JPS6135545A - 半導体装置の製造方法 - Google Patents

半導体装置の製造方法

Info

Publication number
JPS6135545A
JPS6135545A JP15559184A JP15559184A JPS6135545A JP S6135545 A JPS6135545 A JP S6135545A JP 15559184 A JP15559184 A JP 15559184A JP 15559184 A JP15559184 A JP 15559184A JP S6135545 A JPS6135545 A JP S6135545A
Authority
JP
Japan
Prior art keywords
ball
wire
semiconductor device
electrode pad
temperature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15559184A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0325019B2 (enExample
Inventor
Osamu Usuda
修 薄田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP15559184A priority Critical patent/JPS6135545A/ja
Priority to KR1019850004374A priority patent/KR900005348B1/ko
Priority to US06/759,273 priority patent/US4732313A/en
Priority to DE8585109406T priority patent/DE3577371D1/de
Priority to EP85109406A priority patent/EP0169574B1/en
Publication of JPS6135545A publication Critical patent/JPS6135545A/ja
Publication of JPH0325019B2 publication Critical patent/JPH0325019B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/06—Wiring by machine
    • H10W72/071—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • B23K20/007—Ball bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H10W70/041—
    • H10W72/07232—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45147—Copper (Cu) as principal constituent
    • H10W72/015—
    • H10W72/01551—
    • H10W72/0711—
    • H10W72/07141—
    • H10W72/073—
    • H10W72/075—
    • H10W72/07511—
    • H10W72/07521—
    • H10W72/07532—
    • H10W72/07541—
    • H10W72/07551—
    • H10W72/50—
    • H10W72/536—
    • H10W72/5363—
    • H10W72/884—
    • H10W90/754—
    • H10W90/756—

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Wire Bonding (AREA)
JP15559184A 1984-07-27 1984-07-27 半導体装置の製造方法 Granted JPS6135545A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP15559184A JPS6135545A (ja) 1984-07-27 1984-07-27 半導体装置の製造方法
KR1019850004374A KR900005348B1 (ko) 1984-07-27 1985-06-20 반도체장치의 제조방법
US06/759,273 US4732313A (en) 1984-07-27 1985-07-26 Apparatus and method for manufacturing semiconductor device
DE8585109406T DE3577371D1 (de) 1984-07-27 1985-07-26 Apparat zum herstellen einer halbleiteranordnung.
EP85109406A EP0169574B1 (en) 1984-07-27 1985-07-26 Apparatus for manufacturing semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15559184A JPS6135545A (ja) 1984-07-27 1984-07-27 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS6135545A true JPS6135545A (ja) 1986-02-20
JPH0325019B2 JPH0325019B2 (enExample) 1991-04-04

Family

ID=15609376

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15559184A Granted JPS6135545A (ja) 1984-07-27 1984-07-27 半導体装置の製造方法

Country Status (2)

Country Link
JP (1) JPS6135545A (enExample)
KR (1) KR900005348B1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09134982A (ja) * 1995-11-08 1997-05-20 Fujitsu Ltd 半導体装置及びその製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09134982A (ja) * 1995-11-08 1997-05-20 Fujitsu Ltd 半導体装置及びその製造方法

Also Published As

Publication number Publication date
KR900005348B1 (ko) 1990-07-27
JPH0325019B2 (enExample) 1991-04-04
KR860001477A (ko) 1986-02-26

Similar Documents

Publication Publication Date Title
US4732313A (en) Apparatus and method for manufacturing semiconductor device
EP0276564B1 (en) Wire bonding
JP3248778B2 (ja) 半田ワイヤーにボール部を形成する方法
JP2011077193A (ja) 半導体装置の製造方法
EP0178170B1 (en) Semiconductor device having a bonding wire and method for manufacturing it
JPS60154537A (ja) 半導体デバイスの製作方法
EP1367644A1 (en) Semiconductor electronic device and method of manufacturing thereof
JPS6135545A (ja) 半導体装置の製造方法
CN101894770B (zh) 半导体封装打线表面的预氧化处理方法及其预氧化层结构
WO2006112393A1 (ja) 半導体装置及び半導体装置の製造方法
JPS60113449A (ja) 難加工性ろう材付リ−ドピンの製造方法
JP2680232B2 (ja) 半田ワイヤによるワイヤーボンディング方法
JP3016956B2 (ja) 半田ワイヤによるワイヤボンディング方法
JPH0468548A (ja) 被覆線のワイヤボンデイング装置
JP2918676B2 (ja) 気密封止用ステムの製造方法
CN85106110A (zh) 用于制造半导体器件的装置
JPS6379331A (ja) ワイヤボンデイング装置
JPS6197937A (ja) 半導体素子の組立方法及びその装置
JPS6225899Y2 (enExample)
JPH0462456B2 (enExample)
JPS59211252A (ja) 半導体装置
JP2003309142A (ja) 半導体装置及びその搭載方法
JPS63138744A (ja) ワイヤボンデイング方法
JPS63217633A (ja) ワイヤボンデイング方法
JPS60177639A (ja) 半導体装置の製造方法

Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term