5672321A
- Authority
- JP
- Japan
- Prior art keywords
- plated
- substrate
- thermocouple
- manufacture
- constitution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/80—Constructional details
- H10N10/81—Structural details of the junction
- H10N10/817—Structural details of the junction the junction being non-separable, e.g. being cemented, sintered or soldered
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/01—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/80—Constructional details
- H10N10/85—Thermoelectric active materials
- H10N10/851—Thermoelectric active materials comprising inorganic compositions
- H10N10/854—Thermoelectric active materials comprising inorganic compositions comprising only metals
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Photometry And Measurement Of Optical Pulse Characteristics (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14946479A JPS5672321A (en) | 1979-11-20 | 1979-11-20 | Radiation thermocouple and its manufacture |
| US06/206,257 US4343960A (en) | 1979-11-20 | 1980-11-12 | Thermopile and process for manufacturing same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14946479A JPS5672321A (en) | 1979-11-20 | 1979-11-20 | Radiation thermocouple and its manufacture |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5672321A true JPS5672321A (en) | 1981-06-16 |
| JPS6138810B2 JPS6138810B2 (cg-RX-API-DMAC7.html) | 1986-09-01 |
Family
ID=15475695
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14946479A Granted JPS5672321A (en) | 1979-11-20 | 1979-11-20 | Radiation thermocouple and its manufacture |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US4343960A (cg-RX-API-DMAC7.html) |
| JP (1) | JPS5672321A (cg-RX-API-DMAC7.html) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58118924A (ja) * | 1982-01-09 | 1983-07-15 | Kensetsusho Kenchiku Kenkyu Shocho | 熱流放射計パネル |
| JPS6296831A (ja) * | 1985-10-23 | 1987-05-06 | Eikou Seiki Sangyo Kk | 熱流計センサ−及びその製法 |
| JPH10190071A (ja) * | 1996-12-20 | 1998-07-21 | Aisin Seiki Co Ltd | 多段電子冷却装置 |
| JP2012042304A (ja) * | 2010-08-18 | 2012-03-01 | Etou Denki Kk | 熱流センサ |
| JP2012255717A (ja) * | 2011-06-09 | 2012-12-27 | Etou Denki Kk | 熱流センサ及び熱流センサの製造方法 |
| JP2012255718A (ja) * | 2011-06-09 | 2012-12-27 | Etou Denki Kk | 熱流センサの製造方法 |
| JP2019207112A (ja) * | 2018-05-28 | 2019-12-05 | 株式会社Soken | 熱流束センサおよび熱量計測装置 |
Families Citing this family (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4593456A (en) * | 1983-04-25 | 1986-06-10 | Rockwell International Corporation | Pyroelectric thermal detector array |
| US5055140A (en) * | 1987-10-05 | 1991-10-08 | Murata Mfg. Co., Ltd. | Thermoelectric element using semiconductive ceramic material |
| US4779994A (en) * | 1987-10-15 | 1988-10-25 | Virginia Polytechnic Institute And State University | Heat flux gage |
| GB8810333D0 (en) * | 1988-04-29 | 1988-06-02 | Apthorp M L | Thermal flow sensor |
| US5180440A (en) * | 1988-11-23 | 1993-01-19 | Pace Incorporated | Printed circuit thermocouple arrangements for personnel training and equipment evaluation purposes |
| CA2003202A1 (en) * | 1988-11-23 | 1990-05-23 | William J. Siegel | Printed circuit thermocouple arrangements for personnel training and equipment evaluation purposes, and methods of making and using same |
| US5059543A (en) * | 1990-09-21 | 1991-10-22 | The Board Of Regents Acting For And On Behalf Of The University Of Michigan | Method of manufacturing thermopile infrared detector |
| US5286304A (en) * | 1991-10-24 | 1994-02-15 | Enerdyne Corporation | Thermoelectric device and method of manufacturing |
| FR2703833B1 (fr) * | 1993-04-06 | 1995-06-02 | Imra Europe Sa | Dispositif à effet PELTIER, notamment pour la détection d'un risque de condensation sur une surface se trouvant au contact d'un volume d'air humide. |
| US5434744A (en) * | 1993-10-22 | 1995-07-18 | Fritz; Robert E. | Thermoelectric module having reduced spacing between semiconductor elements |
| US5449910A (en) * | 1993-11-17 | 1995-09-12 | Honeywell Inc. | Infrared radiation imaging array with compound sensors forming each pixel |
| US6180867B1 (en) | 1996-04-17 | 2001-01-30 | General Electric Company | Thermal sensor array and methods of fabrication and use |
| US5909004A (en) * | 1996-04-17 | 1999-06-01 | General Electric Company | Thermocouple array and method of fabrication |
| USRE41801E1 (en) | 1997-03-31 | 2010-10-05 | Nextreme Thermal Solutions, Inc. | Thin-film thermoelectric device and fabrication method of same |
| US5982014A (en) * | 1997-05-30 | 1999-11-09 | Thermalytics, Inc. | Microfabricated silicon thermopile sensor |
| NL1012709C2 (nl) * | 1999-07-26 | 2001-02-01 | Berkin Bv | Werkwijze voor het vervaardigen van een thermozuil op een elektrisch isolerende drager. |
| US6717044B2 (en) | 2001-04-18 | 2004-04-06 | Kraus, Ii George William | Thermopile construction with multiple EMF outputs |
| US7726876B2 (en) | 2007-03-14 | 2010-06-01 | Entegris, Inc. | System and method for non-intrusive thermal monitor |
| US8487177B2 (en) * | 2010-02-27 | 2013-07-16 | The Boeing Company | Integrated thermoelectric honeycomb core and method |
| DE102011054739A1 (de) * | 2011-10-24 | 2013-04-25 | O-Flexx Technologies Gmbh | Thermoelement und Herstellungsverfahren |
| US9929332B2 (en) * | 2014-04-25 | 2018-03-27 | North Carolina State University | Flexible thermoelectric devices, methods of preparation thereof, and methods of recovering waste heat therewith |
| DE102015113087A1 (de) * | 2015-08-07 | 2017-02-09 | Neuschäfer Elektronik GmbH | Füllstandsensor und Verfahren zur Herstellung eines solchen |
| US12181351B2 (en) | 2018-02-28 | 2024-12-31 | Arthur Beckman | Thermopile assembly providing a massive electrical series of wire thermocouple elements |
| CN112284572A (zh) * | 2020-10-14 | 2021-01-29 | 杭州仰仪科技有限公司 | 一种面向塔式结构差示扫描量热仪的热电堆式热流传感器 |
| CN113503981B (zh) * | 2021-06-22 | 2023-04-25 | 中国科学院上海硅酸盐研究所 | 一种连环垂向锯齿型热电堆热流传感器及其制造方法 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3509624A (en) * | 1967-09-11 | 1970-05-05 | Sanders Associates Inc | Method of making multilayer printed circuits |
| US3626624A (en) * | 1969-03-10 | 1971-12-14 | Franklin C Green | Electro-mechanical free pistol |
| IL45788A (en) * | 1974-10-04 | 1977-11-30 | Yeda Res & Dev | Thermoelectric detector |
| US4050302A (en) * | 1975-02-10 | 1977-09-27 | Aluminum Company Of America | Thermoelectric heat flow transducer |
| US4111717A (en) * | 1977-06-29 | 1978-09-05 | Leeds & Northrup Company | Small-size high-performance radiation thermopile |
| US4276441A (en) * | 1980-02-15 | 1981-06-30 | Wilson International Incorporated | Thermoelectric generator and method of forming same |
-
1979
- 1979-11-20 JP JP14946479A patent/JPS5672321A/ja active Granted
-
1980
- 1980-11-12 US US06/206,257 patent/US4343960A/en not_active Expired - Lifetime
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58118924A (ja) * | 1982-01-09 | 1983-07-15 | Kensetsusho Kenchiku Kenkyu Shocho | 熱流放射計パネル |
| JPS6296831A (ja) * | 1985-10-23 | 1987-05-06 | Eikou Seiki Sangyo Kk | 熱流計センサ−及びその製法 |
| JPH10190071A (ja) * | 1996-12-20 | 1998-07-21 | Aisin Seiki Co Ltd | 多段電子冷却装置 |
| JP2012042304A (ja) * | 2010-08-18 | 2012-03-01 | Etou Denki Kk | 熱流センサ |
| JP2012255717A (ja) * | 2011-06-09 | 2012-12-27 | Etou Denki Kk | 熱流センサ及び熱流センサの製造方法 |
| JP2012255718A (ja) * | 2011-06-09 | 2012-12-27 | Etou Denki Kk | 熱流センサの製造方法 |
| JP2019207112A (ja) * | 2018-05-28 | 2019-12-05 | 株式会社Soken | 熱流束センサおよび熱量計測装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| US4343960A (en) | 1982-08-10 |
| JPS6138810B2 (cg-RX-API-DMAC7.html) | 1986-09-01 |
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