JPS6138588B2 - - Google Patents
Info
- Publication number
- JPS6138588B2 JPS6138588B2 JP54031516A JP3151679A JPS6138588B2 JP S6138588 B2 JPS6138588 B2 JP S6138588B2 JP 54031516 A JP54031516 A JP 54031516A JP 3151679 A JP3151679 A JP 3151679A JP S6138588 B2 JPS6138588 B2 JP S6138588B2
- Authority
- JP
- Japan
- Prior art keywords
- lead
- vapor
- tin
- solder
- deposited
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910000679 solder Inorganic materials 0.000 claims description 37
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 19
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 14
- 230000008020 evaporation Effects 0.000 claims description 10
- 238000001704 evaporation Methods 0.000 claims description 10
- 239000000203 mixture Substances 0.000 claims description 5
- 239000010409 thin film Substances 0.000 claims description 5
- 238000007740 vapor deposition Methods 0.000 claims description 4
- 238000000034 method Methods 0.000 claims 2
- 229910052718 tin Inorganic materials 0.000 description 18
- 229910045601 alloy Inorganic materials 0.000 description 9
- 239000000956 alloy Substances 0.000 description 9
- 238000005476 soldering Methods 0.000 description 7
- 239000000758 substrate Substances 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 229910001128 Sn alloy Inorganic materials 0.000 description 4
- 239000006023 eutectic alloy Substances 0.000 description 4
- 230000004907 flux Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 3
- 239000013078 crystal Substances 0.000 description 2
- 230000005496 eutectics Effects 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 229910052745 lead Inorganic materials 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 229910000859 α-Fe Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000978 Pb alloy Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000010587 phase diagram Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Landscapes
- Details Of Resistors (AREA)
- Non-Adjustable Resistors (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3151679A JPS55124965A (en) | 1979-03-17 | 1979-03-17 | Preliminary solder of lead wire with evaporated thin film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3151679A JPS55124965A (en) | 1979-03-17 | 1979-03-17 | Preliminary solder of lead wire with evaporated thin film |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS55124965A JPS55124965A (en) | 1980-09-26 |
| JPS6138588B2 true JPS6138588B2 (US07922777-20110412-C00004.png) | 1986-08-29 |
Family
ID=12333359
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3151679A Granted JPS55124965A (en) | 1979-03-17 | 1979-03-17 | Preliminary solder of lead wire with evaporated thin film |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS55124965A (US07922777-20110412-C00004.png) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0684084B2 (ja) * | 1985-10-22 | 1994-10-26 | 株式会社日立製作所 | ダイレクトドライブ型サーマルヘッドの製造方法 |
| JPH0260101A (ja) * | 1988-08-26 | 1990-02-28 | Alps Electric Co Ltd | チップ電子部品 |
| US5038996A (en) * | 1988-10-12 | 1991-08-13 | International Business Machines Corporation | Bonding of metallic surfaces |
-
1979
- 1979-03-17 JP JP3151679A patent/JPS55124965A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS55124965A (en) | 1980-09-26 |
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